• Vision AppKit utilizes the Alif Semiconductor Ensemble® MCU family of industry-leading Edge ML MCUs and Telit Cinterion’s power-efficient LTE-M and low-power Wi-Fi and Bluetooth® wireless technology modules
• Ultra-compact camera design can perform on-device AI use cases like face and object detection, image classification, and more at a significantly lower power consumption than previously possible for these use cases

Telit Cinterion, an end-to-end IoT solutions enabler, and Alif Semiconductor, a supplier of the most secure, power-efficient Edge AI-enabled MCUs and fusion processors in the market, today announced the Vision AppKit — the world’s smartest and most efficient connected camera reference design.

The Vision AppKit combines Telit Cinterion’s Wi-Fi and Bluetooth wireless technology or LTE-M communication modules in an ultra-compact camera design together with Alif Semiconductor’s Ensemble E3 series MCU, capable of performing on-device AI use-cases like face and object detection, image classification, and more at significantly lower power consumption than previously possible.

The Vision AppKit is a reference design for ultra-low power, small form factor AI-enabled camera that can capture images and/or video, perform AI-based processing in real-time on captured data, and deliver the results wirelessly to a display or other external system. Alif’s E3 Series MCU — known for its EdgeAI capabilities in battery-operated IoT devices — powers this groundbreaking design. Telit Cinterion supports communication in the Vision AppKit with the ME310 LTE Cat-M and WE310 Wi-Fi and Bluetooth Low Energy 5.0 modules.

The Alif Ensemble E3 series features a distinct High-Efficiency MCU core and a separate High-Performance MCU core, along with microNPUs that can be promptly enabled when a device needs additional AI/ML compute performance, to keep the overall system power footprint as low as possible. Alif Semiconductor’s aiPM technology dynamically powers only the logic that is in use at any given time thus achieving the lowest overall system power consumption. This combination delivers a performance uplift of at least two orders of magnitude compared to traditional 32-bit MCUs at a power consumption that is two orders of magnitude lower, drastically reducing inference times for AI camera vision-based tasks like object detection, face recognition, and image classification.

Reza Kazerounian, Co-Founder and President at Alif Semiconductor, said:

“The Vision AppKit AI camera reference design incorporates highly efficient processing capability to deliver small form factor camera solutions for object detection and image classification in a secure way.”

“This technology enables battery-operated cameras to perform computations previously only possible in the cloud.”

The ME310 empowers enterprises to implement novel, compact designs across a diverse range of applications, such as asset tracking, healthcare monitoring, smart metering, portable devices, industrial sensors, home automation, and more. This module facilitates enhanced power efficiency in IoT applications through Power Saving Mode (PSM) and extended Discontinuous Reception (eDRX), catering to devices requiring optimization in cost, size, and power consumption. Additionally, the WE310 is a fully integrated module combining single-band Wi-Fi (802.11 b/g/n) and Bluetooth Low Energy (BLE5). It offers a cost-effective and high-speed wireless connection to an embedded microcontroller via UART, SPI, and SDIO interfaces.

“Integrating Alif’s cutting-edge edge AI technology with Telit Cinterion’s industry-leading secure modules opens the path to a new category of intelligent, compact, ultra-low power, and cost-efficient IoT devices,” said Manish Watwani, Chief Marketing and Product Officer at Telit Cinterion. “This integrated design reduces adoption barriers and guarantees optimal AI and communication performance.”

The post Telit Cinterion and Alif Semiconductor Unveil the Vision AppKit: A Postage Stamp-Sized, Intelligent Connected Camera Platform appeared first on IoT Business News.

• Telit Cinterion’s new end-to-end, turnkey IoT solution will feature 3GPP Release-17 NB-IoT-over-NTN compliant modules with hybrid cellular and satellite connectivity services
• New partnership will provide transportation, logistics, agriculture, mining and other verticals with seamless, ubiquitous connectivity based on floLIVE’s global cellular infrastructure, which acts as the backbone to worldwide connectivity and is complemented by Skylo’s satellite service — even in remote areas

Telit Cinterion, an end-to-end IoT solutions enabler, today announced a solution featuring cellular and satellite connectivity services on its ME910G1 and ME310G1 modules.

In partnership with floLIVE and Skylo Technologies, the new solution ensures that mobile assets — shipping containers, agricultural equipment, trucks, and other high-value assets — are continually trackable and monitored anywhere on earth, from cities and rural highways to deserts and oceans.

The new Telit Cinterion solution is ideal for enterprises in transportation, logistics, construction, mining, agriculture and other verticals whose mission- and business-critical applications require guaranteed global connectivity with their mobile assets. The solution will provide OEMs, system integrators, and enterprises with a turnkey, end-to-end suite featuring:

• Telit Cinterion cellular LPWA module that is fully compliant with the new 3GPP R17 NB-IoT over non-terrestrial network (NTN) standard. This will enable satellite data communication using the NB-IoT protocol — without any special hardware changes required for the integration of the cellular module in the customer application.
• Telit Cinterion cellular and satellite data service plans, as well as a connectivity management portal. This drastically simplifies access to global connectivity with unique, centralized support and an advanced monitoring platform for full control of device fleets.
• Satellite connectivity services from Skylo — a direct-to-device Non-Terrestrial Network (NTN) operator focused on connecting anything, anywhere — in conjunction with floLIVE — the creator and owner of the world’s first and largest hyperlocal global network and a leading IoT connectivity enabler.

The Telit Cinterion ME910G1 module is currently under certification and approval by Skylo, making it one of the first modules that will be commercially available for customers globally. The solution will debut in Europe and North America following the launch of the floLIVE-Skylo service in 2024.

“The ability to leverage local cellular connectivity across the globe in tandem with satellite connectivity truly opens the globe to IoT and digital transformation,” said Chen Porat, floLIVE SVP of Sales, APAC and Africa. “floLIVE offers MNOs and IoT MVNOs with a global hyperlocal infrastructure that becomes the backbone to anywhere, ‘always-on’ connectivity. This expansion into the NTN domain signifies our dedication to supporting our partners through continuous growth in carrier relations, global presence, and service offerings.”

“We are thrilled to partner with Telit Cinterion, a recognized leader in the IoT industry. This collaboration will enable us to leverage Telit Cinterion’s expertise in cellular connectivity to expand the reach and capabilities of standards-based NB-IoT-over-NTN with the Skylo solutions,” said Sriram Subramanian, Director of Product Management at Skylo. “Together, we will empower businesses across industries to unlock the true potential of connected devices and drive digital transformation on a global scale.”

“Transportation companies, logistics providers and mine operators are just three examples of enterprises that need to monitor their high-value mobile assets anywhere and everywhere on earth,” said Manish Watwani, Chief Marketing and Product Officer, Telit Cinterion.

“Our strategic partnership with Skylo and floLIVE meets that need by providing the world’s first turnkey package of hardware and seamless, ubiquitous, global connectivity that leverages the best of cellular and satellite — all based on the new 3GPP R17 NB-IoT over NTN standard.”

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Telit Cinterion, a global enabler of the intelligent edge, and Rutronik, one of Europe’s leading broadline distributors, have seamlessly collaborated since 2007, providing a comprehensive portfolio of IoT products and services.

That robust partnership is now reaching new heights as Rutronik introduces Cinterion’s complete product range to its offerings in the EMEA region. The strategic move enhances Rutronik’s capability to deliver a diverse selection of cutting-edge components, including mobile communication, Wi-Fi, Bluetooth, GNSS positioning modules, SIM solutions, and various cloud services, to meet individual customer requirements more effectively.

After Telit became Telit Cinterion on January 1, 2023, the company expanded its range of secure IoT solutions in the area of modules and mobile connectivity. The additional product portfolio is now added to Rutronik’s linecard. The family-owned company was already the largest distribution partner in the EMEA region and the additional components will further expand this successful partnership. Among other products, components like the compact 5G modem card MV32-W, the IoT module PLS83-W, and the wireless IoT module TX62 are now included.

“Rutronik’s dedication to maintaining substantial stock levels not only solidifies their position as a dependable distribution partner but also underlines their reliability in meeting the diverse and dynamic demands of the market,” said Rene Heckeler, Sales Director of Global Distribution, Telit Cinterion.

“Together, we are poised to continue our joint journey, pushing the boundaries of IoT technology and further enriching the constantly evolving landscape of IoT solutions within the region.”

Tailor-made customer solutions thanks to highly innovative components and expertise

A key component of success is the combination of highly innovative products and expert knowledge. Rutronik’s Field Application Engineers (FAE) work hand in hand with the experts from Telit Cinterion to ensure an excellent consulting service.

“Together, Rutronik and Telit Cinterion have committed to pooling their expertise at both the technology- and employee-level to transform the wireless IoT market in EMEA,” said Jens Rook, Senior Sales Director, Telit Cinterion.

“Through continuous investment in training and skill development, we ensure that our teams offer the latest technological innovations and provide the highest level of service and support to our valued customers across the region.”

Daniel Barth, Senior Manager Product Marketing Wireless at Rutronik, adds: “Our aim is always to act in the interests of our customers and to offer the best solutions that are precisely tailored to their needs. With the combination of highly innovative components from Telit Cinterion, our expertise, and our services, we achieve exactly that. We are convinced that by expanding our product portfolio, we will continue to write our success story by offering our customers a comprehensive range of first-class wireless hardware, mobile contracts, and cloud services.”

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• Using Telit Cinterion’s cellular LPWA modules and IoT connectivity solutions, WaterSignal transfers water data independent of a power source
• WaterSignal, an innovator in the water conservation space, leverages Telit Cinterion’s technology to ensure always-on connectivity for its water monitoring system

Telit Cinterion, a global enabler of the intelligent edge, today announced that it is working with WaterSignal to ensure always-on connectivity to its real-time water monitoring and leak detection systems.

As water scarcity continues to increase worldwide, baseline water benchmarking and evaluation have become critical, requiring operation teams for domestic meters, irrigation systems and cooling towers to have reliable access to on-demand data. Through WaterSignal’s remote water monitoring capabilities – supported by cellular LPWA modules and IoT connectivity solutions – teams gain deeper insights into their towers and systems’ efficiencies while eliminating the need to perform repetitive, manual day-to-day meter readings.

WaterSignal’s real-time water monitoring and leak detection system enables make-up and blow-down meter monitoring for cooling towers, helping teams search for leaks proactively, mitigate water loss and damage and justify evaporation credits with local municipalities. The unique technology is non-invasive, unlike others, WaterSignal’s solutions attach to any existing water meter without a disruptive installation, significantly reducing costs while eliminating the need for additional city approval.

In light of ongoing and worsening power outages, WaterSignal needed to transfer water data independent of a power source. The company also needed a trusted and dependable technology partner for cellular IoT connectivity and network services. Because of these requirements, WaterSignal turned to Telit Cinterion’s cellular LPWA modules and IoT connectivity solutions for their units.

Telit Cinterion’s cellular LPWA supports various devices, from point-of-sale terminals and smart meters to industrial sensors and asset management. Its modules include Power Saving Mode (PSM) and extended Discontinuous Reception (eDRX), ideal for increasing IoT application power saving and battery life when backed by networks. The cellular LPWA module family form factor also allows developers to employ a “design once, use anywhere” strategy, helping them decrease costs, truncate development time and deploy the most optimal technologies for the application’s environment. In addition to providing superior performance for the module, the radio frequency front-end (RFFE) engineering delivers reliable connections, even for IoT devices in hard-to-reach locations typical of a water monitoring setting.

“Telit Cinterion is a leading IoT provider and was selected because of its excellent reputation for quality modules, which later expanded to its IoT connectivity network services,” said Mike Drake, Vice President of Engineering, WaterSignal.

“WaterSignal can ensure connectivity for customers via cellular data rather than Wi-Fi. It does not require a connection to power. This capability provides a more stable connection. It allows the WaterSignal device to communicate, even in deep vaults or locations far away from buildings with Wi-Fi.”

“When monitoring critical resources, like water, a reliable connection is pivotal to maintaining visibility and extracting actionable insights,” said Neset Yalcinkaya, SVP Sales Americas, Telit Cinterion. “WaterSignal’s technology is invaluable for operation teams, and we are pleased that Telit Cinterion’s cellular LPWA modules and IoT connectivity solutions are central to providing that essential connection, particularly the ability to use cellular instead of Wi-Fi to transfer water data independently of a power source during an outage.”

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• NR-Light or RedCap, a new class of 5G, fills the gap between high-speed mobile broadband devices and extremely low-bandwidth devices
• First generation 5G RedCap IoT modules offer worldwide coverage with LTE Cat 4 fallback and flexible form factors
• Modules integrate perfectly with Telit Cinterion connectivity and services, encompassing NExT data plans, connectivity activation, AppZone and OneEdge

Telit Cinterion, a global enabler of the intelligent edge, today announced the introduction of its first-generation 5G RedCap IoT modules, leveraging Snapdragon® X35 5G Modem-RF System, the world’s first 5G NR-Light modem-RF system.

By leveraging Snapdragon X35, Telit Cinterion offers its customers an unparalleled evolution path from mid-speed LTE to cost-effective 5G, ensuring they remain at the forefront of technological progress and can transition seamlessly to the latest technology when the time is right.

As defined by 3GPP Release 17, the 5G New Radio (NR) RedCap is a new, mid-tier 5G device class to serve ‘middle of the range’ IoT use cases. RedCap benefits from the scale of 5G NR networks, while using fewer 5G NR capabilities for an optimum balance of features versus cost and power consumption.

The new 5G RedCap modules offer efficiency and reliability and include two new compact LGA modules — the PVR81 and FE910C04 — pin-to-pin and software compatible with Telit Cinterion LTE modules, as well as the FN920C04 M.2 standard adapter card. These modules offer premium throughput of 220Mbps/100Mbps in DL/UL, surpassing LTE Cat.4 capability through higher QAM modulation. The modules ensure backward compatibility with R15/16 and LTE Cat 4 fallback, guaranteeing seamless communication and coverage.

Purpose-built to cater to a variety of industries, the new 5G RedCap IoT modules feature a rugged design, making them suitable for a wide range of demanding applications, including agricultural and construction telematics, industrial gateways, health care and security and surveillance. With the continuous expansion of IoT applications, these modules provide a future-proof solution that extends the lifecycle of LTE Cat 1 and Cat 4 modules, ensuring long-term viability and performance with compatible hardware form factors that allow customers to upgrade their devices to 5G while keeping the same hardware design. The incorporation of state-of-the-art positioning accuracy with dual-band L1/L5 high-performance embedded GNSS further enhances their capabilities.

Notably, the new 5G RedCap IoT modules simplify connectivity with an onboard eSIM ready for connectivity activation and NExT connectivity. Additionally, OneEdge and embedded processing capability enabled by AppZone ensure advanced capabilities for device management and processing.

The first-generation 5G RedCap modules come with multiple SKU options, including fully global variants on all form factors, catering to customers’ diverse requirements across the world. The 5G RedCap IoT modules, powered by Snapdragon X35, provide a solution that is not only forward-looking but also capable of adapting to the changing technological landscape. As IoT applications continue to shape industries, these modules empower businesses to embrace innovation and drive progress.

“We are excited to continue our collaboration with industry leaders such as Telit Cinterion to advance ecosystem commercialization of NR-Light globally,” said Preethika Adyanthaya, Director of Product Management, Qualcomm Technologies, Inc. “This announcement showcases the combined strength of Telit Cinterion’s expertise in IoT solutions and Qualcomm Technologies’ leading connectivity technology, enabling a new and wide range of use cases in various product categories.”

“Our collaboration with Qualcomm Technologies represents a significant milestone in our commitment to delivering cutting-edge IoT solutions,” said Marco Contento, VP of Product Management, Mobile Broadband, Telit Cinterion.

“The 5G RedCap modules powered by Snapdragon X35 provide a future-proof evolution path for a wide variety of IoT applications, ensuring our customers are equipped with the latest technology to drive innovation in their respective verticals.”

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• New line of Telit Cinterion 5G data cards and LGA modules will leverage Snapdragon X72 5G Modem-RF System
• These new products target high-performance routers, gateways and CPEs for consumers and enterprises

Telit Cinterion, a global enabler of the intelligent edge, today announced that their next-generation of 5G data cards and LGA modules portfolio will use the Snapdragon® X72 5G Modem-RF System.

This is the latest example of the two companies’ commitment to providing device OEMs with the latest technologies to differentiate and future-ready their consumer and enterprise products.

Snapdragon X72 is part of the world’s first 5G Modem-RF System family ready for 5G Advanced, boosted with AI hardware acceleration to drive the future of 5G in mobile broadband applications. Snapdragon X72 will help Telit Criterion’s customers to differentiate their devices, especially for service providers and end-users that demand products with long lifecycles.

Telit Cinterion will use the Snapdragon X72 for a new portfolio that includes a global M.2 data card and two LGA modules: one for North America and the other for use in Asia-Pacific (APAC), Europe, Middle East and Africa (EMEA) and South America. These new, high-performance modules support 4.4 Gbps peak downloads and 3.5 Gbps peak uploads, making them ideal for bandwidth-intensive applications such as fixed wireless access, mobile broadband, industrial IoT, private 5G and 4K video. Support for OpenWRT allows the new modules to seamlessly provide advanced networking features for a wide range of routers, gateways and CPEs for residential and enterprise use.

The new Telit Cinterion data cards and modules — currently in development — streamline product advancement, making it easier to integrate external peripherals such as Wi-Fi and Ethernet transceivers, without the need for costly adapter components. They also will enable OEMs to run their application software directly on the data card or module, thus eliminating the expense, board space and complexity of an external CPU.

Snapdragon X72 introduces a new modem-RF architecture purpose-built for scalability. The new converged mmWave-sub6 architecture and new mmWave antenna module Qualcomm® QTM565 help reduce hardware footprint, cost, design complexity and power consumption. Additionally, OEMs and Telit Cinterion customers can leverage the Qualcomm® Advanced Modem-RF Software Suite to further improve sustained performance across a wide variety of consumer and enterprise experiences.

“Snapdragon X72 is designed to drive the next phase of 5G evolution enabled by advanced 5G features, which will help Telit Cinterion customers future-ready their devices,” said Anand Venkataraman, Director of Product Management, Qualcomm Technologies, Inc. “We’re excited to continue bringing our connectivity technology to Telit Criterion customers so they can take full advantage of 5G.”

“For over two decades, Telit Cinterion and Qualcomm Technologies have partnered to provide device OEMs with early access to the latest and greatest technologies,” said Marco Contento, VP of Product Management, Mobile Broadband, Telit Cinterion.

“We’re continuing that tradition by making the Snapdragon X72 our foundation for Telit Cinterion’s new portfolio of 5G data cards and LGA modules which will raise the bar for what’s possible and preferable in mobile-powered devices such as routers, gateways and CPEs.”

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• WE310K6 module features the Realtek RTL8852BE chipset, 802.11 a/b/g/n/ac/ax, Bluetooth and Bluetooth Low Energy 5.2 for low power and high performance
• IEEE 802.11, Bluetooth SIG and Wi-Fi Alliance certifications eliminate the time and expense of developing and launching connected devices for consumer, medical, industrial and smart city applications

Telit Cinterion, a global enabler of the intelligent edge, today announced the WE310K6, a fully integrated, low-power module featuring dual-band, dual-stream Wi-Fi and dual-mode Bluetooth/ Bluetooth Low Energy.

The WE310K6 enables device OEMs to add high-speed wireless connectivity quickly and cost-effectively to their products — even when they have limited Bluetooth and Wi-Fi expertise.

The WE310K6 supports 802.11 a/b/g/n/ac/ax, classic Bluetooth and Bluetooth Low Energy 5.2, giving OEMs the flexibility to design products that can connect to other local devices or to the internet over Wi-Fi. The module is ideal for a wide variety of consumer and business applications, including:

• Smart home: home automation, appliances, home security and alarms, smart lighting, and IP cameras and speakers
• Health care and medical: remote patient monitoring, medical wearables, and health care and wellness devices
• Industrial and commercial: energy management, robotics, and industrial and building automation
• Other applications: aftermarket OEM telematics, fleet management, smart cities and parking, printers, asset management, pet and animal trackers, and more

The Realtek RTL8822BE-CG is a highly integrated single-chip that supports 2-stream 802.11ac solutions with Multi-user MIMO (Multiple-Input, Multiple-Output) and Wireless LAN (WLAN) PCI Express network interface controller and integrated Bluetooth 2.1/3.0/4.2 USB interface controller. It combines a WLAN MAC, a 2T2R capable WLAN baseband, and RF in a single chip. The RTL8822BE-CG provides a complete solution for a high-performance integrated wireless and Bluetooth device.

The WE310K6 also has IEEE 802.11 and Bluetooth SIG certifications and complies with Wi-Fi Alliance and Bluetooth SIG-v5.2 requirements. OEMs can get new products to market faster by reducing RF design time and removing the burden of testing and certification. The module’s other key features and benefits include:

• Two form factor options: LGA package or on top of an M.2 Key E carrier board
• Host-activated Wi-Fi and Bluetooth radios
• Dual-stream spatial multiplexing up to 1201 Mbps
• MU-MIMO technology
• Bluetooth Low Energy AUDIO Isochronous Channel (CIS) support
• Compatible with Wi-Fi 802.11 e, h, k and i
• Advanced security (including WPA3) with integrated crypto hardware
• Industrial-grade temperature range (-40 °C to +85 °C) to ensure reliability even in demanding environments

“We are thrilled to collaborate with Telit Cinterion and offer our latest generation Wi-Fi 6 solutions,” said Yee-Wei Huang, Realtek’s Vice President and Spokesman. “The collaboration yields a feature-rich platform with the latest cutting-edge technologies.”

“Wi-Fi 6 and Bluetooth Low Energy are rapidly becoming must-have features for consumer, enterprise, medical and industrial devices, but OEMs often face challenges in adding those technologies to their products,” said Marco Argenton, VP of Product Management for IoT Modules, Telit Cinterion.

“Our new WE310K6 enables them to add low-power quickly and cost-effectively, high-performance connectivity even when they have only limited RF design expertise. That means faster time to market and time to revenue and gives their customers peace of mind that the devices will work flawlessly from day one.”

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• Proof-of-concept (PoC) trial by Nestlé Brazil showcases 5G’s ability to support demanding, mission-critical applications such as industrial robotics
• Telit Cinterion’s 5G evaluation kit helps manufacturers and systems integrators identify where and how to leverage 5G for factory automation

Telit Cinterion, a global enabler of the intelligent edge, today announced completion of a successful proof-of-concept trial of private 5G for factory automation.

Conducted in partnership with Nestlé Brazil, the trial showcases why and how manufacturers are increasingly making 5G a foundational component of their Industry 4.0 transformation strategies. Many manufacturers are considering or already implementing 5G, including private 5G networks, a global trend that will be worth $109 billion by 2030.

Nestlé conducted the trial at Parque Tecnologico São José dos Campos, a government-sponsored research park where it is one of the resident companies exploring next-generation technologies and business processes. The trial focused on how Nestlé could use 5G to connect autonomous manufacturing robots and automated guided vehicles at their plants like the one in Caçapava, Brazil.

The trial used the Telit Cinterion 5G FT980-WW evaluation kit, which features the FN980 module. Based on the 3GPP Rel. 15 standard, the FN980m supports all major 5G frequency bands, giving private networks maximum deployment flexibility. The Nestlé trial focused on the use of sub-6 GHz spectrum.

“Telit Cinterion has been a partner of Nestlé since we began conducting the first tests using 5G technology at Nestlé’s Innovation and Technology Center (CIT) at the São José dos Campos Technology Park. We are very pleased with this unprecedented joint work, which is so important for the national industry,” explained Gustavo Moura, Digital Transformation Program Manager for Operations at Nestlé Brazil.

Neset Yalcinkaya, SVP Sales Americas at Telit Cinterion, said:

“Nestlé Brazil is one of several recent Latin America 5G factory automation trials that Telit Cinterion has been part of, which shows that manufacturers across the region see 5G as key for ensuring the success of their Industry 4.0 migration.”

“This successful trial also is the latest example of how manufacturers, systems integrators, and others turn to Telit Cinterion for private 5G factory automation and PoC trials.”

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• New software solution with artificial intelligence (AI) enables real-time quality control throughout the factory floor to maximize productivity and customer satisfaction while minimizing waste and rework.
• Deployable in the cloud or on premises, deviceWISE AI Visual Inspection seamlessly integrates with industrial cameras, robots and PLCs, as well as major platforms such as AWS, Azure IoT, IBM Maximo, SAP and Siemens.

Telit Cinterion, a global enabler of the intelligent edge, today announced deviceWISE® AI Visual Inspection, an AI-powered solution that enables automakers, pharmaceuticals, semiconductors, health care, energy and other manufacturers to optimize quality control, productivity, customer satisfaction and profitability.

Designed for a wide variety of factory floor use cases, deviceWISE AI Visual Inspection provides the granular, actionable insights that are critical for success in demanding production environments such as just-in-time manufacturing (JITM) and Industry 4.0.

deviceWISE AI Visual Inspection provides manufacturers with a turnkey solution for collecting visual inspection data from factory floor devices and then feeding it into analytics platforms. These insights enable manufacturers to quickly identify and address emerging quality control problems involving employee workstations, industrial robots, CNC machines and more. In the process, these insights help minimize rework and downtime and help meet production schedules.

Deployable in the cloud or on premises, deviceWISE AI Visual Inspection:

• Leverages the latest visual AI technologies to identify problems such as missing bolts, improperly installed product badges, bad welds, misaligned seams and more.
• Uses a broad array of technologies from the NVIDIA Metropolis stack — the NVIDIA Jetson edge AI platform, DeepStream SDK and TensorRT SDK.
• Provides customizable algorithms for on-the-fly model training deployment.
• Integrates seamlessly with a wide range of factory floor equipment such as cameras, PLCs, robots and CNC machines, as well as enterprise software systems including AWS, IBM Maximo, Microsoft Azure IoT, SAP and Siemens.

deviceWISE is a scalable, integrated IIoT platform that provides visibility and control over connected machines and data. deviceWISE allows customers to use NVIDIA AI technologies to boost throughput and improve quality in each step of their manufacturing process. The platform collects and transforms data, integrates machines and systems, runs edge logic and provides data visualization. deviceWISE AI Visual Inspection leverages Telit Cinterion’s decades of experience in integrating industrial machines and data orchestration, while making it easy to identify and resolve problems in real time, minimizing downtime and reducing the impact on production.

“deviceWISE AI Visual Inspection significantly enhances the ability of manufacturers to quickly find and fix problems that directly affect their competitiveness and bottom line,” said Ricardo Buranello, SVP of IoT Platforms Business Unit, Telit Cinterion.

“deviceWISE is an IIoT platform that enables manufacturers to collect, transform and integrate data from any machine to any IT system, creating full applications for Industry 4.0 and digital transformation. Now with the new module deviceWISE AI Visual Inspection, we add cameras as sensors in a fully integrated suite. This will provide all the tools manufacturers need to disruptively innovate on their manufacturing processes.”

deviceWISE AI Visual Inspection is currently in pre-release with release expected in Q3 2023.

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