Following the news that MediaTek and Meta Reality Labs have announced an exclusive partnership to develop custom chips for augmented reality (AR) glasses; Anisha Bhatia, Senior Analyst at GlobalData, a leading data and analytics company, comments:

“Meta and MediaTek’s partnership on co-developing augmented reality (AR) chipsets is a shot in the arm for the AR segment, showing the vital strategic position of AR in Meta’s path ahead. This is Meta’s second big collaboration with MediaTek, after the August 2023 announcement that Meta’s Llama 2-based AI Large Language Models (LLM) will be used in MediaTek’s processors for on-device AI.”

“Meta is bullish on AR, and smart glasses are widely expected to be the next frontier in tech hardware. Working with MediaTek will provide Meta with more control over implementing its AR vision using MediaTek’s silicon versus using chipset giant Qualcomm’s silicon. Meta has tried creating its own mixed reality (XR) system on chips (SoCs) in recent times, without much success, and is rightfully leaving hardware design to the experts.”

“Meta has been working with Qualcomm on all things XR. The entry of MediaTek, one of the foremost chipset companies and a major Qualcomm rival, brings more competition to this segment. Combined with the hoopla around Apple’s Vision Pro AR headset, added rivalry in AR hardware will move the industry forward, which is what this sector needs.”

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MediaTek debuts RedCap modem technology and chipset family to expedite the transition to 5G-NR for consumer, enterprise, and industrial IoT applications.

Leveraging its industry expertise in 5G connectivity, MediaTek announced it is expanding its family of modems and chipsets to support 5G RedCap.

The new solutions, the M60 modem IP and the MediaTek T300 chipset series, will make it easy for MediaTek to facilitate the transition to 5G-NR for a wide range of applications that require long lasting and efficient battery life, such as wearables, light-weight AR devices, IoT modules, and devices built with edge AI in mind.

RedCap, which stands for “reduced capability,” is designed to bring the benefits of 5G to NR consumer, enterprise, and industrial devices. Taking full advantage of the evolution of 5G networks to the Standalone (SA) network architecture, RedCap promises to deliver reliability for devices that have low bandwidth requirements, offering many of the benefits of 5G without the cost and complexity of typical 5G solutions.

“Our RedCap solutions are a significant part of our mission to democratize 5G, providing our customers the ability to optimize components and deliver 5G-enabled devices from a range of applications and a range of price points,” said JC Hsu, Corporate Senior Vice President at MediaTek.

“The migration to 5G RedCap will replace legacy 4G/LTE solutions, offering significantly better power efficiency and more reliable user experiences compared to leading edge 5G eMMB modem solutions and legacy 4G LTE Cat 4 and Cat 6 devices.”

As the world’s first 6nm Radio Frequency System-On-Chip (RFSOC) single die solution for RedCap, the MediaTek T300 series is breaking new ground in the RedCap space. This RFSOC will allow brands to capitalize on the emerging RedCap market and create innovative designs for enterprise, industrial, consumer, AR, and data-card applications. Built on the highly efficient TSMC 6nm process, the MediaTek T300 series integrates a single-core Arm Cortex-A35 in a significantly more compact PCB area. The MediaTek T300 series supports up to 227 Mbps downlink and 122 Mbps uplink data rates.

Both the T300 series and the M60 5G modem IP support the 3GPP R17 standard and combine MediaTek’s industry-leading power efficiency with coverage enhancements and extremely low latency. By leveraging MediaTek’s UltraSave 4.0 technology and reducing unnecessary paging receptions, the M60 offers up to a 70% reduction in power consumption compared to similar 5G eMBB solutions and up to 75% power savings compared to 4G LTE solutions.

MediaTek’s RedCap solutions are driving a new wave of efficiency, reliability, and cost-savings for 5G-enabled devices across the consumer, enterprise, and industrial sectors to meet ever-evolving connectivity requirements and expectations. The MediaTek T300 series devices will sample in the first half of 2024, with commercial samples in the second half of 2024.

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Fibocom FWA-dedicated 5G module FG370, based on MediaTek’s T830 chipset platform, is designed to empower the FWA devices with enhanced speed performance and optimized reference design. With mass production availability, it is now capable of accelerating the implementation of 5G technologies worldwide.

Fibocom Wireless Inc., a global leading provider of IoT (Internet of Things) wireless solutions and wireless communication modules, in cooperation with MediaTek Inc., the leading global fabless chipmaker, to launch the “Fast-to-deploy” one-stop solution for FWA based on the 5G Sub-6GHz module FG370 at MWC Barcelona 2023.

The innovative “Fast-to-deploy” 5G FWA solution includes the reference designs of two forms of FWA devices, CPE and MiFi, integrating with Fibocom 5G Sub-6GHz module FG370, significantly simplifying the hardware design of FWA devices and reducing the time to market. Leveraging multiple key features of the latest advanced Wi-Fi 7 technology, the CPE supports tri-band Wi-Fi 7 solution delivers a high throughput and seamless in-home connectivity, while the MiFi supports dual-band Wi-Fi 7 solution brings a reliable and stable network connectivity for mobile hotspot users.

It is worth mentioning that the FG370 was firstly-introduced to the market in October 2022, certified by GCF and CE in early January 2023, now it is ready for mass production. By utilizing the powerful quad-core Arm Cortex-A55 CPU on MediaTek’s T830, FG370 supports 4CC CA (Carrier Aggregation) and up to 300MHz of spectrum, as well as 2CC CA and up to 200MHz of spectrum, significantly improves the utilization of spectrum resources and ensures an extended 5G coverage. In addition to new features such as 8RX (Receive Antennas) and Power Class 1.5 (PC1.5) High Power User Equipment (HPUE), FG370 module is capable of delivering maximum 7.01Gbps on the downlink and 2.5Gbps on the uplink.

“I am very pleased that Fibocom’s FG370 5G module has achieved market-entry certifications such as GCF and CE in a short time,” said Evan Su, General Manager of Wireless CommunicationsⅡ, MediaTek. “During the MWC Barcelona 2023, we jointly released the “Fast-to-Deploy” 5G FWA solution based on Fibocom FG370, it will help CPE and Mobile hotpot customers to implement the migration from previous generation to the newest platform in a very short term, bringing ultra-fast gigabit experience. In the future, we will expand our cooperation in product development, industry solutions and more, empowering the future with our 5G innovations.”

“The advent of 5G has bolstered the use of FWA solutions, huge opportunities come with challenges, the utilization of 5G spectrum, the complexity in device design, and the reliability of network connection are the obstacles of FWA roll-out,” said Simon Tao, General Manager of MBB Product Management Dept., Fibocom.

“By working closely with MediaTek, we have achieved several product milestones ahead of the market. We believed that by launching the reference design for both CPE and MiFi, FWA customers worldwide can upgrade to the latest 5G solution smoothly and easily, significantly reduce the time to market and maximize the ROI.”

Fibocom will dive deep into the cooperation with MediaTek to launch the mmWave version of FG370 and to introduce the storage separation capability to the module in future generations.

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With MediaTek’s 3GPP NTN-standard modem and Skylo’s NTN service, smartphone and IoT manufacturers are able to develop new devices, sensors, and wearables with in-built satellite connectivity.

Skylo, a Non-Terrestrial Network (NTN) service operator connecting anything, anywhere, today announced its on-going partnership with MediaTek, a leading global chipset manufacturer.

With MediaTek’s 3GPP NTN-standard modem and Skylo’s NTN service, smartphone and IoT manufacturers are able to develop new devices, sensors, and wearables with in-built satellite connectivity. This allows OEMs to offer connectivity experiences that weren’t possible before, such as being able to text without any gaps or loss in coverage resulting in deeper customer relationships.

MediaTek’s chipsets power over two billion new consumer and enterprise products each year, and lead the industry with integration, connection, and power-efficiency. For those device manufacturers who need a viable chipset solution with 3GPP NTN-capabilities, MediaTek currently has that capability, making it possible to integrate cellular and satellite connectivity into the same device. Further, Skylo’s NTN service is also commercially available today and has done extensive stress testing with MediaTek’s 3GPP NTN chipset to ensure always-on availability when the user has access to the open sky.

Cliff Lin, Assistant General Manager of MediaTek, said:

“The use cases for satellite connectivity based on 3GPP NTN standard are profound, and we have just scratched the tip of the iceberg as satellite and cellular converge for the first time. Our technology provides users with a tested, viable, and consistent opportunity to contact loved ones and emergency services from remote areas.”

“We will continue to work with Skylo to ensure that the chipsets we manufacture are compliant with industry standards and work on its commercial-ready and capable satellite network.”

“MediaTek’s 3GPP standards-based chipset with NTN is a major milestone in bringing ubiquitous connectivity to smartphones and subscribers across the globe,” said Dr. Andrew Nuttall, Chief Technology Officer for Skylo. “We’re honored to support MediaTek and deliver a service to their OEM customers.”

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MediaTek and Skyworks Develop 5G New Radio Design Enabling Seamless Integration With Automotive Communications Systems.

Skyworks Solutions, Inc. today announced that the company has engaged with MediaTek to offer a complete modem-to-antenna automotive-grade 5G solution.

This 5G New Radio Sky5A RF front-end solution will accelerate the deployment of this cutting-edge protocol across an array of automotive OEM and consumer service offerings.

“The rollout of 5G is reshaping the automotive market with a variety of safety and entertainment telematics applications to improve the driving experience,” said Martin Lin, deputy general manager of the Wireless Communications Business Unit at MediaTek. “Through this collaboration with Skyworks, MediaTek is providing OEMs and automotive customers a complete solution that offers high performance, reliability and flexibility to meet the growing demands for bandwidth and advanced connectivity in next-generation vehicles.”

As automotive OEMs create entirely new vehicle platforms with cutting-edge processing and sensing capabilities to support advancements in electric vehicle (EV) technology, driver-assistance systems (ADAS), and artificial intelligence, they are looking for solutions that can support the expanded data and connectivity demands of these next-generation innovations.

“This strategic initiative allows Skyworks and MediaTek to address the stringent requirements of the global automotive industry,” said John O’Neill, vice president of marketing at Skyworks.

“Our combined engineering expertise enables our customers to innovate new vehicle communication architectures, with the confidence that their designs will continue to meet future bandwidth needs and the rapid evolution of global wireless networks.”

The 5G NR Sky5A RF front-end complete solution was designed for automotive applications, supporting 3GPP R15 and R16 standards, bandwidth exceeding 100MHz, flexible antenna architectures, regional optimization, aux ports to support the addition of future bands, and full automotive grade reliability qualification.

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With the MediaTek Genio platform stack, designers and OEMs can bring differentiated and secure intelligent devices to market faster.

MediaTek today unveiled its new Genio platform for AIoT devices and introduced the first chip in the Genio family, the Genio 1200 designed for premium AIoT products.

MediaTek Genio is a complete platform stack for the AIoT with powerful and ultra- efficient chipsets, open platform software development kits (SDKs) and a developer portal with comprehensive resources and tools. This all-in-one platform makes it easy for brands to develop innovative consumer , enterprise and industrial smart applications at the premium, mid-range and entry levels, and bring these devices to market faster.

With MediaTek Genio, customers have access to all the hardware, software and resources needed to go from concept to design and manufacturing. Customers can choose from a range of Genio chips to suit their product needs, and then use MediaTek’s developer resources and the Yocto Linux open platform SDK to customize their designs. MediaTek also makes it easy for customers to access its partners’ system hardware and software, and leverage partners’ networks and sales channels. By offering an integrated, easy-to-use platform, MediaTek Genio reduces development costs and speeds up time to market, while providing long-term support for operating system updates and security patches that extend the product lifecycle.

Jerry Yu, MediaTek Corporate Senior Vice President and General Manager of MediaTek’s Computing, Connectivity and Metaverse Business Group, said:

“Today MediaTek powers the most popular AIoT devices on the market. As the industry enters the next era of innovation, MediaTek’s Genio platform delivers flexibility, scalability and development support brands need to cater to the latest market demands.”

“We look forward to seeing the new user experiences brands bring to life with the Genio 1200 and its powerful AI capability, support for 4K displays and advanced imaging features.”

Open Platform AIoT SDK

The Genio open platform AIoT SDK allows designers to customize multiple products with the same software pack, which supports Yocto Linux. By streamlining the writing and coding of each software application layer, customers can develop their products with minimal support – regardless of the type of application.

Developer Resources and Partner Ecosystem

MediaTek’s Genio developer portal gives customers access to a wide range of developer tools, along with access to partners’ system hardware and software. Furthermore, brands can use the portal to take advantage of partners’ networks and sales channels. This range of development tools and partner support makes it easy for brands of all sizes to streamline the design of AIoT products and speed up time-to-market.

High-Performance Chipsets

The MediaTek Genio chipsets offer fast multicore performance with extreme power-efficiency, optimizing the user experience for even the most compute-intensive AI applications. The CPU, GPU and AI Processing Unit (APU) in each Genio chipset work together to enhance intelligent autonomous capabilities at the edge and support high quality displays, cameras and more. Additionally, each chipset offers support for the latest Wi-Fi and Bluetooth protocols to deliver seamless connectivity.

The Genio series includes premium, mid-tier and entry-level system-on-chips (SoCs) and modules to address different market and application needs such as:

• Genio 1200 for premium AIoT applications that need best-in-class performance, support for the latest multimedia standards and 4K displays, 4.8 TOPs AI accelerator, and exceptional power efficiency.
• Genio 500 for retail and commercial IoT applications that require high performance edge processing and advanced multimedia capabilities.
• Genio 350 for hubs in portable and home environments that require lighter vision and voice edge processing.
• Genio 130 for thin-OS and cloud-supported voice assistant devices that require an audio and microphone-orientated platform.

With a highly capable octa-core CPU, five-core graphics, dual-core AI processor and advanced multimedia engines, the Genio 1200 is ideal for advanced smart home appliances, industrial IoT applications and other demanding AI-embedded devices. The Genio 1200 can also receive and process ultra-high definition display and camera inputs from a range of computer vision (CV) applications.

The new Genio 1200 combines best-in-class performance, support for the latest multimedia standards and 4K displays, and exceptional power efficiency in a 6nm-class chip. This highly integrated, powerful and extendable platform supports several high-speed interfaces, such as PCI-Express, USB 3.1 and GbE MAC, and also supports MediaTek Wi-Fi 6E and sub-6 5G modules to meet a wide range of connectivity needs.

The Genio 1200 will be commercially available starting in H2 2022.

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Introducing the Single-mode MT2625 and Dual-mode MT2621 SoC Solutions with R11 Support for Industrial and Consumer IoT Applications.

MediaTek recently announced it has completed the NarrowBand IoT Release 14 (NB-IoT R14) rate enhancement tests in collaboration with China Mobile to become the first chip maker to pass the test.

A development board based on the MediaTek MT2625 System-on-Chip (SoC) solution was used to achieve the upload rate of 150kbps and download rate of 100kbps. At a data rate of 4~6 times over the R13 standard, R14 is sufficient for applications in remote meter reading, over-the-air firmware upgrade (FOTA), and voice over massage etc. NB-IoT R14 will open up new markets in the IoT industry.

With the growing Internet-of-Things (IoT) market and services, the peak up/downlink speeds of the R13 standard can no longer keep up with application demands. As a result, the NB-IoT R14 evolution introduces the larger maxium 2536bits TBS and 2 HARQ processes to achieve over 100kbps peak uplink and downlink speeds promising GPRS bandwidth levels for remote upgrades and low power wide area (LPWA) situations with higher bandwidth and latency requirements in NB-IoT applications. At the same time, the NB-IoT R14 standard has also been enhanced in terms of mobility, positioning, multicasting, and multi-carrier techniques to provide better standards and technical support for the IoT industry and market applications.

Jerry Yu, MediaTek Vice President and General Manager of the Intelligent Devices business unit, said:

“MediaTek is very pleased to be the first chip maker to pass the China Mobile NB-IoT R14 interoperability tests.”

“MediaTek is a key player in the development of the IoT standard and we are also actively developing the technology along with the industry. Currently, we have two R14-ready chips available: the single-mode MT2625 and the GSM+NB-IoT dual-mode MT2621 SoC solutions. These two chipsets will be widely used in the industrial and consumer IoT markets to usher-in the influx of the IoT era.”

MediaTek and China Mobile are working closely together on bringing IoT applications to the market. In June of this year, they launched the world’s smallest (16mm x 18mm) NB-IoT module based on the MT2625 chipset to help manufacturers quickly and easily develop new IoT devices. Within the year, the two companies started collaborating on the NB-IoT R14 interoperability tests. The development of IoT requires active cooperation on both the network side and the chipset manufacturer to ensure a quality user experience from IoT devices. In the future, both companies will expand the collaborative efforts in a variety of real-world applications to jointly promote the development of all things IoT.

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Alibaba Launches IoT protocol for Tmall Genie-controlled Smart Home Ecosystem.

Alibaba A.I. Labs, which leads the development of Alibaba’s consumer artificial intelligent (AI) products, and MediaTek, a global fabless semiconductor company, today announced a strategic collaboration in Internet of Things (IoT) initiatives including smart home protocols, customized IoT chips and AI smart hardware, with the aim of fostering the development of a connected world in the IoT era.

The two parties also announced the first Smartmesh connectivity solution in China that supports the latest many-to-many Bluetooth mesh technology, in an effort to speed up the adoption of this technology in smart home settings.

The solution, which is based on the Labs’ self-developed IoT protocol named IoTConnect and the Bluetooth chip co-developed by both parties, enables smart home devices to automatically pair with Tmall Genie, the Lab’s first voice-controlled smart assistant, leading up to a Tmall Genie-controlled smart home ecosystem.

Miffy Chan, Head of Alibaba A.I. Labs, commented:
“We are excited about partnering with MediaTek to explore collaboration in the IoT ecosystem. Our AI and cloud computing capabilities, along with MediaTek’s cutting-edge technology in chip design, provide unique advantages to our connectivity solutions for smart homes, offering real benefits to consumers in China and paving the way to a more connected world through innovation.”

Jerry Yu, Corporate Vice President and General Manager of the Home Entertainment Business Group, MediaTek said:

“MediaTek is thrilled to partner with Alibaba A.I. Labs in building up a voice-controlled smart home ecosystem. This follows our collaboration in delivering the great success of Tmall Genie X1.”

“The smart home market is undergoing tremendous growth as technologies advance. With MediaTek’s strength in connectivity and baseband, computing and multimedia, coupled with Alibaba’s leading advantages in cloud computing and AI, we are confident that the collaboration will mark a milestone in the development of the IoT era,” Yu added.

The partnership comes on the heels of the successful collaboration on Tmall Genie, for which MediaTech provides chip technology support. Alibaba A.I. Labs launched the smart home assistant in July last year, with an aim to provide brand new interaction experiences for Chinese consumers. Over one million Tmall Genie devices were sold in China during Alibaba’s Global Shopping Festival on November 11 last year.

IoTConnect is an open connectivity protocol based on Bluetooth mesh standard for smart hardware and smart home appliance manufacturers. Smart devices using the protocol can be automatically paired with Tmall Genie. The protocol aims to promote unified connectivity standards among smart devices, and hence lower the cost in developing connected devices and foster the development of voice-controlled smart home ecosystem.

The Smartmesh solution supports the latest Bluetooth mesh networking and Bluetooth 5 functionality set up by the Bluetooth Special Interest Group (SIG), the body that oversees the development of Bluetooth standards. Customized Bluetooth SoCs (system-on-chip) – MT7581 and MT7583 – for the solution are featured with Bluetooth smart mesh technology, automatic pairing, fast connection and low-power consumption. The two SoCs will be ready for the market in the second half of this year.

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Highly power efficient SoC designed with NB-IoT and GSM/GPRS Connectivity.

MediaTek has announced its newest chipset, MT2621, the industry’s first dual-mode System-on-Chip (SoC) designed for Internet of Things (IoT) applications with both narrow band IoT (NB-IoT) Release 14 (R14) and GSM/GPRS connectivity.

The highly power efficient MT2621 chipset brings dual-mode cellular technologies for IoT, and ensures lowest power consumption. It best supports the developments of a broad range of connected devices including fitness trackers and other wearables, IoT security sensors, smart meters and various industrial applications.

MT2621 features a highly integrated design with a complete connectivity platform that allows it to work with current GSM/GPRS as well as NB-IoT networks for excellent IoT coverage and phone call capability. The advanced connectivity features built into the MT2621 chipset meet the needs of cellular network infrastructure both GSM and future NB-IoT, which is set to fuel the next chapter of growth for the IoT market.

The new MT2621 requires only a single SIM and antenna to cover both cellular networks, with dual standby functionality (SSDS). This allows a single UICC and mobile number for both networks, even while operating simultaneously, resulting in a cost-efficient, simplified design that enables manufacturers to bring their devices to market faster. The chipset integrates a wideband front-end module that provides support for all ultra-low, low and mid bands across the globe.

At its core, the MT2621 is powered by an efficient Armv7 MCU paired with internal Flash and PSRAM. The chipset supports sight and sound interfaces for peripherals, and comes with built-in Bluetooth 4.2 for connecting to other devices nearby.

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New highly integrated and ultra-low-power MT2625 SoC supports a full range of global network connectivity standards to further the advancement of NB-IoT commercial applications.

MediaTek Inc. today unveiled its first narrow band Internet of Things (NB-IoT) System-on-Chip (SoC), the MT2625, and announced a collaboration with China Mobile to build the world’s smallest NB-IoT module (16mm X 18mm) around the chipset.

MediaTek’s new ultra-low-power MT2625 SoC supports a full frequency band (from 450MHz to 1.2GHz) of 3GPP R13 (NB1) and R14 (NB2) standards for a wide range of IoT applications including smart home control, logistics tracking and smart meters.

Since existing cellular networks like 2G, 3G and 4G do not have the capacity to meet the needs of billions of IoT devices, Low-Power Wide-Area (LPWA) networking was developed to accommodate the increased connectivity needs across the globe. MediaTek has been a key player driving the formulation and implementation of the 3GPP LPWA specification for NB-IoT, which is designed to support large-scale connectivity, reduce equipment complexity and minimize power consumption to prolong battery life for years.

“LPWA has the power to truly unleash the potential of the IoT, representing a huge market opportunity,” said Jerry Yu, MediaTek Corporate Vice President and General Manager of the Home Entertainment Business Group.

“MediaTek was the first in the industry to support the full frequency band of 3GPP NB-IoT standards, and we are committed to continuing to invest in NB-IoT technology to meet the global market demand.”

“By providing highly integrated, low power and robust connectivity technologies over the years, along with full-featured IoT software and hardware development platforms, MediaTek aims to enable developers and device makers of all sizes to quickly bring to market innovative NB-IoT devices.”

MT2625 is MediaTek’s first NB-IoT chipset built to meet the requirements of cost-sensitive and small IoT devices. The highly integrated MT2625 combines an ARM® Cortex®-M microcontroller (MCU), pseudo-static RAM (PSRAM), flash memory and power management unit (PMU) into a small package to lower the cost of production while also speeding up time-to-market. The chip leverages MediaTek’s advanced power consumption technology to enable IoT devices to work with chargeable batteries for years.

Committed to taking advantage of the huge growth opportunity in China, MediaTek and China Mobile have collaborated to build the industry’s smallest NB-IoT module based on MediaTek’s MT2625 SoC. The module integrates with China Mobile’s eSIM card and supports OneNET, China Mobile’s IoT open platform, which makes it easy for device makers to quickly develop and bring to market innovative NB-IoT devices.

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Collaboration removes end-user subscription barriers and eases professional object makers’ development and operational efforts.

MediaTek and Orange today announced a new collaboration to market IoT tailored offerings embedding ready-to-use cellular connectivity to address the growing industrial demand for connected objects. The agreement will address professional developers and manufacturers of IoT devices including consumer electronics products.

The ‘IoT Booster Programme‘ aims to market a family of MediaTek chipsets with an Orange SIM Card or integrated with the Orange SIM Card in partner’s modules. The offering will include the price of connectivity structured for IoT needs. This ready-to-use IoT offer allows professional developers to accelerate deployment of their connected objects onto the cellular network by removing the need to seek out complex arrangements for chipset and connectivity separately. The IoT Booster Programme is suitable for any large scale industrials looking to simplify their connectivity, as well as for start-ups seeking “out of the box” IoT connectivity for their product line. Cellular connectivity of these chipsets are designed for longevity, with up to 5 years included at a fixed price.

This collaboration by MediaTek and Orange aims to help electronic manufacturers easily bring more connected objects to market. The programme is expected to be enriched progressively with value added services such as geo-location, device management, data management and other IoT innovative features.

Connected objects using this new offer will operate seamlessly across the Orange network and all of its roaming partners in more than 200 countries. Professional developers and object makers can now design and produce – at a large scale – low power, miniaturized and cost effective devices able to connect indoor or outdoor without post-sale subscription efforts.

JC Hsu, MediaTek’s Corporate Vice President and General Manager of the IoT business unit, said:

“This initiative removes a major hurdle for wider adoption of everywhere connected objects. Now cellular connected devices can be instantly activated like any other connectivity technology, and used practically on a global scale.”

“This partnership gives our customers access to the high quality of Orange services, its vast networks and roaming agreements and a ready-made go-to-market path for cellular connected devices”

“We want to accelerate the ecosystem and unleash the potential of IoT to connect a myriad of devices,” said Yves Maitre, Executive VP for Connected Objects and Partnerships, Orange. “Our collaboration with MediaTek will combine our network and connectivity with MediaTek chipset expertise to make it easier for our customers to install cellular connectivity into their product line using an off-the-shelf bundle, all for one fixed price.”

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OriginGPS’ New Family of Products, Beginning with the Multi Micro Hornet (ORG1510-MK) Module, Adds MediaTek Functionality to Offer Impeccable Performance, Tiny Size and Rapid Update Rate Ideal for Action Sports Cameras and Wearables.

OriginGPS today announced the launch of a new family of products, the first of which is the ORG1510-MK, the world’s smallest fully integrated multi-GNSS (GPS, Glonass and BeiDou) module. The miniature low-power architecture supports an update rate of up to 10Hz and contains onboard flash, making it the perfect GNSS component for devices that require fully-featured components with small footprints, such as UAVs designed to follow action sports and other fast-moving activities or wearables.

The ORG1510-MK contains the MediaTek MT3333 chip, which supports the fastest update position calculation rate of all leading modules. The chip also contains an onboard flash memory that does not erase when power is off. It consumes very little power with the use of both standby mode and backup mode, and, in advanced applications, a periodic mode that can turn the device on and off when in backup or standby.

“The inclusion of MediaTek has enabled the creation of the most powerful GPS module on the market”, said Gal Jacobi, CEO of OriginGPS.
“The ORG1510-MK’s tremendously fast update rate, low power consumption, miniature size and reliable accuracy makes it possible to track life’s most exciting and fast-paced activities without delay, battery drain, or clunky devices. It will be a meaningful engine of growth for OriginGPS in Asia Pacific and globally.”

Several key features of the New Multi Micro Hornet include:

• Rapid update rate and superior memory – The Multi Micro Hornet boasts an update rate of up to 10Hz and onboard flash, supporting a significantly higher accuracy than the standard update rate of 1Hz and low power consumption due to the module’s ability to store hours of data.
• Smallest size, highest performance – Despite the Multi Micro Hornet’s tiny size of 10×10 mm and height of 6.1 mm, the module offers superior sensitivity and outstanding performance, achieving rapid Time To First Fix (TTFF) of less than one second, accuracy within as little as one meter, and sensitivity at an industry leading -165dBm two constellations simultaneously.
• High sensitivity and noise immunity – The ORG1510-MK continues to leverage OriginGPS’ patented and proprietary Noise Free Zone NFZ technology to ensure high sensitivity and noise immunity even under marginal signal conditions.
• Continuous connectivity with minimal power consumption – The low power consumption modes aided by MediaTek include a standby mode, during which the RF and baseband enter low power mode, and backup mode, during which the internal PMU turns off and only keeps the VRTC domain alive. For advanced applications, the module can periodically turn its operation on and off when in backup or standby mode.
• An intelligent design that shortens time to market – The Hornet family of GPS / GNSS antenna modules integrates a GNSS receiver and patch antenna in a single module. As a cornerstone of the OriginGPS portfolio, the ORG1510-MK pin-to-pin compatibility with the Micro and Nano Hornet modules ensures a seamless migration from GPS to GNSS and gives developers the ability to create new product offerings in the shortest time to market while minimizing costly design risks. Developers can simply connect it to a power source on a single layer PCB to begin integrating it into their designs.

“MT3333 was the world’s first 5-in-1 multi-constellation Global Navigation Satellite System chipset. It features excellent signal acquisition performance and tracking sensitivity, combined with superior noise immunity,” said Chet Babla, Senior Director, Corporate Sales EMEA at MediaTek.

“With the lowest power consumption in the industry, our highly integrated multi-GNSS solution, together with OriginGPS’s Noise-Free Zone System, will enable ultra-compact designs for a wide range of applications, such as wearables and the Internet of Things.”

Additionally, the ORG1510-MK module combines OriginGPS’ proprietary low-profile GNSS antenna with a dual-stage LNA, RF LDO, SAW filter, TCXO, RTC crystal and RF shield.

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MediaTek Cloud Sandbox accelerates device prototyping by offering developers a complimentary cloud service to host prototype-device data.

MediaTek Labs, today announced general availability of its new Cloud Sandbox data platform to better help developers bring their ideas to life for the Internet of Things (IoT).

The new service, which is free to all registered MediaTek Labs members globally, offers convenient storage of and access to data from wearable and IoT devices during prototyping.

“MediaTek recognizes the importance of a cloud-based IoT platform and playground to service developers and makers who are prototyping wearable or IoT devices,” said Marc Naddell, VP of MediaTek Labs.

“With this complimentary offering from MediaTek Labs, IoT developers no longer need to set up and manage their own web server or source third-party cloud platform services. Instead they can focus on their IoT device prototyping and value proposition, accelerating the time from solution ideation to prototype and proof-of-concept.”

A considerable challenge for developers in the early stages of device creation is not only the management of large amounts of data but also a convenient and simple way to visualize the data and demo prototypes to collaborators. MediaTek Cloud Sandbox helps solve this with a variety of invaluable features , including:

• Data storage and visual charting
• Data monitoring with notifications
• Device remote control
• Firmware upgrades over-the-air (FOTA)
• RESTful API support, TCP socket connection
• Web or mobile app based access

MediaTek Cloud Sandbox (MCS) will be on display in MediaTek’s booth at Mobile World Congress – Hall 6, Stand 6E21 – with three compelling demonstrations, including:

1. Wine Brewer – A MediaTek LinkIt ONE development board implementation that won first prize in ITRI Mobilehero 2014 competition in Taiwan.
2. Weather Station – A LinkIt ONE development board implementation that gathers and pushes real-time temperature, humidity and pressure data to MCS, and is able to have its fan controlled from MCS and the MCS companion mobile app.
3. MediaTek LinkIt Connect 7681 demo – A LinkIt Connect 7681 development board implementation and its companion mobile app to demonstrate real-time LED color control.

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Jupiter SL871, the Smallest Multi-Constellation GNSS in Telit’s Portfolio to Deliver Ultra-low Standby Power for Consumer and Industrial Devices Discovering GPS, GLONASS, Beidou, Galileo, QZSS and SBAS constellations.

Telit Wireless Solutions, a global provider of high-quality machine-to-machine (M2M) solutions, products and services, today announced the market introduction of Jupiter SL871. The new module, which is based on MediaTek’s low-power MT3333 core, enables multi-constellation tracking. The SL871 is the ideal solution for battery-life sensitive GNSS applications that do not require Dead Reckoning, TRAIM and support of communication ports like USB or CAN bus. The recently introduced companion SL869 V2 module provides these sophisticated features.

The SL871 can track GPS + Galileo and GLONASS (or GPS + Galileo and Compass\Beidou depend-ing on the SW onboard) constellations, while simultaneously pro¬viding the positioning data through standard UART. It features an ultra-sensitive RF front-end that enables multi-GNSS indoor fix, fast fix and navigation in challenging outdoor scenarios such as dense urban areas.

The Jupiter SL871 also supports ephemeris file injection (A-GPS) as well as Satellite Based Augmentation System (SBAS) to increase position accuracy. Its onboard software engine is able to locally predict ephemeris three days in advance starting from ephemeris data broadcast by GNSS satellites received by the module and stored in the internal Flash memory. In addition, advanced power modes and AGPS help in finding the best balance between accu¬racy and power consumption, significantly increasing the battery life.

When designing position-aware, connected devices, developers can benefit significantly from the seamless integration between Telit’s cellular modules and the Jupiter SL871. Bundling these cellular and positioning modules significantly reduces development complexity without adding costs. Multi-GNSS modules applied together with the company’s eCall / ERA-GLONASS compliant cellular modules can, for example, deliver ready-to-use emergency automotive tracking solutions for the European and Russian markets.

“MediaTek is extremely pleased to partner with Telit on its latest generation multi-GNSS Jupiter positioning solution,” said SR Tsai, general manager of MediaTek’s Wireless Connectivity and Networking business unit. “MediaTek’s multi-constellation location technology has been widely proven globally. The MT3333 single-chip SoC enables industry leading levels of performance and integration, together with the lowest power consumption, and is ideal for deployment across multiple product segments.”

“The Jupiter SL871 was designed to help developers looking for a quick and painless design-in experience creating geo-location aware products, particularly battery-powered ones,” said Taneli Tuurnala, Vice President and Head of GNSS Division at Telit Wireless Solutions.

“This exceptional and easy-to-use receiver module extends our partnership with MediaTek and will accelerate our global engagement with vertical application areas such as fleet management systems, GNSS-assisted road tolling, wearable technology, in-car navigation, telematics, personal monitors, to name a few.”

The post Telit Unwraps Second Positioning Module Based on MediaTek’s Single Chip SoC Technology appeared first on IoT Business News.

Jupiter SL869 V2 to Deliver Ultra-low Standby Power for Consumer and Industrial Devices Discovering GPS, GLONASS, Beidou, Galileo, QZSS and SBAS constellations.

Telit Wireless Solutions, a global provider of high-quality machine-to-machine (M2M) solutions, products and services, today announced the market introduction of Jupiter SL869 V2, the second generation of one of its top performing positioning products. The new module is based on the low-power MT3333 from MediaTek. The complete multi-GNSS receiver features easy integration and superior battery-life performance, able to discover and simultaneously track multiple constellations. It also delivers a high-sensitivity RF front-end, enhancing reliability and functionality of geo-location aware consumer, commercial and industrial devices.

The Jupiter SL869 V2 supports GPS, QZSS and Glonass and is ready for Galileo and Compass/Beidou. Two variants of product deliver simultaneously tracking of different combinations of constellations: either GPS + Galileo and Glonass; or GPS + Galileo and Compass/Beidou. Geo-location data is delivered using NMEA protocol through a standard UART port. It supports ephemeris file injection (A-GPS) as well as Satellite Based Augmentation System (SBAS) to increase position accuracy. Its onboard software engine is able to locally predict ephemeris three days in advance starting from ephemeris data broadcast by GNSS satellites, received by the module and stored in the internal Flash memory.

The SL869 V2 can replace the JN3 or SL869 in device designs with the observance of a few simple application rules. That allows customers to design once and interchangeably mount the JN3, SL869 or SL869 V2 depending on required features. The xL869 is Telit’s GNSS unified form factor family which allows customers to select among different GNSS technologies and feature sets. Modules in this family are offered in a 16 x 12.2 mm, 24-pad, LCC package.

When designing position-aware, connected devices, developers can also benefit significantly from the seamless integration between Telit cellular modules and the Jupiter SL869 V2. Bundling of all-Telit cellular and positioning modules significantly reduces development complexity without adding costs. Multi-GNSS modules applied together with the company’s eCall / ERA-GLONASS compliant cellular modules can, for example, deliver ready-to-use emergency automotive tracking solutions for the European and Russian markets.

“MediaTek is extremely pleased to partner with Telit on its latest generation multi-GNSS Jupiter positioning solution,” said SR Tsai, general manager of MediaTek’s Wireless Connectivity and Networking business unit.

“MediaTek’s multi-constellation location technology has been widely proven globally. The MT3333 single-chip SoC enables industry leading levels of performance and integration, together with the lowest power consumption, and is ideal for deployment across multiple product segments.”

“The Jupiter SL869 V2 was designed to help developers looking for a quick and painless design-in experience creating geo-location aware products, particularly battery-powered ones,” said Taneli Tuurnala, Vice President, Head of GNSS Division at Telit Wireless Solutions.

“This exceptional and easy-to-use receiver module marks the start of our partnership with MediaTek and will accelerate our global engagement with vertical application areas such as fleet management systems, GNSS-assisted road tolling, wearable technology, in-car navigation, telematics, personal monitors, to name a few.”

The post Telit Unwraps First Positioning Module Based on MediaTek’s Single Chip Multi-GNSS Receiver SoC Technology appeared first on IoT Business News.