Innovative Wi-Fi HaLow Router with High-Speed Wi-Fi 6 for Long-Range IoT Connectivity in Diverse Environments.

CES 2024 – Morse Micro, a leading Wi-Fi HaLow silicon vendor, in partnership with Edgecore Networks, a prominent provider of traditional and open network solutions for enterprises, data centers, and telecommunication service providers, today announced a strategic partnership.

Together, they unveiled the new Wi-Fi HaLow router – the Edgecore EAP112.

This innovative router, ideal for outdoor environments and a variety of other settings, is designed to meet the rapidly growing demands of IoT applications. Equipped with advanced Wi-Fi HaLow capabilities and supporting the Matter protocol, the Edgecore EAP112 is uniquely positioned to connect thousands of IoT devices through a single device, marking a significant advancement in IoT connectivity solutions.

Edgecore EAP112 integrates Morse Micro’s MM6108 Wi-Fi HaLow module, marking a significant advancement for both commercial and consumer access point/router segments. The EAP112 is poised to revolutionize wireless connectivity by providing enhanced coverage and longer range for Wi-Fi-enabled IoT products using Wi-Fi HaLow technology.

“Our collaboration with Edgecore represents a pivotal moment in Morse Micro’s journey to redefine wireless connectivity for the IoT with Wi-Fi HaLow technology,” said Michael De Nil, co-founder and CEO at Morse.

“The integration of our Wi-Fi HaLow module into Edgecore’s EAP112 access point/router platform exemplifies our commitment to expanding long-range connectivity options for the growing IoT ecosystem.”

Wi-Fi HaLow technology is the first Wi-Fi standard tailored to meet the unique needs of the Internet of Things (IoT), making it a superior alternative to traditional Wi-Fi alternatives in a wide range of IoT applications. Operating in the sub-GHz frequency band, the Wi-Fi HaLow 802.11ah standard was designed from the ground up for the IoT, offering an optimal combination of extended range, power efficiency, long battery life for wireless devices, superior penetration of barriers, large network capacity, advanced security, and Wi-Fi compatibility.

The EAP112 offers robust extensibility and usability for diverse IoT applications, featuring Wi-Fi 6, Wi-Fi HaLow, 4G LTE, BLE, Zigbee, and Thread. Designed for resilience in various environments and applications, especially in challenging terrains or climates, it operates within a temperature range of -30°C to 50°C and is IP65-rated for superior water and dust resistance. The EAP112 also provides flexible mounting options, including wall, ceiling, and pole mount, to accommodate specific site needs.

The Edgecore EAP112 is designed to leverage the complementary strengths of Wi-Fi HaLow and Wi-Fi 6 technologies, providing unparalleled range, coverage, speed and reliability. This Wi-Fi combination is especially critical in today’s IoT-driven world, where the ever-increasing demand for consistent and robust wireless communication is driving innovations in access point and router platforms.

Key Features of the Edgecore EAP112 Access Point/Router:

• Enhanced Coverage: The EAP112, equipped with Morse Micro’s MM6108 module, significantly boosts IoT connectivity, ensuring efficient and effective coverage. This enhancement enables intelligent applications across a variety of settings, including expansive residential areas, commercial spaces, and industrial environments.
• Advanced Connectivity: The platform’s Wi-Fi 6 technology ensures higher data rates and increased capacity, making it ideal for handling multiple IoT devices and high-bandwidth applications.
• Optimized Power Efficiency: The integration of Wi-Fi HaLow ensures that the EAP112 is not only powerful but also power-efficient, making it suitable for deployments in remote locations.
• Future-Proof Technology: The EAP112 is designed to meet the evolving demands of both commercial and consumer applications, paving the way for widespread adoption of Wi-Fi HaLow technology in the IoT ecosystem.

“Our partnership with Morse Micro aligns seamlessly with our goal to provide innovative products in the Wi-Fi HaLow IoT router market. The launch of the EAP112 represents a pivotal moment in harnessing the extensive potential of IoT connectivity, bringing significant advantages to our clientele in both commercial and consumer segments,” declared TengTai Hsu, VP of Edgecore Networks. “The EAP112 embodies our commitment to innovation and excellence, reflecting our dedication to advancing IoT applications with technologies like Wi-Fi HaLow and Matter. We have initiated Proof of Concept (POC) collaborations with selected regional customers. Our long-established partner, BeMap, is gearing up to kick off the sales and marketing of the EAP112 in Japan. Concurrently, Edgecore Wi-Fi is preparing to open pre-orders for the EAP112 to the global market later this year.”

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Quectel Wireless Solutions, a global IoT solutions provider, is pleased to announce a major milestone for its satellite communication module, CC200A-LB, which has recently secured global certifications from leading authorities, including CE, FCC, IC, and RCM.

This confirms CC200A-LB’s compliance with satellite network standards across Europe, North America, Canada, Australia, and New Zealand.

With a focus on cost-effectiveness and ultra-low latency, the CC200A-LB module delivers a reliable and uninterrupted global network connection. This makes it an ideal solution for a wide range of applications, including maritime, transportation, heavy equipment, agriculture, mining, oil and gas monitoring as well as other scenarios where cellular networks may be limited.

Norbert Muhrer, President and CSO, Quectel Wireless Solutions, said:

“We are thrilled to see the global approval of our satellite communication module. Its capability in delivering uninterrupted network coverage ensures continuous and cost-effective communication for managing remote and mobile assets anytime, anywhere.”

The CC200A-LB incorporates cutting-edge satellite IoT connectivity offered by ORBCOMM, utilizing the L-band of the Inmarsat GEO constellation. It features two-way communication, low latency, and global coverage. When paired with cellular modules, it enables distinctive dual-mode IoT applications, providing unparalleled reliability, redundancy and ubiquitous coverage. In scenarios with inadequate or disrupted cellular network coverage, IoT devices can seamlessly sustain communication through satellite connections.

The CC200A-LB is designed with a streamlined LCC+LGA package, measuring 37mm × 38mm × 3.35mm. Equipped with multi-constellation GNSS positioning, the module can identify the device’s location quickly and precisely. Its user-friendly AT command set facilitates effortless configuration and management.

The module can be purchased in isolation or with the appropriate Quectel antenna to help accelerate the time-to-market of customer devices.

Apart from the CC200A-LB, Quectel has diversified its portfolio by introducing a range of satellite communication modules. Among them, the CC660D-LS is compliant with 3GPP NTN R17 standards and features two-way communication, support for multiple frequency bands, low latency as well as low power consumption. The BG95-S5 and BG770A-SN modules are designed to support both satellite and cellular networks, providing ubiquitous coverage for IoT applications.

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Empowering Turkish product makers with the C16QS Smart Cellular IoT Module for Cost-Efficient, High-Performance Cat 1.bis IoT Solutions.

Cavli Wireless, a pioneer in cellular IoT module manufacturing, today announced the launch of its new ultra-low-cost C16QS LTE Cat 1.bis cellular IoT module in the Turkey market.

This launch is not just a strategic step towards meeting the growing demand for low-cost 4G smart connectivity solutions in the region; it marks a significant milestone in Cavli Wireless’s commitment to the Turkish market, addressing its specific needs for affordable, high-quality IoT connectivity.

The Cavli C16QS, a state-of-the-art single-mode LTE Cat 1.bis Cellular Module, epitomizes Cavli’s commitment to high-quality, affordable smart connectivity. Designed in line with 3GPP Release 14 standards, it features a small form factor and integrated eSIM and GNSS, requiring only a single antenna and fewer power amplifiers. This design reduces space and power consumption, allowing smaller modules with region-specific deployment. Tailored for the Turkish market, the C16QS offers OEMs the chance to cut initial hardware costs due to its competitive pricing, making it a cost-effective local solution.

Its ability to easily switch between networks, coupled with global connectivity and device management capabilities, makes it ideal for various smart connectivity applications. Additionally, a separate battery can power the GNSS without activating the LTE, further enhancing power efficiency. The integration of both RAM and NOR Flash on the chip ensures a smaller device footprint and faster performance, meeting the diverse connectivity needs and economic dynamics of the region.

The C16QS is set to power IoT adoption across various sectors in Turkey, including e-mobility, POS systems, electric charging stations, Telematics Control Units (TCU), asset tracking, and much more. Enhancing this module’s capabilities, the Hubble Stack Intelligence, a key component of the Cavli Hubble connectivity & modem management platform, offers advanced remote diagnosis, monitoring, and debugging through the Hubble Lens feature. This innovation not only streamlines IoT deployment by eliminating the need for physical intervention but also scales IoT solutions in the most seamless manner. Furthermore, Cavli’s strong network operator partnerships have bolstered its presence in the market, offering robust local LTE and LTE-M connectivity solutions that are redefining industry standards in terms of service quality and pricing.

“The introduction of the C16QS cellular IoT module in Turkey is a pivotal moment for Cavli Wireless,” stated John Mathew, Chief Executive Officer, Cavli Wireless. “The C16QS stands out in the market for its exceptional balance of price efficiency and advanced connectivity features, making it an ideal choice for Turkish product makers looking to leverage Cat 1.bis based smart connectivity solutions. The launch of the C16QS is poised to be a key driver in cellular IoT adoption in Turkey, perfectly aligning with our vision of democratizing IoT by providing high-performance, seamless connectivity solutions tailored to the demanding needs of the Turkish region.”

Istanbul, Ankara, and Izmir have thriving engineering ecosystems, with numerous universities, research institutions, and companies focused on manufacturing and engineering. This strong foundation in engineering has contributed to the rapid growth of the IoT industry in Turkey, with the market value jumping from a few hundred million dollars to $9.55 billion in recent years. The advancement of these engineering hubs is expected to further propel IoT industry growth, potentially reaching $18.2 billion by 2027, driven by factors like smart city solutions, Industry 4.0 adoption, and government digital economy efforts.

Cavli partners with a Turkish mobility specialist to enhance mobility-as-a-service through micro-mobility charging solutions, utilizing integrated smart modules and a cloud platform to ensure reliable networks that transform city infrastructure into smart charging networks for micro-mobility vehicles. The engineering expertise concentrated in these cities continues to drive Turkey’s leadership in IoT and digital transformation.

As a pioneer in cellular IoT, Cavli Wireless takes pride in supporting the digital transformation of Turkish companies across industries. The company is grateful for the opportunity to collaborate with partners and customers in Turkey, providing seamless and affordable smart connectivity through optimized cellular IoT solutions tailored for the region. Cavli is dedicated to fostering the continued growth of Turkey’s thriving engineering ecosystems and rapidly expanding IoT sector. The company aims to build enduring relationships and play an integral role in advancing Turkey’s leadership in engineering. By leveraging the cellular IoT expertise to meet the connectivity needs of the Turkish market, Cavli Wireless looks forward to realizing the full potential of IoT innovation to drive progress that improves lives nationwide.

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Quectel Wireless Solutions, a global IoT solutions provider, announces the new Quectel SG520B series of 5G Sub-6GHz, Wi-Fi 6E and Bluetooth smart modules.

The module series has been developed to meet growing needs for smart modules which can support not only connectivity but also a variety of functions, such as edge computing capability, graphics processing, multimedia and operation of peripherals such as displays, cameras and touch panels. The modules feature a built-in up- to-date Android operating system and are based on the Qualcomm® QCM4490 64-bit octa-core processor from Qualcomm Technologies, Inc.

Offering comprehensive cellular connectivity options including worldwide 2G, 3G, 4G and 5G coverage, with LTE Cat 15 and both 5G Release 16 standalone (SA) and 5G non-standalone (NSA), the modules offer 5G and LTE multiple input multiple output (MIMO) technology. This enables them to address growing market demands for high data rate and link reliability for wireless communications. The utilization in MIMO of multiple antennas at the receiver end at the same time and on the same frequency band significantly minimizes errors and optimizes data speed.

Norbert Muhrer, President and CSO, Quectel Wireless Solutions, said:

“The Quectel SG520B Series of 5G Sub-6GHz smart modules are powerful, versatile modules that are ideal for enabling rich device functionality alongside unparalleled connection performance across multiple cellular, Wi-Fi and Bluetooth options.”

“We see huge potential for the SG520B Series to support use cases in the industrial, enterprise and consumer markets that demand rich media functionality backed by high performance processing and connectivity.”

Further connectivity choices include 2×2 MIMO Wi-Fi 6E, IEEE 802.11 a/b/g/n/ac/ax. and Wi-Fi dual band simultaneous (DBS), with peak data rate up to 3.6Gbps. In addition, the smart modules offer Bluetooth 5.2 and the option of a multi-constellation global navigation satellite system (GNSS) receiver for applications that require fast and accurate fixes in any environment.

Designed for industrial and consumer applications that require high data rates and support for powerful multimedia functions, typical use cases include smart gateways, customer premise equipment (CPE), Mi-Fi devices, point of sale (POS) terminals, cash registers, dashcam, digital signage and industrial PDAs etc.

Available in a 42.5mm x 56.5mm x 2.95mm LGA package, the SG520B Series has an operating temperature range of -35 °C ~ +75 °C. The modules will support NSA/SA with maximum 5G downlink speeds up to 2.5Gbps and uplink speeds up to 900Mbps. For 5G NSA deployments, the modules will support 2.5Gbps downlink and 550Mbps uplink, again depending on which regional variant is selected. The modules also support 1080p H.265/H.264 video encoding and decoding.

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The iSIM is another important step in SIM technology. G+D Mobile Security has played a key role in its development and along with PassTime is now launching the first commercially viable large-scale solution, together with AT&T and Sony Semiconductor Israel.

PassTime, a leading manufacturer of IoT solutions for the automotive industry, wanted to develop its next generation compact GPS locater to be even more energy-efficient with added features and reduced manufacturing complexity for broadening its applicability in other market verticals. Due to these requirements, a classic SIM card or even eSIM presented space and power challenges that were solved with the iSIM (integrated SIM) solution. PassTime selected G+D, AT&T and Sony for the next generation Encore product design.

The companies worked closely together to design the new PassTime Encore locater, which is based on Sony’s Altair ALT1250 chipset and G+D Mobile Security’s proven SIM operating system and is connected via AT&T’s cellular network.

The central component of the solution is the iSIM or iUICC (integrated Universal Integrated Circuit Card). Unlike pluggable SIM cards or soldered eSIMs, the iUICC is a TRE (tamper-resistant element) within a SoC (system-on-a-chip). That means that the iSIM is an isolated hardware component that is combined with a baseband chipset to form a single connectivity module.

In the short term, the iSIM will be used primarily for secure IoT connectivity in applications on LTE-M or LPWAN (Low Power Wide Area Network), for example in the energy industry and in healthcare. Consumer devices, such as notebooks, are expected at a later phase.

iUICC offers numerous advantages. These include:

• Smaller hardware real estate for cost saving: the small space requirement, which enables the production of small, lightweight, and thus also cost-effective devices
• Energy efficient for IoT: optimized energy consumption, which increases the efficiency of IoT devices
• Streamlines end-to-end manufacturing process: efficient and fast device production that optimizes manufacturing and operating processes
• Trusted security with major connectivity operators: a high level of security offered by the isolated hardware in combination with G+D Mobile Security’s SIM operating system
• Sustainability: ensured by dispensing with slots, additional housings, plastic and eliminating transport routes.

“For many IoT applications, analysts expect the iSIM to dominate in the long term. G+D Mobile Security invested in the research and development of this new technology at a very early stage and is now playing a pioneering role in the market launch together with industry partners. We are convinced, as demonstrated by this project, that this will enable us to write another exciting success story in this crucial technology segment,” explains Philipp Schulte, CEO G+D Mobile Security.

“PassTime’s asset tracking solution, Encore, is battery-powered and designed to track just about any mobile asset. The device’s small form factor and ultra-low energy-consumption are critical factors to the application as it is often called upon to be in the field for four years or more on the initial battery charge. The iSIM solution allows us to further enhance our solutions’ efficiency in these vital areas,” said Todd Goodnight, EVP and Chief Technology Officer at PassTime.

Dima Feldman, VP Product Management and Marketing at Sony Semiconductor Israel, said:

“The Encore PassTime Tracker marks the first commercial use of the iSIM in scale.”

“This is an important step whose simplification and affordability will enable massive adoption of the IoT. We want to thank everyone involved in this development for making it happen.”

PassTime’s fourth generation Encore has completed testing and will be commercially available starting November 2023.

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News highlights:

• New Arm Cortex-M52 is the smallest, most area- and cost-efficient processor enabled with Arm Helium technology, delivering enhanced AI capabilities for lower cost IoT devices
• Provides the flexibility to scale across a range of performance points and configurations, delivering DSP capabilities without a separate unit to save on area and cost
• Simplified development flows bring AI within reach on a single toolchain and single proven architecture

Generative Artificial Intelligence (AI) and Large Language Models (LLMs) are grabbing headlines, but many don’t realize how much AI is already deployed in embedded devices and impacting applications across our homes, cities and in industry – this is referred to as the Artificial Intelligence of Things (AIoT), and it’s being built on Arm. AI is critical to understanding data and enabling more seamless interactions between the physical and digital world. As this technology advances, on-device intelligence is being deployed in smaller, more cost-sensitive and often battery powered devices at the lowest cost points, with greater privacy and reliability due to less reliance on the cloud.

As AI-enabled IoT shipments continue to increase, our partners need access to more ML (Machine Learning) capabilities and simpler development flows, giving them the agility to innovate and scale quickly. To address these requirements, today we are announcing the Arm Cortex-M52, designed for AIoT applications that require a boost in digital signal processing (DSP) and ML performance without the cost overhead of dedicated DSP and ML accelerators. Cortex-M52 will unlock the potential for delivering ML on embedded computing solutions at lower price points than is possible today.

Bringing AI capabilities to a broader range of IoT devices

The Cortex-M52 includes Arm Helium technology, providing a significant performance uplift in DSP and ML applications for small, low power embedded devices, making it possible to deploy more compute intensive ML inference algorithms in endpoints without a dedicated NPU. Helium technology has already been implemented successfully in products at the far edge of the network, but the Cortex-M52 now enables Arm partners to take this capability into lower cost more power constrained devices.

By extending Helium technology into a new class of Cortex-M, Arm is delivering a step change in matrix and DSP compute on microcontrollers for smaller embedded devices. The Cortex-M52 provides a simplified migration path from the Cortex-M33 and Cortex-M4, addressing a wide range of AIoT applications to enable richer UI, voice and vision experiences, such as automotive and industrial control, predictive maintenance, and wearable sensor fusion. Cortex-M52 delivers the flexibility needed to scale across a range of performance points and configurations, providing DSP capabilities without a separate processing unit, saving on silicon area and cost.

Providing optimal performance and cost choice with robust safety and security

Cortex-M52 extends the Armv8.1-M Cortex-M line-up (which includes the Cortex-M55 and Cortex-M85) to a new efficiency point, a critical milestone in bringing ML capabilities to microcontrollers. It provides the lowest area and power implementation of any Helium-enabled Cortex-M, offering choice to silicon partners looking to trade-off performance and cost. Developers can benefit from an uplift in bothML and DSP performance, with up to 5.6x performance uplift for ML and up to 2.7x performance uplift for digital signal processing compared to previous Cortex-M generations.

Security remains critical in devices, especially when shipping at large scale, and Cortex-M52 implements the latest security extensions for Armv8.1-M, including PACBTI and Arm TrustZone technology, which offers enhanced software threat mitigation. In addition, Cortex-M52 will accelerate the route to PSA Certified Level 2 silicon, enabling the next generation of PSA Certified devices. The latest Armv8.1-M cores (including Cortex-M55 and Cortex-M85) also offer enhanced functional safety features that are crucial in many automotive and industrial control applications. The Cortex-M52 delivers these extended safety packages and features to help partners reach FuSa certification faster and more easily, compared to previous generation Cortex-Ms being deployed in these applications.

Simplifying AI development for the smallest endpoint devices

Traditional embedded developers grapple with the mathematical, data analysis, toolchain expertise and programming skills required for AI. Developer enablement is critical if we are to see an increase in AIoT shipments, and with the Cortex-M52 we’re delivering the critical features and capabilities required in a modern development flow today.

Historically, to achieve the ML and DSP performance Cortex-M52 delivers would have required the combination of a CPU, a DSP and an NPU, meaning that once the hardware is built, developers would need to write, debug and tune code for chips with three separate tool chains, three compilers, three debuggers, and so on. Now, we are bringing AI within reach on a single toolchain and single proven architecture with the industry-standard, user-friendly Arm Cortex-M portfolio. This ensures a unified development flow for traditional, DSP and ML workloads – while specific integration and optimizations for leading machine learning frameworks will ensure that developers have a seamless experience and get the best performance from any Cortex-M.

Cortex-M52 is fully software compatible with Cortex-M55 and Cortex-M85, enabling developers to benefit from and leverage the growing software and tools ecosystem around Helium, as well as free software libraries and an extensive knowledge base from our partner ecosystem. To help streamline and accelerate the IoT and embedded development process, Cortex-M52 will also be available on Arm Virtual Hardware, our cloud-based offering that enables software development in advance of silicon.

Deploying AI across the full spectrum of AIoT use cases, built on Arm

The AIoT runs on Arm and together with our partners, we identified a need to bring DSP and ML compute performance to low power embedded applications at a better cost and accessibility point for the market. The Cortex-M52 CPU delivers higher levels of AI inference performance on the smallest devices, enabling the industry to scale IoT device deployments even further.

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Fibocom unveils a high-performance, multi-mode LTE smart module SC228 to drive digital transformation across AIoT industries. Empowered by the Qualcomm Snapdragon® SM6225 chip, the module delivers superior CPU processing performance and excellent power efficiency backed by the features of an Octa-core (4*A73 2.4G + 4*A53 1.9G) processor and high-level graphics processor.

Fibocom, a global leading provider of IoT (Internet of Things) wireless solutions and wireless communication modules, announces the release of a new LTE smart module SC228 for the acceleration of digital transformation in smart retailing, smart wearable camera, Industrial IoT, In-vehicle infotainment market.

Integrated with a 6nm processor, the module utilizes the powerful CPU and GPU to deliver superior multimedia performance while conserving power. Compatible with frequency bands worldwide, the module also supports Bluetooth and dual-band Wi-Fi for short-distance wireless communication.

The integration of AI and IoT is reshaping the way that decision-makers from various industries operate and respond to real-time information. The highly integrated smart module SC228 is capable of offering a comprehensive solution for industry customers to improve product performance and facilitate the decision-making process. Equipped with a powerful CPU, SC228 can support the smooth running of AI algorithms, which ensures the terminals realize a bunch of functionalities such as facial recognition, HMI (Human-machine Interaction), etc. In terms of multimedia processing, the SC228 is integrated with a low-power island DSP (Digital Signal Processors) for sensors and audio, furthermore, it also supports multi-camera input and output with up to three of them working simultaneously. To cater to diverse IoT application scenarios, the SC228 is designed with rich interfaces including MIPI/ USB/ UART/ SPI/ I2C to help customers develop the terminals flexibly.

In software design, the SC228 is preset with an upgradable Android 14 operating system in cope with the ever-evolving software innovations, which can help our customers quickly meet the requirements for GMS (Google Mobile Service) certification and continuous development for long lifecycle terminals. Notably, the premium smart module is also built-in with GNSS for fast and accurate positioning for mobile scenarios.

Eden Chen, General Manager of MC BU at Fibocom, said:

“AI-driven productivity is inevitably evolving as an essential to extend the capabilities of IoT devices, significantly improve the operational efficiency by enriching the IoT device with edge computing.”

“We are pleased to be at the forefront of the AIoT market to provide a comprehensive, highly integrated SC228 smart module solution for various industries, looking forward, we are optimistic to unleash the interconnected intelligence with our powerful smart module portfolio.”

Engineering sample will be available by late December 2023.

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MediaTek debuts RedCap modem technology and chipset family to expedite the transition to 5G-NR for consumer, enterprise, and industrial IoT applications.

Leveraging its industry expertise in 5G connectivity, MediaTek announced it is expanding its family of modems and chipsets to support 5G RedCap.

The new solutions, the M60 modem IP and the MediaTek T300 chipset series, will make it easy for MediaTek to facilitate the transition to 5G-NR for a wide range of applications that require long lasting and efficient battery life, such as wearables, light-weight AR devices, IoT modules, and devices built with edge AI in mind.

RedCap, which stands for “reduced capability,” is designed to bring the benefits of 5G to NR consumer, enterprise, and industrial devices. Taking full advantage of the evolution of 5G networks to the Standalone (SA) network architecture, RedCap promises to deliver reliability for devices that have low bandwidth requirements, offering many of the benefits of 5G without the cost and complexity of typical 5G solutions.

“Our RedCap solutions are a significant part of our mission to democratize 5G, providing our customers the ability to optimize components and deliver 5G-enabled devices from a range of applications and a range of price points,” said JC Hsu, Corporate Senior Vice President at MediaTek.

“The migration to 5G RedCap will replace legacy 4G/LTE solutions, offering significantly better power efficiency and more reliable user experiences compared to leading edge 5G eMMB modem solutions and legacy 4G LTE Cat 4 and Cat 6 devices.”

As the world’s first 6nm Radio Frequency System-On-Chip (RFSOC) single die solution for RedCap, the MediaTek T300 series is breaking new ground in the RedCap space. This RFSOC will allow brands to capitalize on the emerging RedCap market and create innovative designs for enterprise, industrial, consumer, AR, and data-card applications. Built on the highly efficient TSMC 6nm process, the MediaTek T300 series integrates a single-core Arm Cortex-A35 in a significantly more compact PCB area. The MediaTek T300 series supports up to 227 Mbps downlink and 122 Mbps uplink data rates.

Both the T300 series and the M60 5G modem IP support the 3GPP R17 standard and combine MediaTek’s industry-leading power efficiency with coverage enhancements and extremely low latency. By leveraging MediaTek’s UltraSave 4.0 technology and reducing unnecessary paging receptions, the M60 offers up to a 70% reduction in power consumption compared to similar 5G eMBB solutions and up to 75% power savings compared to 4G LTE solutions.

MediaTek’s RedCap solutions are driving a new wave of efficiency, reliability, and cost-savings for 5G-enabled devices across the consumer, enterprise, and industrial sectors to meet ever-evolving connectivity requirements and expectations. The MediaTek T300 series devices will sample in the first half of 2024, with commercial samples in the second half of 2024.

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The CQS290 Android Smart Module, fully designed, engineered, and manufactured in India, aims to combine high-performance mobile computing and graphical capabilities with a seamless connectivity experience for automotive and industry 4.0 solutions.

Cavli Wireless, a pioneer in the IoT solutions landscape, showcased its innovative offerings at the India Mobile Congress 2023.

The event, held at Pragati Maidan, New Delhi, from October 27 to 29, stood as Asia’s largest telecom, media, and technology forum, a collaborative initiative presented by the Department of Telecommunications (DoT) and the Cellular Operators Association of India (COAI). At the event, attendees had the opportunity to explore Cavli’s groundbreaking IoT connectivity solutions at their booth located in Hall 3, Booth 3.41.

IMC 2023 marked a significant chapter for Cavli Wireless, highlighting not only its innovation in the Cellular IoT space but also solidifying its commitment to the Make in India initiative. As the first IoT solutions provider to design, engineer, and manufacture its cellular IoT modules in India, Cavli proudly proclaimed, “Our modules are Made in India, For the World.”

This firm stance underscored the company’s dedication to establishing India as a key player on the global semiconductor and wireless communications map. With its R&D engineering center and manufacturing hub securely based in Kochi, India, Cavli demonstrated its unwavering commitment to indigenous production and innovation during the event.

At the heart of Cavli’s exhibit was the CQS290, the flagship Cellular Android Module from the esteemed Cavli C-Series. This LTE Cat 4 module boasted impressive data rates, reaching up to 150 Mbit/s downlink and 50 Mbit/s uplink with 2G fallback. With its Cortex A53 quad-core CPU and Adreno 702 GPU, the CQS290 promises unparalleled graphics and power efficiency. The module comes in two region-specific variants. It is equipped with the Qualcomm Location Suite Gen 9VT engine, providing exceptional GNSS performance and supporting multi-constellation GNSS, including GPS, GLONASS, and more. The module is adept at energizing applications ranging from two-wheelers and telematics to fleet management and point-of-sale terminals. Its multifaceted features, amplified by the optional integrated eSIM, positioned it as the go-to solution for next-gen smart connected devices.

The Hubble Stack Intelligence further elevates the CQS290’s capabilities, allowing for remote diagnosis, monitoring, and debugging via Hubble Lens, a cutting-edge feature of the Cavli Hubble IoT platform. This innovation eradicates the need for on-site intervention, streamlining the scalability of IoT. Through strategic partnerships with operators both in India and globally, Cavli has carved a significant niche, offering unparalleled LTE and LTE-M connectivity solutions that redefine industry benchmarks in service quality and affordability.

Additionally, the Cavli booth featured the flagship C-Series Cellular IoT modules, which offer LPWAN and Wideband connectivity. These modules stood out due to their versatility in footprint, power consumption, and network capabilities, making them the ideal choice for diverse solution implementations. The Cavli solution expertise team was also on hand, conducting live demos of the Hubble Tech Stack and offering complimentary solution consulting to booth visitors.

Cavli Wireless, with its “Made in India, For the World” ethos has been lauded as one of the top companies with global business potential on a list curated by Forbes India & D Globalist. This recognition highlights our relentless commitment to pushing the boundaries of smart connectivity.

John Mathew, CEO & Chief Technology Architect of Cavli Wireless, commented, “Gracing the stage of India Mobile Congress 2023, Asia’s prime telecom, media, and technology event, Cavli Wireless revealed our pioneering Cellular IoT Android Module, the CQS290, fueled by recognition from Forbes India and D Globalist as one of the top 200 companies. We are unwavering in our commitment to developing India’s semiconductor ecosystem, recognizing the journey ahead to become a global semiconductor powerhouse despite geopolitical challenges, and emphasizing the necessity for industry-Government-Academia collaboration to meet this exciting challenge.”

Cavli Wireless is poised to redefine India’s electronics and wireless communications landscape. Having already established a robust engineering presence in Kochi, the company is gearing up for a significant workforce expansion in the coming years, with the India operations team projected to surpass 200 skilled professionals across diverse technological and business roles.

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The fusion of Artificial Intelligence (AI) and the Internet of Things (IoT) is propelling us into a new era of interconnected intelligence. This synergy, often referred to as AIoT, holds the potential to revolutionize industries, enhance daily life, and enable unprecedented levels of automation and efficiency. In this article, we will delve into the world of AIoT, exploring its definition, key applications, benefits, challenges, and the promising future it holds for our interconnected world.

Defining AIoT

AIoT, or Artificial Intelligence of Things, is a convergence of AI and IoT technologies. It involves embedding AI algorithms and machine learning models into IoT devices, enabling them to process and analyze data locally and make intelligent decisions. AIoT leverages the power of data analytics and machine learning to extract valuable insights and respond to changing conditions in real time.

Key Applications of AIoT

1. Smart Home

In the realm of smart homes, AIoT is making homes more intelligent and efficient. Smart devices, such as thermostats, cameras, and voice assistants, use AI to learn user preferences and adapt to individual needs. These devices can optimize energy use, enhance security, and automate various household tasks.

2. Healthcare

AIoT plays a vital role in remote health monitoring and telemedicine. Devices equipped with AI can collect and analyze patient data, such as vital signs and symptoms, and provide real-time health recommendations or alerts. This technology improves the quality of healthcare and helps manage chronic conditions more effectively.

3. Industrial Automation

In manufacturing and industrial settings, AIoT is transforming operations. IoT sensors collect data from equipment and processes, while AI algorithms analyze this data to predict maintenance needs and optimize production. This reduces downtime, increases efficiency, and improves overall productivity.

4. Smart Cities

AIoT contributes to the development of smart cities by enhancing urban planning and management. Traffic lights, surveillance cameras, and environmental sensors use AI to analyze data and improve traffic flow, monitor security, and reduce pollution.

5. Agriculture

In smart agriculture, AIoT is revolutionizing farming practices. IoT sensors collect data on soil quality, weather conditions, and crop health. AI models analyze this data to make decisions about irrigation, fertilization, and pest control, optimizing crop yields and resource use.

6. Retail

Retail businesses use AIoT to enhance the shopping experience. Smart shelves can monitor inventory levels, and AI algorithms can analyze customer behavior and preferences to personalize marketing and promotions.

7. Autonomous Vehicles

The automotive industry is integrating AIoT in the development of autonomous vehicles. AI algorithms process data from sensors, cameras, and Lidar systems to make real-time decisions for safe and efficient self-driving.

8. Energy Management

AIoT is improving energy efficiency by allowing smart grids to optimize power distribution based on real-time demand and supply data. This reduces energy waste and supports sustainable energy practices.

Benefits of AIoT

The integration of AI and IoT offers numerous advantages:

1. Real-Time Decision Making

AIoT enables devices to make real-time decisions based on data analysis. This leads to faster responses to changing conditions and improved efficiency.

2. Enhanced Automation

By embedding AI in IoT devices, automation becomes smarter and more adaptable. Devices can learn from data and user behavior, making automation more effective.

3. Improved Predictive Analytics

AIoT systems can predict maintenance needs, security threats, and other critical events, reducing downtime and preventing issues before they occur.

4. Personalization

AIoT can provide a more personalized user experience by adapting to individual preferences and needs.

5. Energy Efficiency

AIoT optimizes resource use and energy consumption, making processes more environmentally friendly and cost-effective.

6. Cost Savings

By automating processes and reducing downtime, AIoT can lead to cost savings in various industries.

Challenges and Considerations

While AIoT offers numerous benefits, it also poses challenges and considerations:

1. Data Privacy and Security

Collecting and analyzing sensitive data using AIoT technology raise concerns about data privacy and security. Strong data protection measures are essential.

2. Complexity

Integrating AI into IoT devices and systems can be complex and require specialized expertise. Deploying and maintaining AIoT solutions can be a challenge for organizations.

3. Connectivity

Reliable internet connectivity is crucial for the seamless operation of AIoT devices. Expanding network coverage and ensuring robust connections are vital.

4. Energy Consumption

AIoT devices, especially those that rely on continuous data processing, can consume significant power. Energy-efficient designs are important to mitigate this.

5. Ethical Considerations

AIoT technologies may raise ethical concerns, particularly regarding data collection, sharing, and decision-making processes. Ethical guidelines and regulations are necessary.

The Future of AIoT

As technology continues to advance, the future of AIoT looks promising. Here are some trends and developments to watch for:

1. Edge AI

Edge computing combined with AIoT allows for data processing at or near the source, reducing latency and enabling real-time decision-making.

2. 5G Connectivity

The rollout of 5G networks will provide faster and more reliable connectivity for AIoT devices, enabling them to operate more efficiently and securely.

3. Quantum Computing

Quantum computing may revolutionize AIoT by providing unparalleled processing power, enabling more complex analyses and decision-making.

4. Ethical AI

Developments in ethical AI aim to address concerns about data privacy, fairness, and transparency in AIoT systems.

5. AIoT Ecosystems

AIoT ecosystems will become more interconnected, with devices and systems working together to provide a seamless and intelligent experience.

Conclusion

The synergy of AI and IoT, known as AIoT, is transforming industries and daily life by enabling real-time decision-making, enhanced automation, and predictive analytics. Challenges related to data security, complexity, and ethical considerations must be addressed to ensure that the benefits of AIoT are fully realized.

As AIoT technology continues to evolve, it will remain a driving force in our interconnected world, offering a glimpse into a future where devices and systems are smarter, more efficient, and adaptable, ultimately enhancing our quality of life and the efficiency of various industries.

The post The Synergy of AI and IoT: Unleashing the Power of AIoT appeared first on IoT Business News.

With the popularity of FWA (Fixed Wireless Access) devices among homes and enterprises, the pursuit of unleashing the potential of unlimited speed performance with 5G and Wi-Fi combination never stops. During Broadband World Forum 2023, Fibocom debuts the Wi-Fi 7 module WN170-GL with key performance in supporting incomparable 5.8Gbps download speed and jitter-free latency, delivering blazing-fast wireless experience for FWA scenarios.

Fibocom, a global leading provider of IoT (Internet of Things) wireless solutions and wireless communication modules, debuts the groundbreaking Wi-Fi 7 module WN170-GL featuring multiple key advancements in optimized network usage, next-level speed performance, and elevated overall performance.

The state-of-the-art Wi-Fi 7 module is set to provide superior wireless connections for smart home devices and enterprise-level terminals.

Coupled with the Qualcomm® FastConnect 7800 WCN7851, the WN170-GL is a highly integrated module ready for 802.11a/b/g/n/ac/ax/be and compliant with Bluetooth 5.3 standard. Packaged in LGA form factor design, the Wi-Fi 7 module adopts multiple innovations and enhancements in the support of MU-MIMO (Multi-user MIMO) and 4K QAM (Quadrature Amplitude Modulation) modulation scheme, with the capacity to pack more data into each signal thus offering striking data throughput and assuring the lag-free wireless connectivity. In terms of channel bandwidth, the WN170-GL supports MLO (Multi-Link Operation), allowing maximum flexibility in DBS (Dual-band Simultaneous) operations such as 2.4GHz + 5GHz and 2.4GHz + 6GHz. Furthermore, WN170-GL is equipped with a closed-loop power detector and low-power PCIe interface to achieve low-power and high-speed data transmission.

By utilizing the merits of Wi-Fi 7 innovations, the 5G FWA industry will be able to unlock the next-level wireless experience for smart home devices and enterprise-level terminals. Fibocom provides the industry-first 5G + Wi-Fi 7 module solution by integrating the 5G Sub-6GHz module FG190 and Wi-Fi 7 module WN170-GL, helping FWA customers to build up the top-quality wireless devices such as CPE, router, mobile hot-spot etc.

5G FWA device is transforming as the ‘Hub’ with the pivotal role in enabling the Gigabit wireless access in both indoor and outdoor scenarios, and the introduction of Wi-Fi 7 module WN170-GL is crucial to unleash the next-level wireless experience combined with the Fibocom 5G module solution. Fibocom is confident in offering the industry-leading 5G + Wi-Fi 7 solution and bringing smoother video conferencing, virtual collaboration, and lag-free streaming for a wide range of industry customers worldwide.

Engineering sample of Wi-Fi 7 module WN170-GL will be available in 2023Q4.

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• Onomondo SoftSIM is the world’s first 100% software and agnostic IoT SIM, and now available for commercial deployment on Nordic devices
• New testing reveals that the power consumption of the radiomodule is reduced by up to 100% when using eDRX in idle mode

Earlier this year, Onomondo and Nordic Semiconductor announced a new collaboration aimed at integrating Onomondo’s world-first SoftSIM to cellular IoT end-products based on Nordic’s nRF9160 low power System-in-Package (SiP).

Today, the two organisations are announcing the successful integration of SoftSIM into nRF91 Series-based designs, meaning users of Nordic’s cellular IoT devices can now deploy the world-first technology across IoT projects, with early testing data showing a 90-100% reduction in power consumption.

Announced last year at the Made for IoT Summit, SoftSIM is the world’s first 100% software and agnostic IoT SIM. While non-physical eSIMs offer much promise, they still demand additional supporting hardware.. However, by reusing modules that already exist for cellular IoT, Onomondo’s IoT SIM can be stored and executed as pure software. In addition, with the embedded commercial agreements on eSIMs lacking the flexibility modern IoT use cases require, SoftSIM is network and platform agnostic, meaning there are no hidden lock-ins or unnecessary costs for users.

Today’s news means that users can now download SoftSIM from the Cloud, which will then be executed as software by the nRF9160 SiP’s embedded ARM Cortex-M33 application processor. The availability of SoftSIM in nRF91 Series-based designs is not only a world first, but also makes it one of the most compact and flexible solutions for cellular IoT connectivity in the market today. Without the need for extra hardware, users can significantly reduce the bill-of-materials (BoM) and simplify the design of IoT projects.

In addition, by combining SoftSIM with the most power optimized and highly integrated cellular IoT SiP on the market, the potential for low power IoT projects will be transformed. During testing, we found that using a SoftSIM reduces the current consumption by 100% compared to a physical SIM in idle, resulting in around 3.5µA. The SoftSIM itself consumes near zero current consumption in idle mode, compared to an average consumption of 46µA observed when using physical SIM cards from other connectivity providers. This means that the total average current in idle mode of the radio module can go from 52µA to 9.5µA which will greatly increase the battery lifetime of the device.

Commenting on the announcement, Michael Karlsen, co-founder and CEO of Onomondo said: “Today is an important milestone for Onomondo and our mission. Our promise has always been to break down the silos that exist between hardware and software within the IoT industry, and the successful integration of SoftSIM into nRF91 Series-based designs and now its availability to users is a huge step forward in delivering on it. The testing data already shows how much it could impact low power IoT projects globally, so we’re excited to see what the future holds as we work to build on this success and continue bringing SoftSIM to IoT users globally.”

“Nordic Semiconductor is thrilled to lead the way in the IoT industry. Back in 2015, we started developing the nRF9160, a groundbreaking product for Cellular IoT, with a vision of one day replacing the traditional SIM technology with smarter solutions,” says Svein-Egil Nielsen, CTO/VP R&D at Nordic Semiconductor.

“We’re happy that our collaboration with Onomondo brings the ‘world’s first’ SoftSIM to the market. This innovation simplifies how IoT devices connect, significantly cuts costs, enhances power efficiency, and provides more flexibility for our customers. This partnership shows our dedication to pushing the boundaries of what’s possible in the IoT world.”

Onomondo was founded on the idea that different parties from the IoT ecosystem need to work closer together. This is particularly the case with the connectivity part of the IoT spectrum, which has typically been seen as something that needs to be designed around and ‘made to fit’, rather than something where innovation can take place. SoftSIM is serving to break down these barriers, allowing users to double their devices’ lifetime, half battery consumption, drive down debugging time, and cut costs, all from functionality within the network itself.

Pavel Hübner, CEO and Co-founder of HARDWARIO, a leading provider of IoT solutions that tested SoftSIM, added: “When you think of connectivity, it’s something that should just ‘work’, no questions asked. For too long, progress in our industry has been held back by the legacy barriers between hardware and software. But it’s the innovation between Nordic and Onomondo that we’re now starting to see what’s possible when different parts of the industry collide and work more closely together. The testing data we saw was incredibly encouraging, and we’re excited to now be able to offer our users the ability to deploy the technology in the real world.”

The post World’s first SoftSIM from Onomondo now available on Nordic Semiconductor devices; testing reveals new era for low-power IoT appeared first on IoT Business News.

Quectel, a global IoT solutions provider, has unveiled six new antennas designed to provide robust connectivity performance for IoT devices.

The new antennas cover a wide range of use cases from 5G to non-terrestrial networks (NTNs) bringing new capabilities to customers.

“We’re delighted to further augment our comprehensive range of antennas with the addition of these new antennas and evaluation boards,” said Norbert Muhrer, President and CSO, Quectel Wireless Solutions.

“Internet of Things applications increasingly demand high-performance antennas that meet their specific needs whether that’s for competitive cost, access to specific network technologies in particular frequency bands or for robust, safe characteristics such as IP ratings and RoHS and REACH compliance.”

“The expanded Quectel antenna range is sure to meet the needs of your device and deployment and is backed by our design support and deployment experience, alongside, of course, our widely deployed and comprehensive range of modules.”

The Quectel YC0001CA is a 4G surface-mount design (SMD) antenna that is optimized for LTE, LTE-M and Narrow Band-IoT (NB-IoT) networks. This low-profile antenna, which measures just 35.0 x 8.5 x 3.0mm, operates in the 700-960MHz and 1710-2700MHz and is both RoHS and REACH compliant for use in sensitive environments. In addition, the antenna can be supplied on tape and reel for high-volume applications and is compatible with all of Quectel’s 4G, 3G, 2G and LPWA IoT modules.

The Quectel YC0018CA is a 5G SMD antenna that covers 5G New Radio (NR) Sub-6GHz frequency bands. Depending on the ground plane, the antenna is designed to be mounted directly to the printed circuit board (PCB) using a conventional PCB reflow process. Measuring 40.0 x 7.0 x 3.0mm, the antenna operates between -40 °C to +85 °C and weighs 15g. The antenna can be tuned specifically for the final device environment with a simple, PI matching circuit and, when used with other 5G antennas, it can achieve multiple input, multiple output (MIMO) performance. Also available on tape and reel, the antenna can also be supplied with the YC0018CAEVB evaluation board.

The Quectel YECN028AA is a 5G or NTN external antenna that supports the 410-470MHz, 617-960MHz and 1425-6000MHz frequency bands. With dimensions of 225 x 54.5 x 13.0mm, the antenna is IP66, RoHS and REACH compliant so it has wide applicability to use cases in sensitive environments. Featuring high efficiency and gain, the antenna offers omni-directional high-speed data transmission and can be used in a wide range of wireless devices such as access points, outdoor equipment, real-time monitoring devices and many others.

The Quectel YEMX223J1A is a 5G x 2 combo antenna that is IP67, RoHS and REACH compliant. Measuring 186.0 x 176.0 x 100.5mm, the combo antenna supports the 410-470MHz, 617-960MHz, 1420-1520MHz, 1710-2690MHz, 3300-3800MHz and 4000-6000MHz frequency bands. The ultra-wideband antenna box is also backward compatible supporting 2G and 3G networks as well as Cat-M and NB-IoT. Designed for ease of integration with connection via two cable lengths from 450-5000mm, the pole, wall suction mount omni-directional antenna offers ease of installation and durability thanks to its IP67 and IP69K compliant enclosure. Quectel offers flexible installation option with custom cable length and connector options

The Quectel YEMX425J1A is a 5G x 4 combo antenna that measures 186.0 x 176.0 x 150mm. The combo antenna supports the 410-470MHz, 617-2690 MHZ and 3300-6000MHz frequency bands and both RoHS and REACH compliant. Offering backward compatibility with 2G, 3G, Cat-M and NB-IoT, the antenna is, in common with the YEMX223J1A, compatible with Quectel’s RM520x Series of IoT modules. In addition, durability is assured thanks to the combo antenna’s IP67 and IP69K ASA enclosure.

Rounding out the latest wave of Quectel antenna introductions, the Quectel YSIS001AA, metal spring antenna operates in the 412-427MHz band, the 433-435 MHz band and the 450-470MHz band which is compatible with LTE B31 plus EU433 applications. Measuring 29.0 x 7.0 x 7.90mm, the RoHS and REACH compliant antenna is mounted to the host device PCB using the conventional SMD reflow process, offering high efficiency.

In common with all Quectel antennas, these new additions to the range also gain Quectel’s comprehensive antenna design support including simulation, testing and manufacturing for custom antenna solutions to meet customers’ specific application needs.

The post Quectel Expands Its IoT Antenna Portfolio With Six New 4G and 5G Antennas appeared first on IoT Business News.

Quectel Wireless Solutions, a global IoT solutions provider, and MikroElektronika (MIKROE) today announced the release of the LC29H series RTK (real-time kinematic) Click Boards.

The LC29H is a series of dual-band, multi-constellation GNSS modules that support the concurrent reception of global GNSS constellations including GPS, BDS, GLONASS and Galileo, delivering a substantial reduction in multipath interference within dense urban canyons and a remarkable improvement in positioning accuracy.

The Quectel LC29H series of GNSS modules has been designed to meet consumer mass-market requirements and enables high-precision, small form factor and low-cost devices. The modules are based on the latest L1/L5 receiver and compared to existing L1/L2 receivers, have equivalent accuracy performance but achieve 70% less power consumption and enable solutions to be 50% smaller.

The GNSS RTK 3 Click version features Quectel LC29HEAMD dual band (L1+L5) module. It can provide MSM4 or MSM7 RTK corrections and can be combined with the Quectel YEGM011AA Geodetic Antenna as a base station. It can also be used as a rover and can be combined with the high performance Quectel YB0017AA mobile antenna to provide centimeter-level accuracy. The combination of two boards and associated antennas can be used to facilitate a very cost-effective RTK base and rover pair with out-of-the-box centimeter-level accuracy.

“We’re thrilled that MIKROE has picked our new LC29H series for their new GNSS Click boards products,” commented Norbert Muhrer, President and CSO, Quectel Wireless Solutions. “MIKROE is known for providing best-in-class click boards, documentation, and development tools, helping engineers and OEMs to evaluate ideas quickly and effortlessly and to be able to get their new innovative products into production quickly.”

“MIKROE have collaborated with Quectel developing many peripheral add-on Click boards carrying GNSS, LTE, GSM modules. The result of our most recent cooperation is the two mikroBUS add-on boards for the development of RTK Rover and Base Station applications,” said says Aleksandar Mitrovic, Head of Click Development Team & Click boards Product Marketing Manager at MIKROE. “We are very impressed with the quality of communication and level of support during development of these reference designs.”

The LC29H Series is engineered to excel with dual-frequency support, culminating in exceptional accuracy. In autonomous mode, it achieves impressive accuracy values of 1 meter, while the RTK-capable variants achieve centimeter-level precision. What’s more, the optional dead reckoning (DR) function ensures top-tier positioning performance, even in challenging scenarios characterized by weak signals or the absence of GNSS signals.

The LC29H Series incorporates advanced power management capabilities, ushering in an era of low-power GNSS sensing and positioning. This feature makes the module an ideal choice for applications where power efficiency is paramount, especially in battery-powered systems, including robotic lawn mowers, e-scooters, sport trackers, drones or handheld detectors such as metal detectors.

The post Quectel and MikroElektronika announce LC29H series RTK click boards to achieve cm-accurate positioning for mass-market IoT devices appeared first on IoT Business News.

Quectel Wireless Solutions, a global IoT solutions provider, is pleased to introduce the EM060K-EA LTE-Advanced Cat 6 module, offered for the EMEA, APAC and Brazil markets.

The module, which is available in the M.2 form factor, measuring 30.0mm x 42.0mm x 2.3mm and powered by the Snapdragon® X12 LTE Modem from Qualcomm Technologies Inc, adopts 3GPP Release 12 technology and supports a theoretical peak date rate of 300 Mbps downlink and 50 Mbps uplink. The EM060K-EA can operate in extended temperature ranges from -25 °C to +75 °C, has a dedicated EMEA SKU and features power saving technology to ensure maximised deployment uptime.

Offering LTE-A and UMTS and HSPA+ coverage, the EM060K series has been designed for the global market and covers nearly all tier-one carriers worldwide. The modules include an optional built-in embedded SIM (eSIM) and feature dual SIM single standby (DSSS). The EM060K series is also compatible with Quectel’s EM12 series of Cat 12 modules, its EM160R-GL Cat 16 module and its RM500Q series of 5G modules to facilitate customers’ migrations between different modules.

In addition, the module is embedded with a multi-constellation, high-sensitivity global navigation satellite system (GNSS) receiver to enable positioning. This capability simplifies product design and provides adopters with faster, more accurate and more reliable positioning capabilities for applications that require this capability. Quectel has specifically tailored the EM060K-EA series for a range of primary applications, encompassing industrial routers, home gateways, set-top boxes, industrial and consumer laptops, as well as digital signage.

“We’re delighted to unveil the Quectel EM060K-EA LTE-A Cat 6 module,” said Norbert Muhrer, President and CSO, Quectel Wireless Solutions. “It is great to be able to introduce this high-performance module that brings LTE-A capability to the EMEA, APAC and Brazil markets. We’re especially pleased to bring customers this combination of high data rate and low power consumption at such a competitive cost. We look forward to supporting our customers’ additional needs for eSIM and GNSS capability within the EM060K series.”

This module boasts a comprehensive suite of Internet protocols, industry-standard interfaces, and a wealth of features. It is designed to cater to a diverse array of applications, including but not limited to industrial routers, home gateways, set-top boxes, industrial laptops, consumer laptops, industrial PDAs, rugged tablet PCs, and digital signage. Additionally, it offers compatibility with USB drivers for Windows, Linux, and Android, with the option for a built-in eSIM, further expanding its versatility.

The post Quectel introduces EM060K-EA LTE-Advanced Cat 6 module appeared first on IoT Business News.

The integrated SIM (iSIM) is an important evolutionary step in SIM technology, empowering simple and cost-efficient connection, deployment and go-to-market for Internet of Things (IoT) devices.

Giesecke+Devrient (G+D) is playing a key role in shaping this development and, together with Sony Semiconductor Israel, is launching the first commercial iSIM solution that supports remote SIM provisioning.

The iSIM, or integrated Universal Integrated Circuit Card (iUICC), has the potential to revolutionize IoT and makes devices more flexible and efficient. It is cost-optimized, smaller, more adaptable and sustainable than previous generations of SIMs and will complement established solutions such as the pluggable SIM and eSIM.

As the world’s first providers, G+D and Sony Semiconductor Israel are now taking iSIM development a step further by introducing a secure solution that is specifically designed for remote SIM provisioning (RSP), enabling seamless over-the-air activation and management of SIM profiles. This allows for high flexibility to choose the respectively preferred cellular network throughout the long lifespan of an IoT device, while also offering the most cost-effective solution over its lifetime, according to a recent whitepaper from Transforma Insights.. The capability to set profiles depending on the device’s location simplifies the global scaling of deployments. Additionally, RSP helps streamline production, storage, and logistics processes, to enhance operational efficiency.

The new solution is based on the iSIM-enabled ALT1350 chipset by Sony Semiconductor Israel, which now supports standardized and future-proof RSP. G+D’s secure SIM operating system (OS) is stored in a tamper-resistant element (TRE) within a system-on-a-chip (SoC), unlike insertable SIM cards or soldered eSIMs. It acts as an isolated hardware component that is combined with a baseband chipset to form a single connectivity module.

The iSIM offers numerous advantages: Less hardware comes with minimal footprint and enables the production of small, lightweight and therefore cost-effective devices, and the optimized energy consumption increases device efficiency. High security is provided by the isolated hardware in combination with G+D’s secure and certified SIM OS. Production and warehousing processes can be optimized because there is no need to solder different hardware components or plug SIM cards into the device. Finally, iSIMs also support higher sustainability requirements, with the absence of slots, additional housings or plastic.

Due to its low power consumption and small size, the iSIM is an ideal choice for battery-constrained IoT devices operating in low-power wide-area networks (LPWANs) through Narrowband IoT (NB-IoT) or Long Term Evolution for Machines (LTE-M) technologies. Wearables are also among the potential areas of application. Typical use cases can be found in market segments such as smart metering, agtech, smart health, tracking and tracing or the entire spectrum of massive IoT.

With the AirOn360 central SIM management solution, G+D provides a comprehensive service for over-the-air administration of iSIMs. It supports both remote SIM provisioning of network operator-specific data and update management. The solution complies with GSMA RSP specifications for consumer, M2M and IoT applications and helps Original Equipment Manufacturers (OEMs) or device owners manage the iSIM lifecycle efficiently and securely. RSP in accordance with the new GSMA SGP.32 standard for M2M/IoT use cases empowers IoT device operators with maximum flexibility in their choice of mobile network operators. This allows them to choose the optimal provider in terms of cost, service quality or network coverage, for example.

“As market leader in eSIM, G+D has been investing in the research and development of iSIM technology for a long time. Together with industry partners, we want to accelerate SIM innovation. A good example for this is our cooperation with Sony, under which we are now announcing the industry’s first commercial iSIM with remote SIM provisioning. This pioneering achievement empowers our customers to unlock the full potential of the IoT with flexible and cost-optimized connectivity. We are convinced that this will be another important milestone in the iSIM evolution,” explains Bernd Müller, Head of Technology and Strategy in the connectivity & IoT business at G+D.

“This solution marks another joint success between Sony Semiconductor Israel and G+D. The iSIM is poised to reshape the future of IoT in which everything is connected,” added Dima Feldman, VP Product Management & Marketing at Sony Semiconductor Israel.

“Our ALT1350 baseband chipset combined with G+D’s SIM operating system and management solution, has led to a powerful, simple, and secure IoT connectivity management system that will drive the market forward.”

The post G+D and Sony Semiconductor Israel launch first solution for remote SIM provisioning of iSIMs appeared first on IoT Business News.

• NR-Light or RedCap, a new class of 5G, fills the gap between high-speed mobile broadband devices and extremely low-bandwidth devices
• First generation 5G RedCap IoT modules offer worldwide coverage with LTE Cat 4 fallback and flexible form factors
• Modules integrate perfectly with Telit Cinterion connectivity and services, encompassing NExT data plans, connectivity activation, AppZone and OneEdge

Telit Cinterion, a global enabler of the intelligent edge, today announced the introduction of its first-generation 5G RedCap IoT modules, leveraging Snapdragon® X35 5G Modem-RF System, the world’s first 5G NR-Light modem-RF system.

By leveraging Snapdragon X35, Telit Cinterion offers its customers an unparalleled evolution path from mid-speed LTE to cost-effective 5G, ensuring they remain at the forefront of technological progress and can transition seamlessly to the latest technology when the time is right.

As defined by 3GPP Release 17, the 5G New Radio (NR) RedCap is a new, mid-tier 5G device class to serve ‘middle of the range’ IoT use cases. RedCap benefits from the scale of 5G NR networks, while using fewer 5G NR capabilities for an optimum balance of features versus cost and power consumption.

The new 5G RedCap modules offer efficiency and reliability and include two new compact LGA modules — the PVR81 and FE910C04 — pin-to-pin and software compatible with Telit Cinterion LTE modules, as well as the FN920C04 M.2 standard adapter card. These modules offer premium throughput of 220Mbps/100Mbps in DL/UL, surpassing LTE Cat.4 capability through higher QAM modulation. The modules ensure backward compatibility with R15/16 and LTE Cat 4 fallback, guaranteeing seamless communication and coverage.

Purpose-built to cater to a variety of industries, the new 5G RedCap IoT modules feature a rugged design, making them suitable for a wide range of demanding applications, including agricultural and construction telematics, industrial gateways, health care and security and surveillance. With the continuous expansion of IoT applications, these modules provide a future-proof solution that extends the lifecycle of LTE Cat 1 and Cat 4 modules, ensuring long-term viability and performance with compatible hardware form factors that allow customers to upgrade their devices to 5G while keeping the same hardware design. The incorporation of state-of-the-art positioning accuracy with dual-band L1/L5 high-performance embedded GNSS further enhances their capabilities.

Notably, the new 5G RedCap IoT modules simplify connectivity with an onboard eSIM ready for connectivity activation and NExT connectivity. Additionally, OneEdge and embedded processing capability enabled by AppZone ensure advanced capabilities for device management and processing.

The first-generation 5G RedCap modules come with multiple SKU options, including fully global variants on all form factors, catering to customers’ diverse requirements across the world. The 5G RedCap IoT modules, powered by Snapdragon X35, provide a solution that is not only forward-looking but also capable of adapting to the changing technological landscape. As IoT applications continue to shape industries, these modules empower businesses to embrace innovation and drive progress.

“We are excited to continue our collaboration with industry leaders such as Telit Cinterion to advance ecosystem commercialization of NR-Light globally,” said Preethika Adyanthaya, Director of Product Management, Qualcomm Technologies, Inc. “This announcement showcases the combined strength of Telit Cinterion’s expertise in IoT solutions and Qualcomm Technologies’ leading connectivity technology, enabling a new and wide range of use cases in various product categories.”

“Our collaboration with Qualcomm Technologies represents a significant milestone in our commitment to delivering cutting-edge IoT solutions,” said Marco Contento, VP of Product Management, Mobile Broadband, Telit Cinterion.

“The 5G RedCap modules powered by Snapdragon X35 provide a future-proof evolution path for a wide variety of IoT applications, ensuring our customers are equipped with the latest technology to drive innovation in their respective verticals.”

The post Telit Cinterion Announces First-Generation RedCap Modules Enabled by Snapdragon X35 5G Modem-RF System for Smooth Evolution from LTE to 5G appeared first on IoT Business News.

The MediaTek T750-based 5G module FG360 has enabled seamless connectivity for FWA devices and brought a premium 5G experience for end users worldwide. To even the digital divide at the global scale, Fibocom launched the FG360-MEA 5G module dedicated for the 5G FWA deployment in the Middle East and Africa.

Fibocom announces a regional version of FG360 5G module series, the variant FG360-MEA is designed to support the frequency bands in the Middle East and Africa, allowing telecom operators and device manufacturers to deploy the 5G solution in a fast and cost-effective manner.

Fibocom FG360-MEA is a high-performance Sub-6GHz 5G module tailor-made for the Middle East and Africa market. Incorporating optional 6 or 8 antenna configurations, along with 2 x 2.5G SGMII and 4 x PCIe Gen 3 on the interface settings, allowing customers to apply flexible hardware designs based on the diversified market demands. By leveraging the 2CC CA (Carrier Aggregation) capability with a bandwidth of 200MHz, FG360-MEA delivers an optimal 5G experience with enhanced speed, greater capacity, and reduced network latency for terminals such as CPE, ODU, gateways, routers as well as industrial and medical devices.

“Driven by the exploration of service offerings requiring high bandwidth and low latency and the availability of a wide range of devices at attractive price points. Middle East and North Africa market remains strong growth in 5G subscriptions and forecasts to see these account for 32 percent of the total in 2028, as more countries issue licenses and spectrum to enable 5G network investment.”

According to the Ericsson Mobility Report released in June 2023. By launching the FG360-MEA, Fibocom enriches the 5G module solution with a comprehensive capability to accelerate the commercialization of 5G FWA in the Middle East and Africa markets.

Furthermore, it is worth mentioning that the FG360-MEA module also allows end devices to enjoy dramatically faster wireless connections with the combination of high-speed 5G + Wi-Fi 6 by addressing the configurations of MT7915+MT7975 reaching up to AX1800/AX3600, and the engineering sample of FG360-MEA is now available.

“We are proud to launch the next trailblazing 5G wireless module in the Middle East and Africa region and provide support to innovative Mobile Broadband devices by our market-leading technology experts”, says Lars Thyroff, General Manager of Fibocom Wireless EU GmbH.

“By adopting multiple optimizations on FG360-MEA, the module solution will bring Gigabit wireless experience to both individual and enterprise users in the local market.”

The post Fibocom to Pace Up the 5G FWA in the Middle East and Africa with Newly Launched FG360-MEA, Bringing Experience-first 5G Connectivity appeared first on IoT Business News.

Companies will Showcase the Plug-and-Play Capability for Seamless Real-time Connections across Europe at The Things Conference.

Today, EchoStar Mobile Limited, an EchoStar company, and The Things Industries announced a collaboration to deploy hybrid satellite and LoRa® Internet of Things (IoT) solutions to businesses across Europe.

The companies have incorporated EchoStar’s satellite IoT capabilities into The Things Stack, a reliable, cloud-based LoRaWAN network server, enabling customers to connect IoT devices for real-time, two-way communications over satellite or terrestrial networks using a dual-transport, generic node.

“With plug-and-play simplicity, this collaboration between EchoStar Mobile and The Things Network enables terrestrial and satellite transports to be integrated easily into the same node or module for IoT applications,” said Telemaco Melia, vice president and general manager, EchoStar Mobile.

“It’s a breakthrough that enables cost-effective IoT deployments with seamless coverage so customers can be sure their devices remain connected anytime, anywhere, within the service area – even in the most remote places.”

“LoRa technology has previously been confined by the limits of terrestrial infrastructure. EchoStar’s innovative, integrated approach to satellite connectivity breaks this barrier. Our collaboration provides all the key features of our generic node combined with the wide area reach of the EchoStar network to enable smooth, universal LoRaWAN access, wherever the user may be,” said Wienke Giezeman, CEO, The Things Industries.

The collaboration introduces satellite connectivity to The Things Stack LoRaWAN Network Server and its Generic Node Concept Edition, enabling customers to extend the reach and reliability of their connected IoT devices with one click. With the satellite capability – and a limited-time free trial for each device connected – businesses can effortlessly expand their IoT deployments to remote and challenging locations.

Last year, EchoStar Mobile unveiled its pan-European LoRa-enabled IoT network, which is now delivering bi-directional, real-time LoRa connectivity for customers across Europe. Integration with The Things Stack Cloud propels this offering to a global scale, powering multi-country service continuity for customers in sectors such as utilities, transportation, logistics and agritech.

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• New line of Telit Cinterion 5G data cards and LGA modules will leverage Snapdragon X72 5G Modem-RF System
• These new products target high-performance routers, gateways and CPEs for consumers and enterprises

Telit Cinterion, a global enabler of the intelligent edge, today announced that their next-generation of 5G data cards and LGA modules portfolio will use the Snapdragon® X72 5G Modem-RF System.

This is the latest example of the two companies’ commitment to providing device OEMs with the latest technologies to differentiate and future-ready their consumer and enterprise products.

Snapdragon X72 is part of the world’s first 5G Modem-RF System family ready for 5G Advanced, boosted with AI hardware acceleration to drive the future of 5G in mobile broadband applications. Snapdragon X72 will help Telit Criterion’s customers to differentiate their devices, especially for service providers and end-users that demand products with long lifecycles.

Telit Cinterion will use the Snapdragon X72 for a new portfolio that includes a global M.2 data card and two LGA modules: one for North America and the other for use in Asia-Pacific (APAC), Europe, Middle East and Africa (EMEA) and South America. These new, high-performance modules support 4.4 Gbps peak downloads and 3.5 Gbps peak uploads, making them ideal for bandwidth-intensive applications such as fixed wireless access, mobile broadband, industrial IoT, private 5G and 4K video. Support for OpenWRT allows the new modules to seamlessly provide advanced networking features for a wide range of routers, gateways and CPEs for residential and enterprise use.

The new Telit Cinterion data cards and modules — currently in development — streamline product advancement, making it easier to integrate external peripherals such as Wi-Fi and Ethernet transceivers, without the need for costly adapter components. They also will enable OEMs to run their application software directly on the data card or module, thus eliminating the expense, board space and complexity of an external CPU.

Snapdragon X72 introduces a new modem-RF architecture purpose-built for scalability. The new converged mmWave-sub6 architecture and new mmWave antenna module Qualcomm® QTM565 help reduce hardware footprint, cost, design complexity and power consumption. Additionally, OEMs and Telit Cinterion customers can leverage the Qualcomm® Advanced Modem-RF Software Suite to further improve sustained performance across a wide variety of consumer and enterprise experiences.

“Snapdragon X72 is designed to drive the next phase of 5G evolution enabled by advanced 5G features, which will help Telit Cinterion customers future-ready their devices,” said Anand Venkataraman, Director of Product Management, Qualcomm Technologies, Inc. “We’re excited to continue bringing our connectivity technology to Telit Criterion customers so they can take full advantage of 5G.”

“For over two decades, Telit Cinterion and Qualcomm Technologies have partnered to provide device OEMs with early access to the latest and greatest technologies,” said Marco Contento, VP of Product Management, Mobile Broadband, Telit Cinterion.

“We’re continuing that tradition by making the Snapdragon X72 our foundation for Telit Cinterion’s new portfolio of 5G data cards and LGA modules which will raise the bar for what’s possible and preferable in mobile-powered devices such as routers, gateways and CPEs.”

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A groundbreaking collaboration between LPWAN industry leaders and LoRa Alliance® members Semtech, Actility, Arad, and Deviceroy has the world’s first commercial implementation and successful end-to-end interoperability test for the innovative relay feature utilizing LoRaWAN connectivity.

This cutting-edge advancement enables LoRaWAN packets from remote, isolated or hard to reach devices to be relayed by battery-operated relay nodes. This coverage extension is provided through a low-cost solution further lowering the total cost of ownership (TCO) of the LoRaWAN deployment. The relay feature promises to be a game changer for LoRaWAN-based use cases such as water, gas, and electricity metering, where stringent service level agreements demand cost efficient and unparalleled coverage for all devices within a geographical footprint.

Semtech, a pioneering force in LoRa technology, has seamlessly integrated the relay feature for both end-devices and relay nodes into their latest LoRa Basics Modem v4 stack. This integration fortifies the potential of LoRaWAN to provide low cost, exceptional coverage and connectivity across various applications.

Actility, a trailblazer in IoT connectivity solutions, has integrated the relay feature utilizing LoRaWAN into its renowned ThingPark Wireless and ThingPark Enterprise network platforms in Release 7.3. This inclusion is also available in the free-to-use Community edition of ThingPark, which can be immediately used by developers to test their relay implementations utilizing LoRaWAN. To learn more, visit actility.com/relay.

Deviceroy, a key player in the IoT device industry, plays a pivotal role with Aria Relay, serving as a powerful range extender for LoRaWAN. Aria Relay ensures bidirectional connectivity, enabling data between remote or isolated devices and their destinations to flow reliably, significantly expanding network coverage. To learn more about the Aria Relay, visit deviceroy.com/relay.

The three vendors – Semtech, Actility, and Deviceroy – have successfully completed interoperability testing and achieved reliable end-to-end bidirectional communication with devices that can connect only through a LoRaWAN-based relay. This achievement underscores the reliability and seamlessness of the relay feature in real-world scenarios.

Arad, a visionary in water metering solutions, is poised to deploy the relay feature utilizing LoRaWAN within its water meter networks. This implementation has the potential to revolutionize utility management, offering unparalleled connectivity in even the most challenging environments.

The introduction of the relay feature utilizing LoRaWAN signals a new era in IoT connectivity, reshaping the possibilities for a more connected future across industries by enabling customers to add battery-operated, easy-to-deploy relay nodes that act as network extenders. These relay nodes can be placed in remote locations or in areas where signal strength is weak due to extreme distances or circumstances, effectively extending the range of existing gateway(s) and networks using LoRaWAN connectivity.

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With new capabilities available in Wiliot’s ambient IoT Visibility Platform, companies can now continuously monitor the humidity of products — as well as temperature, location, and carbon footprint — to reduce waste and enhance quality, freshness, safety, and sustainability across the supply chain.

Wiliot, the Internet of Things pioneer whose ambient IoT Visibility Platform is enabling trillions of “things” to gain intelligence, today announced it has achieved the breakthrough ability to sense and analyze humidity levels of individual products, in real-time, throughout the supply chain.

By adding humidity sensing to the company’s Visibility Platform — on top of Wiliot’s existing temperature, location, and carbon emissions sensing capabilities — Wiliot has made it possible for companies to better ensure the safety, integrity, freshness, and sustainability of moisture-sensitive products – end-to-end and at unprecedented scale.

Wiliot’s ability to enable continuous monitoring down to the product level is unlike any traceability technology available today.

“This is a game-changing technology achievement for supply chain visibility,” said Wiliot VP of Data Products & Algorithms, Thaddeus Segura.

“By adding humidity sensing to the Wiliot Visibility Platform, we are transforming the handling of products we all consume and depend on. Now companies can deliver impeccable quality to their customers while promoting sustainability and responsible resource utilization.”

The Wiliot Visibility Platform connects the digital and physical worlds through the Wiliot Cloud and Wiliot IoT Pixels, which are low-cost, self-powered, mass-manufactured postage stamp-sized compute devices affixed to products and packaging.

IoT Pixels continuously and automatically transmit data to the Wiliot Cloud via standard Bluetooth devices, greatly reducing the staffing and operational cost of traditional tracking methodologies, while also reducing error rates, waste, mis-shipments, mis-picks and out-of-stocks.

By using the latest technology to efficiently connect any item to the internet and embedding it with intelligence and awareness, companies can create more efficient, profitable, and sustainable supply chains.

With this latest launch, Wiliot engineers have now introduced to IoT Pixels a tiny membrane that detects humidity in the air. When an IoT Pixel is exposed to different humidity levels, the information is relayed wirelessly to the Wiliot Cloud. In the cloud, this humidity data is combined with temperature and location data to generate insights and timely alerts for staff that can better optimize supply chain operations.

“Based on this new humidity data, companies can now track, in real-time, the relative impact of environmental conditions on moisture-sensitive products – to improve their freshness, quality, safety, and integrity,” Segura continued. “Food retailers can apply freshness insights to their operations to ensure the freshest, ripest products are sold first, while healthcare companies can monitor the safe handling and storage of medicines and health commodities. The Wiliot Visibility Platform gives businesses an entirely new level of insight into their supply chains.”

Products, from produce to pharmaceuticals, have different humidity handling requirements. The Wiliot Visibility Platform helps ensure compliance from producer to distributor to retailer to pharmacy, delivering significant benefits for companies and consumers. Produce stays fresher longer, reducing the amount wasted due to rot and spoil; medicines, which must be stored at specific temperatures and humidity levels, stay safe; and vaccines, which require precise handling and environmental conditions to deliver their intended health benefits, remain effective.

“Wiliot, and the ambient IoT, are changing the way the world operates – helping businesses transition to fully automated, completely transparent, and increasingly sustainable supply chains,” concluded Segura. “Now, with humidity sensing added to our platform, we’re establishing a new baseline for product freshness, quality, and safety – which will pay significant dividends for businesses and consumers alike.”

Wiliot is currently working with many of the world’s largest companies across retail, logistics, apparel, CPG, and pharmaceuticals on a variety of ambient IoT projects.

The post Wiliot Introduces Real-Time Humidity Sensing to its Ambient IoT Visibility Platform for Unprecedented Visibility into Supply Chains appeared first on IoT Business News.

Quectel Wireless Solutions, a global IoT solutions provider, is pleased to announce the North America version of its ground-breaking LTE Cat 1 bis module, the EG800Q-NA, powered by the Qualcomm® QCX216 LTE IoT modem from Qualcomm Technologies, Inc.

With its remarkably small form factor, this ground-breaking module is poised to completely transform the IoT industry in the North American market as its wide range of versatile applications and unparalleled connectivity capabilities are set to redefine the landscape.

The module delivers a maximum downlink data rate of 10Mbps and an uplink rate of 5Mbps, critical for a variety of high-performing IoT applications including smart utility meters, asset trackers, e-mobility, parking meters, and home automation. The EG800Q-NA’s support of Cat 1 bis allows it to use a single antenna, balancing cost and performance and making the module an ideal solution for IoT terminals that are designed to be compact and cost-effective.

One of the standout features of the EG800Q-NA is its comprehensive support for North American bands, empowering businesses and developers to create IoT solutions that seamlessly communicate across diverse networks, ensuring a streamlined and efficient user experience. Certification is in process for the leading US operators, underscoring the module’s efficacy for the North American market and certification is underway for the FCC, IC, GCF and PTRCB.

“We’re thrilled to introduce the EG800Q-NA module to our customers in North America,” stated Norbert Muhrer, President and CSO, Quectel Wireless Solutions.

“As one of the pioneering modules built upon the Qualcomm QCX216 LTE IoT Modem, it perfectly caters to a wide range of mid-range applications and deployment scenarios where dependable and economical communication solutions are essential.”

The Quectel EG800Q-NA redefines compactness, measuring at an astonishingly small size of just 17.7mm x 15.8mm x 2.4mm. Its compact form factor, extensive network compatibility, and adaptable regional capabilities position it at the forefront of the industry. An array of robust Internet protocols and industry-standard interfaces including USB 2.0, UART, I2C, PCM, and USIM further enhance its versatility across various IoT applications like asset management, remotely managed access control (RMAC), and smart grid solutions. Notably, the module supports Dynamic Firmware Over-The-Air (DFOTA) functionality, enabling seamless automatic firmware updates, alongside Wi-Fi scan positioning technology.

In addition to its remarkable individual capabilities, the Quectel EG800Q-NA is part of a dynamic series of products that cater to multiple regions. The EG800Q series encompasses a range of modules, each tailored to meet the unique connectivity needs of various global markets.

In order to streamline customer designs, Quectel also offers an array of high-performance antennas that significantly amplify wireless connectivity. This empowers IoT developers to seamlessly bundle the EG800Q-NA module with Quectel antennas and leverage their pre-certification services, ultimately curtailing costs and expediting the time-to-market for their Cat 1 devices.

The post Introducing the Quectel EG800Q-NA: Unleashing Connectivity for the North American Market appeared first on IoT Business News.

• WE310K6 module features the Realtek RTL8852BE chipset, 802.11 a/b/g/n/ac/ax, Bluetooth and Bluetooth Low Energy 5.2 for low power and high performance
• IEEE 802.11, Bluetooth SIG and Wi-Fi Alliance certifications eliminate the time and expense of developing and launching connected devices for consumer, medical, industrial and smart city applications

Telit Cinterion, a global enabler of the intelligent edge, today announced the WE310K6, a fully integrated, low-power module featuring dual-band, dual-stream Wi-Fi and dual-mode Bluetooth/ Bluetooth Low Energy.

The WE310K6 enables device OEMs to add high-speed wireless connectivity quickly and cost-effectively to their products — even when they have limited Bluetooth and Wi-Fi expertise.

The WE310K6 supports 802.11 a/b/g/n/ac/ax, classic Bluetooth and Bluetooth Low Energy 5.2, giving OEMs the flexibility to design products that can connect to other local devices or to the internet over Wi-Fi. The module is ideal for a wide variety of consumer and business applications, including:

• Smart home: home automation, appliances, home security and alarms, smart lighting, and IP cameras and speakers
• Health care and medical: remote patient monitoring, medical wearables, and health care and wellness devices
• Industrial and commercial: energy management, robotics, and industrial and building automation
• Other applications: aftermarket OEM telematics, fleet management, smart cities and parking, printers, asset management, pet and animal trackers, and more

The Realtek RTL8822BE-CG is a highly integrated single-chip that supports 2-stream 802.11ac solutions with Multi-user MIMO (Multiple-Input, Multiple-Output) and Wireless LAN (WLAN) PCI Express network interface controller and integrated Bluetooth 2.1/3.0/4.2 USB interface controller. It combines a WLAN MAC, a 2T2R capable WLAN baseband, and RF in a single chip. The RTL8822BE-CG provides a complete solution for a high-performance integrated wireless and Bluetooth device.

The WE310K6 also has IEEE 802.11 and Bluetooth SIG certifications and complies with Wi-Fi Alliance and Bluetooth SIG-v5.2 requirements. OEMs can get new products to market faster by reducing RF design time and removing the burden of testing and certification. The module’s other key features and benefits include:

• Two form factor options: LGA package or on top of an M.2 Key E carrier board
• Host-activated Wi-Fi and Bluetooth radios
• Dual-stream spatial multiplexing up to 1201 Mbps
• MU-MIMO technology
• Bluetooth Low Energy AUDIO Isochronous Channel (CIS) support
• Compatible with Wi-Fi 802.11 e, h, k and i
• Advanced security (including WPA3) with integrated crypto hardware
• Industrial-grade temperature range (-40 °C to +85 °C) to ensure reliability even in demanding environments

“We are thrilled to collaborate with Telit Cinterion and offer our latest generation Wi-Fi 6 solutions,” said Yee-Wei Huang, Realtek’s Vice President and Spokesman. “The collaboration yields a feature-rich platform with the latest cutting-edge technologies.”

“Wi-Fi 6 and Bluetooth Low Energy are rapidly becoming must-have features for consumer, enterprise, medical and industrial devices, but OEMs often face challenges in adding those technologies to their products,” said Marco Argenton, VP of Product Management for IoT Modules, Telit Cinterion.

“Our new WE310K6 enables them to add low-power quickly and cost-effectively, high-performance connectivity even when they have only limited RF design expertise. That means faster time to market and time to revenue and gives their customers peace of mind that the devices will work flawlessly from day one.”

The post New Telit Cinterion Wi-Fi 6/ Bluetooth® Low Energy Module Enables Rapid Development and Time to Market for Smart Devices appeared first on IoT Business News.

• Fear of vendor lock-in is one of the biggest barriers to starting or expanding IoT projects, and that’s why 1NCE gives customers peace of mind to make future changes during the lifetime of their devices
• With the new Freedom to Switch feature, 1NCE customers can add or switch connectivity providers without truck-roll or termination fees
• All new industrial IoT SIM cards and chips include Freedom to Switch as part of 1NCE’s $10 for 10 years lifetime service for software and connectivity

1NCE, an IoT software and connectivity company available in 158 countries, today announced the launch of Freedom to Switch – the company’s future-proof answer to the vendor lock-in issues that plague the IoT industry.

1NCE embraces open standards as a part of the company’s core principles. At no additional cost, the company’s new Freedom to Switch feature offers customers peace of mind to make future changes during the lifetime of their devices. The company’s new industrial SIM cards and chips include eUICC technology that ensures 1NCE customers are prepared for any eventuality. Customers can now add or switch to another connectivity provider without having to touch their device – avoiding the costly expense of truck roll and field service.

Ivo Rook, Chief Operating Officer at 1NCE, said:

“In IoT, scopes change and data insights evolve, so customers should always have the freedom to switch. 1NCE thinks it should be a fundamental right for customers to add or change a provider over the lifetime of an IoT project – even if that means leaving us.”

Also new for 1NCE customers is the ability to create test profiles, which help optimize the supply chain by testing connectivity during manufacturing. The test profile is a unique type of operator profile that’s designed specifically for end-of-line tests. Without changing the SIM, customers can use AT commands to switch from the 1NCE profile to the test profile, perform necessary tests with a network emulator, then switch back before shipping the device. This allows function tests even in regions where 1NCE is not available.

The 1NCE Lifetime Flat subscription is industry-disruptive but simple: customers can deploy, connect, and manage IoT sensors across the world for as little as a dollar per year per device. Complimentary to all Lifetime Flat customers, 1NCE OS is enterprise-grade software that supports IoT projects of any scale, for new and existing projects alike. Using 1NCE OS for device and cloud integration, customers can accelerate time-to-market for IoT projects by months. It also features advanced remote access to device states and telemetry, device location without GPS and optimized payload transmission to increase battery life by up to 70 percent.

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