• Telit Cinterion continues execution of western IoT leadership strategy by partnering with VVDN Technologies for mass production of modules, data cards and custom designed products
• Manufacturing footprint scales after the 2022 acquisitions of the Thales IoT business and Mobilogix and now by manufacturing, design and logistics capabilities in India
• Place of manufacture is an increasingly crucial consideration for technology product buyers, with a focus on supply chain resilience, sustainability and environmental impact

Telit Cinterion, a global enabler of the intelligent edge, today announced a strategic relationship with VVDN Technologies, a premier electronics engineering, manufacturing and digital services company, for the mass production of modules, data cards and custom products as part of Telit Cinterion’s ongoing execution of its western IoT leadership strategy.

Under the terms of the agreement, Telit Cinterion begins production of its modules and data cards in VVDN Technologies’ state-of-the-art manufacturing facilities. The relationship will also create a business model through which Telit Cinterion’s IoT Solutions business unit customers will have access to VVDN Technologies’ advanced manufacturing and design capabilities for their custom products.

With increasing scrutiny on the origin of technology products, Telit Cinterion recognizes that India is an emerging global leader in high-quality electronics manufacturing, showing a strong commitment to environmental concerns. Telit Cinterion’s decision to manufacture in India will lead to the expansion of business reach and models into India and as the country’s technology industry grows, Telit Cinterion will be able to address the same using “Design and Make In India” solution.

“We are delighted to be chosen by Telit Cinterion for manufacturing their modules, data cards and custom products,” said Puneet Agarwal, Founder and CEO at VVDN Technologies. “VVDN’s expertise in technology productization, mass production and commitment to sustainability are in alignment with Telit Cinterion’s vision. Together, we will provide customers with the highest-quality IoT modules and data cards on the market.”

“This agreement with VVDN is a game changer as it not only ensures we evolve our time-to-customer but also enables us to lead digital transformation enablement in India,” said Paolo Dal Pino, Chief Executive Officer at Telit Cinterion.

“By starting our manufacturing and operations activities in India along with our R&D center in Bangalore, we are meeting the mission critical needs of our customers and ensuring on our supply chain resilience and sustainability.”

Starting in August, VVDN begins mass production and customer shipments. VVDN operates state-of-the-art facilities in Manesar, Haryana, and Pollachi, Tamil Nadu and is known for their advanced manufacturing capabilities and stringent quality standards.

The post Telit Cinterion Partners with VVDN Technologies for Advanced Product Manufacturing and Expansion of Business into India appeared first on IoT Business News.

• Telit Cinterion and Kontron have today signed a binding agreement whereby Telit Cinterion will sell its cellular automotive product business to Kontron
• With this divestment, Telit Cinterion sharpens focus on its pure-play industrial and commercial IoT strategy

Telit Cinterion, a global leader in the Internet of Things (IoT), and Kontron AG, a global supplier of smart IoT solutions and professional IT services, today jointly announced that they have entered into a binding agreement under which Telit Cinterion will sell its cellular automotive IoT product business to Kontron.

The intended transaction includes Telit Cinterion’s complete portfolio of cellular automotive wireless communication modules, ranging from 4G LTE to 5G. The expected transaction reaffirms California-based Telit Cinterion’s market position as the leading Western provider of cybersecure IoT solutions, and the company’s growing reach in key industrial IoT segments and end markets including energy, telematics, e-health, broadband, and security & surveillance.

With approximately 4,500 employees across 21 countries, Kontron is a technology provider to top global brands. The company posted sales of EUR 1,342 million in 2022. The intended transaction will be submitted to the relevant workers’ councils. The transaction is expected to close in Q3 2023, subject to regulatory approvals and other customary closing conditions.

Kontron and Telit Cinterion customers and partners will continue to receive the outstanding supply, support, and service to which they have been accustomed. All relevant parties will receive updates throughout the transaction, upon closing and ensuing integration period.

The post Telit Cinterion Announces Sale of Its Cellular Automotive Module Unit to Kontron appeared first on IoT Business News.

• Multi-frequency SE868K5 family of modules includes embedded LNA for optimal performance, plus interference immunity for better coexistence with cellular technologies
• Compact, established form factor allows for easy migration and flexibility, while low power and usage profile facilitates customization across IoT verticals

Telit Cinterion, a global enabler of the intelligent edge, today announced the addition of the SE868K5 family of dual-band GNSS positioning modules.

Built on the AIROHA AG3335 chipset family in a scalable design for global deployment or for use in the Indian market, the SE868K5 family consists of SE868K5-D and SE868K5-I modules.

A full dual-band (L1 + L5) module offering enhanced performance in harsh environments, the SE868K5-D is optimized for global deployment, while the SE868K5-I shares the same architecture in a defeatured design for cost-optimized application in the Indian market. Evolved from the 7×7 mm single-frequency SE873K5, the SE868K5 modules are an 11x11mm addition to the xE868 form factor family, utilizing unified proprietary commands (PTWS) to allow for flexibility and easy migration within the product family. The SE868K5 architecture adds extra LNA(s) after the SAW filter for optimal performances as well as immunity to interference for the best co-existence with cellular and other radios.

The new modules offer low power and usage profiles for customization of applications including fleet management systems, e-mobility applications, road tolling systems, cellular base stations, automotive telematics systems, wearable sports training monitors, and other IoT verticals. Early marketing samples of the SE868K5 family are available now, engineering samples will be available in May 2023, and mass production will take place in June 2023.

“AIROHA, a world leading GNSS SoC provider, has partnered with Telit Cinterion for years in creating many successful GNSS solutions,” said Kevin Chen, General Manager at Positioning Communications Product Business Unit of Airoha Technology. The AIROHA’s low power AG3335 dual-band chip can receive signals from as many as six navigational satellite constellations and provides abundant computing power and memory capacity in sufficing flexible development of various applications. “This will definitely help our customers around the world shorten the time-to-market of their products and solutions amid rapid evolutions of IoT application requirements,” said Chen.

“As torchbearers in the IoT revolution and staunch enablers of the intelligent edge, we are delighted to offer a solution that not only meets the needs of our global customers, but our customers on the Indian subcontinent as well,” said Marco Argenton, VP of Product Management, IoT Modules, Telit Cinterion.

“In leveraging AIROHA’s next-generation chipsets with our own proprietary technology, we are able to provide our customers with the best global and local solutions.”

Telit Cinterion will be available to discuss the addition of the SE868K5 family of dual-band GNSS positioning modules at Embedded World 2023, March 14-16, in Nürnberg, Germany. Visit Telit Cinterion at Booth 3-519 in Hall 3.

The post Telit Cinterion Adds New Dual-Band GNSS Positioning Modules Featuring the AIROHA AG3335 Chipset Family appeared first on IoT Business News.

• FE990 is powered by Snapdragon® X62 5G Modem-RF System — the fourth-generation 5G modem-to-antenna solution
• Compatible with Release 16 5G NR Sub-6 NSA/ SA, LTE and WCDMA, FE990 maximizes performance and deployment options with regional SKUs for APAC, Europe and North America

Telit Cinterion, a global enabler of the intelligent edge, today announced the FE990, a 5G sub-6 GHz module series designed for bandwidth-intensive fixed and mobile applications such as industrial IoT, mobile routers, private enterprise networks and residential broadband.

The FE990 features the Snapdragon X62 5G Modem-RF System from Qualcomm Technologies, Inc.

The FE990 is compatible with the 3GPP Release 16, whose advanced features include enhanced mobile broadband (eMBB) and ultra-reliable low-latency communication (URLLC). These features — along with maximum throughputs of 3.4 Gbps downlink and 0.9 Gbps uplink — make the FE990 ideal for bandwidth-intensive applications such as private enterprise networks, 4K/ 8K streaming video, mobile routers, drones for public safety, telemetry for agricultural, forestry and lawn care machinery, residential broadband, telemedicine and Industry 4.0 factory automation.

Snapdragon X62 helps to maximize the FE990’s power efficiency and transmit/ receive performance with advanced technologies such as the new seventh-gen Qualcomm® Wideband Envelope Tracking, Qualcomm® AI-Enhanced Signal Boost, and Qualcomm® 5G PowerSave 2.0. Snapdragon X62 further extends the flexibility offered to operators and devices to increase attainable 5G network speeds and improve capacity with available spectrum. The solution also supports Qualcomm® Smart Transmit 2.0 technology which uses smart control of multiple antennas for superior sub-6 performance.

The FE990 has several features to help service providers, device OEMs, systems integrators and enterprises quickly launch service, such as regional SKUs for APAC, Europe and North America. Backward compatibility with LTE and WCDMA also provides deployment flexibility and future proofing, such as launching 4G broadband services now to capture market share, and then upgrading those customers to 5G when it becomes available.

Available in a 41 x 41 mm LGA-type form factor, the FE990 also supports Telit AppZone Linux/C for embedded programming and Telit OneEdge, which dramatically simplifies design, deployment and management of IoT products and solutions. Samples of the FE990 are available now, with mass production expected to begin in Q4 2023.

“As a leading technology provider, Qualcomm Technologies is proud to provide cutting-edge innovations like Snapdragon X62 to partners like Telit. Our solution is an ideal foundation for the new Telit FE990 to enable optimized modules in the LGA form factor,” said Mathew Joseph, director, product management, Qualcomm Technologies, Inc. “We’re excited to expand our collaboration with Telit Cinterion to enable new form-factors and applications which aim to further the 5G promise of advanced performance, reliability and features for consumers and enterprises.”

“When mobile operators, device OEMs and systems integrators want to take advantage of the latest 5G technologies, they turn to solutions from Telit Cinterion and Qualcomm Technologies,” said Marco Contento, VP of product management, mobile broadband, Telit Cinterion.

“The new Telit FE990 and Snapdragon X62 enable them to quickly and cost-effectively seize many of the biggest emerging market opportunities — from private 5G networks to fixed wireless access to industrial IoT.”

To learn more about the new FE990, visit Telit Cinterion at Mobile World Congress Barcelona 2023 in Hall 5, Stand 5A32.

The post Telit Cinterion Expands 5G Module Portfolio with the FE990 for Residential Broadband, Industrial IoT and Private Enterprise Networks appeared first on IoT Business News.

• The most secured 5G LPWA modules with best-in-class power consumption, helping device OEMs in smart metering, asset tracking, telematics, and more to deploy and safely maintain their IoT solutions securely connected in the field for years
• Future-proof design includes support for 3GPP Rel. 15/16/17 and next-gen LTE-M/ NB-IoT, as well as eSIM/ iSIM and non-terrestrial networks (NTN)

Telit Cinterion, a global enabler of the intelligent edge, today announced new ultra-compact 5G low-power wireless access (LPWA) modules for a wide variety of indoor and outdoor IoT applications that require long battery life and long service life.

The modules feature the ALT1350 chipset from Sony Semiconductor Israel (Sony), the world’s first chipset that supports both unlicensed spectrum and satellite connectivity in a single chipset, enabling faster development, lower power, smaller size and new use cases.

The new modules have several next-generation features that make them ideal for device OEMs, systems integrators and enterprises such as utilities that need to dramatically extend the service life of their IoT devices beyond what traditional designs enable:

• Compliance with 3GPP release 15/16/17 features such as IoT data communication over non-terrestrial networks (NTN). This provides users with future-proof flexibility to switch between cellular and satellite technologies to meet criteria such as coverage, performance, fallback, tariffs and more.
• Support for embedded SIM (eSIM) and integrated SIM (iSIM) technologies. This provides additional future proofing over the full project lifecycle and faster deployments, as well as enterprise-grade security based on integrated Secure Element (iSE), with compliance to CC EAL 5+.
• Best-in-class power consumption. This extends the service life of battery powered IoT devices to a decade or longer, which eliminates the expense of periodically replacing batteries.
• Support for multiple location technologies, including Wi-Fi scan and GNSS. This maximizes flexibility when choosing technologies for indoor and outdoor positioning applications such as tracking high-value medical equipment around a hospital campus.
• Support for the most secure and flexible connectivity solutions. This enables rapid, easy integration with wireless networks and seamless operation across multiple technologies.

The new modules leverage the advanced capabilities in Sony’s ALT1350 chipset, designed to meet the unique and demanding requirements of the 5G LPWA massive IoT market. The ALT1350 SoC features ultra-low power consumption in a variety of modes, including 3GPP PSM and eDRX, which significantly increases the longevity of battery-operated devices.

The ALT1350 also has an AI engine for edge processing, as well as indoor and outdoor positioning technologies bundled with a sensor hub that collects data from the sensors while maintaining its ultra-low power and high security. The SoC integrates multi-layered security architecture, including hardware and software-based secure elements to ensure end-to-end security.

The new modules have pin-to-pin compatibility with Telit Cinterion’s widely deployed module families, enabling integrators to design a single PCB layout and deploy any combination of cellular technologies, with a “design once, use anywhere” strategy.

“We are excited to expand our partnership with Telit Cinterion to serve the growing IoT market connecting utilities, logistic solutions, mobility solutions, health products and more to the cloud,” said Dima Feldman, VP Product Management and Marketing at Sony Semiconductor Israel. “ALT1350 based modules will expand the device battery life to 20 years, allow hybrid connectivity and location options, and ultra-low power processing on the module to make the Telit Cinterion modules the real core of many IoT devices.”

“The new modules are the latest example of Telit Cinterion’s commitment to providing future-proof solutions and value-added services that device OEMs, systems integrators and customers rely on for their IoT deployments. We accelerate time-to-market, help to scale deployments through the full life cycle, and provide reliable, secure connectivity,” said Manish Watwani, Chief Marketing and Product Officer at Telit Cinterion.

“Sony’s new ALT1350 chipset is the ideal foundation for these modules because it deftly balances 5G LPWA and NTN with ultra-long battery life to maximize connectivity options and service life.”

To learn about the new LPWA modules, visit Telit Cinterion at Mobile World Congress Barcelona 2023 in Hall 5, Stand 5A32.

The post Telit Cinterion Expands 5G LPWA Module Portfolio with New Modules Featuring Sony’s Altair ALT1350 Chipset appeared first on IoT Business News.

• Alif and Telit combine technologies and expertise to give system developers a head-start on cloud-managed distributed IoT applications
• Developer kits accelerate design and prototyping of IoT edge devices capable of sensing and making rapid localized decisions using AI/ML

Alif Semiconductor, supplier of low-power, secure, AI/ML-enhanced fusion processors and microcontrollers (MCUs), today announced collaboration with Telit, a global leader in the Internet of Things (IoT), to deliver developer kits that provide cloud-connected hardware and software reference designs for a wide variety of distributed and IoT edge applications.

The kits focus on connected AI/ML-enhanced vision, voice, vibration, and sensor applications such as AI cameras, smart home, city infrastructure, biometric access control, and wearables.

The kits leverage the Alif Ensemble® family of microcontrollers (MCUs) and fusion processors. Ensemble devices utilize innovative aiPM power management technology that feature a High Efficiency, always-on region that senses the environment using initial AI/ML processing, while a separate High Performance region wakes as needed to rapidly execute additional heavy AI/ML workloads and returns to sleep. In addition to smart power management, the Ensemble family provides multiple layers of security based on a secure identity and strong root-of-trust for complete lifecycle management handling keys, certificates, secure boot, remote updates and more.

The developer kits include Telit’s wireless connectivity modules from Wi-Fi and Bluetooth to LTE and 5G cellular, including low-power wide-area (LPWA) offerings in Cat-M and NB-IoT for IoT applications that require lower power consumption and longer battery life. The collaboration also leverages Telit’s cloud services and platforms to connect, manage, and secure the deployment of intelligent IoT edge devices the kits and the technology will enable.

“Together, Alif’s scalable low power secure processors plus Telit’s communication modules and cloud services make an ideal combination for anyone who wants to simply and rapidly develop and deploy IoT edge devices using the very latest technologies,” said Reza Kazerounian, Co-Founder and President at Alif Semiconductor.

“The barriers are now removed to bring low-power Machine Learning to the edge, world-wide.”

“This collaboration delivers comprehensive IoT enablement for solutions leveraging the power of Alif processors for the vibrant new space of low-power and battery-powered AI/ML edge devices,” said Manish Watwani, Chief Marketing and Product Officer at Telit. “Innovators are looking for ‘cut-and-paste’ simplicity to integrate our modules with meaningful local AI/ML on edge devices. Bundled with our Telit NExT cellular connectivity and OneEdge device management and data orchestration platform, this opens the door to more utility and efficiency for our customers in this space.”

The post Alif Semiconductor and Telit to Collaborate on Machine Learning and Wireless Cloud Connectivity Solutions appeared first on IoT Business News.

• Fully featured, Android based “system on a module” is ideal for a wide range of applications requiring mobility, high data rates, advanced human-machine interface and edge computing functions
• Evolving from the Telit SE150A4 smart module, the new SE250B4 is designed to streamline development and production processes for customers while reducing time to market, R&D investments and total cost of ownership

Telit, a global leader in the Internet of Things (IoT), today announced the release of the SE250B4, the newest addition to its smart module product line.

Evolving from the existing SE150A4, the SE250B4 is a fully featured “system on a module” that provides native support for integrated peripherals like high-resolution touch displays, advanced cameras and popular audio and digital sensor interfaces. The SE250B4 is ideal for a wide range of applications that require mobility, high data rates, advanced human-machine interface and edge computing functions. The certified and ready-to-use SE250B4 helps customers reduce time to market, R&D investments and total cost of ownership (TCO).

The new SE250B4 smart module is powered by the Qualcomm® QCM2290 system-on-chip (SOC) with built-in Qualcomm® Adreno GPU 702 at 845MHz, and runs on the Android operating system (OS). The new SE250B4 supports comprehensive multimedia features and multiple wireless technologies — LTE Cat. 4 / Wi-Fi 5 / Bluetooth 5.0 / GNSS — in one highly integrated package that is perfect for a wide range of IoT applications such as:

• Mobile point-of-sale (mPOS), smart cash registers and vending machines
• Smart alarm panels
• Security surveillance cameras and systems
• Home automation and smart home gateways
• Industrial personal digital assistants (PDA)
• Handled PCs and tablets
• Police and law enforcement equipment
• Telematics cameras
• Digital video recorders (DVR)
• In-car video
• And many more

The SE250B4 series includes variants: SE250B4-NA for North America | SE250B4-EU for Europe and other | SE250B4-WE for worldwide Wi-Fi

Manish Watwani, chief marketing and product officer, Telit, said:

“Our commitment to offering customers the most advanced solutions for streamlining development and production processes is reflected in our new SE250B4 smart module series, which not only strengthens Telit’s smart module portfolio but also our market presence in this strategic and growing sector.”

The post Telit Broadens Smart Module Portfolio with Release of New SE250B4 appeared first on IoT Business News.

• Powered by deviceWISE® EDGE, deviceWISE® CLOUD, Telit’s LE910 module family and connectivity, Lantech Intelligent Network Connection (LINC) addresses and resolves key smart factory and machine challenges including uptime, performance, load quality and cost
• LINC is Lantech’s first IoT powered SaaS offering which includes machine data, analysis, and alerts to allow users to monitor stretch wrapper performance remotely

Telit, a global leader in the Internet of Things (IoT), today announced that it is working with Lantech to change how companies package and protect their products for shipment from the factory floor to the retailers door.

Without proper stretch wrapping, loads can fail and shift during shipment causing costly damage to a company’s product or brand. With the Lantech Intelligent Network Connection (LINC) — powered by Telit’s deviceWISE Edge, deviceWISE Cloud, connectivity and LE910 cellular module — Lantech addresses key problems for smart factories that stretch wrap pallet loads, increasing uptime, performance and load quality, and decreasing film cost.

“In 1972 Lantech revolutionized how customers ship their products with the invention of the stretch wrapper,” said Alex Verret, director of Customer Care Services, Lantech. “Today, Lantech stretch wrappers help our customers produce millions of safe-to-ship loads every year, at the lowest possible cost. LINC, our latest innovation, allows our customers to easily connect to machine performance data and proactively address issues to improve wrapping operations.”

LINC is a data visibility solution that allows subscribers to monitor machine data and performance in real-time, from any place. It provides actionable intelligence to maintain and improve system uptime, productivity, load quality, and cost — allowing customers to react to issues before they become problems.

Performance feedback information is vital to anticipating — and proactively addressing — systemic issues. Previously, the only way to access important information was directly from the HMI for L-Series systems (legacy systems that did not even tabulate summary data). Lantech built LINC to harvest and transmit data to allow for wrapper status and performance data to be collected, displayed and analyzed without accessing a customer’s network. The goal of the system is to significantly reduce response times, downtime, quality problems and environmental impacts.

These products enable the LINC system:

• Telit deviceWISE Edge – Industrial IoT edge platform made by hundreds of industrial drivers. It interfaces directly with Programmable Logic Controllers (PLC) and other industrial control systems, enabling the edge application and supporting machine learning.
• Telit deviceWISE Cloud – Cloud-based IoT platform that aggregates data collection, device management, secure remote access, connectivity management and remote access all from one intuitive web interface (with the necessary tools and resources).
• Telit connectivity – Global visibility and control down to the individual SIM, reducing the costs of managing a connectivity ecosystem.
• LE910 module family – LTE Cat 4 industrial grade modules for IoT applications that need a combination of performance and affordability. The modules are ideal for remote asset monitoring and tracking use cases.

“Viewing critical machine analytics anytime — from anywhere — is critical for today’s smart factories and represents a competitive advantage,” said David DeLaRosa, VP deviceWISE Industry 4.0, IoT Platforms Business Unit, Telit. “Empowering the right people to view data to improve uptime and productivity is often an overly complex task. deviceWISE simplifies the process by providing industrial drivers and enabling advanced edge logic, cloud connectivity and secure remote access.”

DeLaRosa continued:

“Through our partnership with Lantech, its LINC system allows users to set and monitor performance targets and receive event-based notifications. This allows wrapping systems to become part of the team by notifying users when important events occur.”

The post Telit Enables Lantech’s Intelligent Stretch Wrapper Solutions Designed to Improve Shipment Costs, Serviceability and Load Quality appeared first on IoT Business News.

• Allows customers deploying in the U.S. to switch to the MNO’s local profile remotely and securely over the air.
• With operation on a local profile, devices deployed in the U.S. are ensured coverage unfettered by roaming restrictions.

Telit, a global leader in the Internet of Things (IoT), today announces it is broadening its connectivity offering by adding a leading service provider’s local native IoT profile to its eUICC-compliant NExTPlus SIM.

This allows IoT customers to overcome permanent roaming restrictions by zero-touch switching between Telit network NExT and local MNO profiles from a single SIM. The one-SIM, full-lifecycle, multi-IMSI, multi-profile solution with the new service provider’s IoT profile is ideal for multi-country deployments where one of the markets is the U.S., as it enables a truly single SKU for the customer to manage all aspects of the IoT deployment at scale.

Telit NExTPlus customers deploying in the U.S. can leverage the local native service provider’s profile – whether preinstalled or downloaded – to overcome roaming issues and optimize the quality of service. With NExTPlus, customers are not only ensured end-to-end compatibility between the SIM, module and the service provider’s cellular networks but also gain the ability to remotely and securely change the attributes and features of the SIM and module using Telit’s Connectivity Management Platform across the provider’s mobile networks as they exist now and in the future.

“Given rapidly advancing technology and business models, the IoT connectivity ecosystem can bring about unknowable disruptions. With IoT becoming an integral part of devices across all industries, a true global SIM with no limitations and with billing, monitoring, IoT orchestration and platform all from a single vendor, offers a competitive advantage,” said Tomer Lavie, Head of Connectivity Business Unit, Telit.

“Telit NExTPlus delivers both global coverage and the flexibility required to optimize coverage and costs across network technologies, including LTE-M, NB-IoT, VoLTE and 5G. These capabilities are increasingly critical as mobile networks around the world ramp up the pace of evolution with new cellular services and operating parameters.”

The post Telit to Feature Leading Mobile Network Operator’s Local Native IoT Profile on its NExTPlus™ eUICC SIM appeared first on IoT Business News.

Highlights:

• Verizon can deliver higher capacity and performance to customers using C-band certified devices based on the FN980 and FN980m modules from Telit
• The Telit FN980 5G module series is ideal for enterprise routers and gateways, high-speed fixed wireless access modems, private LTE/5G networks, video broadcasting and surveillance

Telit, a global leader in the Internet of Things (IoT), today announces that the company’s FN980 5G module series — FN980 and FN980m — have received C-band certification from Verizon.

Based on the new 3GPP Rel. 15 standard, the 5G modules enable bandwidth intensive IoT applications — including high-definition (HD) surveillance video and digital signage — to take advantage of Verizon’s 5G Ultra-Wideband network in the C-band 5G spectrum.

The FN980 and FN980m series enables 3GPP 5G deployment scenarios and features both sub-6 and mmWave (mmW) technologies. The series also includes non-standalone LTE-5G NR dual connectivity (EN-DC), dynamic spectrum sharing between LTE and 5G, and full 5G NR standalone mode. The industrial-grade design is ideal for mission-critical applications that require maximum reliability, including industrial routers and gateways, fixed wireless access (FWA), professional mobile high-resolution video broadcasting equipment and more. In addition to C-band, both modules support sub-6GHz FDD/TDD and LTE Category 20 – 7x carrier aggregation.

Jitender Vohra, senior director of carrier relations at Telit, said:

“Together with all these features and benefits, we are very excited to have our M.2 5G Mobile Broadband (MBB) modules — the award-winning FN980 and FN980m — certified for use on Verizon’s C-band.”

“As we continue to lead the industry in technology evolution our FN980 series continues to expand the possibilities of network evolution to 5G and beyond.”

The post Telit FN980 5G Series Modules Now Certified for Verizon C-Band Spectrum appeared first on IoT Business News.

• Integration of Mobilogix adds IoT device design and engineering capabilities to streamline new and existing customer projects — reducing business risk, project time, cost, and complexity
• Customized IoT project expertise turns business vision into ready-to-certify and mass-produce IoT solutions

Telit, a global leader in the Internet of Things (IoT), today announces the acquisition of group assets from Mobilogix, a California-based startup company specializing in custom IoT solutions worldwide.

The acquisition allows Telit to expand in the growing segment of new and existing IoT adopters that want to reduce complexity and time to market. The acquisition adds comprehensive device engineering expertise and resources that focus on optimizing specifications for handoff to electronic manufacturing services, original device manufacturing, and the attainment of regulatory approvals and carrier certifications.

“We built Mobilogix into a successful global business with razor sharp focus on creating competitive, custom IoT solutions quickly for customers in verticals like telematics, micro-mobility, healthcare, construction, and agriculture, sourcing modules and connectivity from across the IoT value chain,” said Mathi Gurusamy, CEO of Mobilogix.

“Bringing solutions together with all-Telit modules, connectivity and platforms makes custom design much more efficient for our large and small customers to get to market. As part of Telit, we can create these projects faster and reach a much larger market.”

“From Fortune 500 to start-ups, companies adopting IoT prefer to start from a business idea or a vision and turn them directly into viable, competitive, ready-to-launch devices and solutions — without taking focus away from their core businesses,” said Paolo Dal Pino, CEO of Telit. “We have award-winning, industry-leading modules, connectivity, and platforms at Telit. The addition of the Mobilogix expertise in design and industrialization, gives us the ability to build end-to-end custom solutions — fully utilizing all our offerings — for our customers, so they can focus on their business and objectives.”

Upon closing, Irvine-based Mobilogix will relocate personnel and offices into Telit’s new Irvine headquarters. Telit will becoming Telit Cinterion, upon conclusion of regulatory approvals and closing conditions of the acquisition of the Thales IoT Modules business announced on July 29, 2022.

The post Telit Acquires Mobilogix to Provide Custom IoT Project and Solution Design Services appeared first on IoT Business News.

• Telit and Thales jointly announce intended transaction whereby Telit incorporates Thales’ cellular IoT products business and goes forward under Telit leadership

• Combined company, to be called Telit Cinterion, is leading Western IoT provider, supporting customers with expanded IoT portfolio of products, services, and bundles comprising hardware, software, and connectivity solutions

• Telit Cinterion will leverage Thales’ expertise in IoT security across SIM technology, modules, and connectivity

• Through this intended transaction, Thales will transfer its cellular IoT modules assets to Telit and receive a 25% stake in Telit Cinterion

Telit, a global leader in the Internet of Things (IoT), and Thales (Euronext Paris: HO), a global leader in Aerospace, Defense, Security & Digital Identity, today jointly announced they have entered into an agreement under which Telit intends to acquire Thales’ cellular IoT products.

The intended transaction includes Thales’ portfolio of cellular wireless communication modules, gateways, and data (modem) cards, ranging from 4G LTE, LPWAN to 5G.

The intended transaction establishes California-based Telit Cinterion, as a leading Western provider of IoT solutions, expanding the company’s presence in growing industrial IoT segments and end markets including payment systems, energy, e-health, and security. It also enhances the company’s ability to respond more expertly to growing demand for cybersecure IoT solutions in modules and cellular connectivity, thanks to leading technologies from Thales.

Paolo Dal Pino, Telit’s CEO, remarked:
“Innovation, scale and efficient IoT solutions are key for success. This transaction with Thales is arguably the most impactful one for Telit competitiveness. While it will boost our ability to address customer needs more precisely from a richer portfolio, it will also enable us to deliver all new offerings derived from the experience, expertise, and the DNA of two companies that have made security and quality part of their brand promise from the very beginning.”

Philippe Vallée, Thales’s EVP Digital Identity and Security, added:

“The Thales and Telit combination brings together complementary strengths. The business will provide a unique value proposition in a highly competitive global IoT market and will allow Thales to focus its investments on its three core activities in aerospace, defence and security and digital identity and security.”

“The new combination will rely on a unique set of expertise brought by Thales and Telit employees. It will also benefit from leveraging both companies’ strong and complementary product portfolio and Thales’s experience in cellular connectivity.”

Thales’ cellular IoT module business, with approximately 550 employees across 23 countries, services many of the world’s top brands. It generated sales of more than €300 million in 2021. With the transaction expected to close in Q4 2022, subject to entering a binding share transfer agreement, regulatory approvals and other customary closing conditions, Thales becomes a shareholder in Telit Cinterion, controlled by asset manager DBAY Advisors and led by Telit CEO Paolo Dal Pino.

Thales’ cellular IoT products business and Telit’s customers and partners will continue to receive the outstanding supply, support, and service to which they have been accustomed. All relevant parties will receive regular updates throughout the transaction, upon closing and ensuing integration periods.

To sharpen focus on Industrial IoT, Telit Cinterion plans to spin off and manage separately the automotive IoT unit after closing.

Deutsche Bank acted as exclusive financial advisor to Thales, and Rothschild & Co as exclusive financial advisor to Telit, DBAY Advisors.

The post Telit and Thales Announce the Creation of the Leading Western IoT Solutions Provider: Telit Cinterion appeared first on IoT Business News.

• Telit NExT Embedded expands embedded connectivity options for cellular IoT modules that reduce cost, ease complexity, and save power consumption
• NExT Embedded ME310G1 LTE-M module is the first module to integrate the leading-edge ultra-miniature cellular SIM chip technology

Telit, a global enabler of the Internet of Things (IoT), today announced it is broadening its IoT connectivity portfolio with the introduction of Telit NExT Embedded.

Employing next generation integrated SIM (iSIM) and embedded SIM chip (eSIM) technology in the cellular IoT module with an array of intuitive, easy-to-use connection, and device management tools, Telit NExT Embedded will materially simplify deployment of cellular connected IoT devices at any scale. Without the need for a SIM tray or any extra components on the device side, this comprehensive, scalable management resource for IT and IoT managers in the back office allows IoT adopters to innovate faster — with more security and less complexity during device design and throughout deployment operations.

Telit NExT Embedded is the evolution of module-embedded connectivity that Telit helped pioneer with the 2017 introduction of simWISE integrated SIM technology. iSIM lowers the total cost of ownership, reduces the bill of materials, streamlines operations, and reduces costs from errors and manual processes. Complementing the offering, Telit is introducing a line of embedded SIM modules with the ME310G1 — the first LTE-M module to be equipped with the leading-edge ultra-miniature cellular SIM chip technology. Together, the two technology options — integrated and embedded SIM — allow developers and providers to deploy cellular connected products anywhere on the globe out-of-the box.

Telit offers a portfolio of embedded connectivity options designed to enable IoT businesses to:

• Design devices with/without a SIM socket or a SIM chip
• Leverage form factor families with modules to support different cellular technologies and regions
• Innovate with the latest SIM chip on module options and full eUICC compliance
• Work with Telit NExT profiles for major tier-one MNOs globally
• Expand deployments with iSIM in sync with global carrier plans to support standards
• Excel in operational efficiency with over-the-air (OTA) and eUICC-aligned management tools and resources that meet flexibility, simplicity, scalability and security needs now — and that also future-proof the deployment

“A recent industry survey by a Fortune 500 IT giant found that the selection of embedded connectivity for IoT devices is second in the top five IoT best practices by highly successful IoT adopters. Telit NExT Embedded is absolutely aligned with that trend,” said, Tomer Lavie, Head of Connectivity Business Unit, Telit.

“Because most MNOs and MVNOs still require a physical SIM, our portfolio of embedded SIM modules continues to grow and complement the integrated, chipless SIM offering we have with simWISE. Together, they represent the next step in mass-market IoT enablement, facilitating global scaling deployments of fully remotely provisioned devices.”

The post Telit to Broaden its IoT connectivity portfolio with Telit NExT Embedded appeared first on IoT Business News.

• Telit deviceWISE® SMART START is a preconfigured and customizable app to monitor and recognize patterns to improve productivity and reduce unplanned downtime
• Preventative maintenance is the first application with forthcoming releases include apps for OEE, Andon displays, remote monitoring and smart agriculture

Telit, a global enabler of the Internet of Things (IoT), today announced that its award-winning Telit deviceWISE platform now includes new digital transformation applications and templates enabling out-of-the-box solutions for industrial companies.

Preventative maintenance —the first release of the SMART START’s applications— monitors the function of any industrial machine and sends alerts in advance for patterns that affect productivity and can create downtime. Telit will release new apps for overall equipment effectiveness (OEE), Andon displays, remote monitoring and smart agriculture.

The SMART START app templates are part of deviceWISE VIEW and are customizable out-of-the-box to take advantage of the deviceWISE platform. deviceWISE comes with hundreds of industrial drivers to allow data collection from any type of PLC, CNC, robot, torque tool, barcode, RFID, sensors and more. deviceWISE not only collects the data but also has edge intelligence for data analysis and includes integration for IT systems like ERP, CRM, MES, databases, cloud and more.

The Telit deviceWISE industrial IoT platform suite has three main product offerings:

• deviceWISE EDGE is a unified, no-code industrial platform that reduces latency and increases factory operations throughput.
• deviceWISE CLOUD is a cloud-based service that manages remote access, data collection, device and connectivity management from the edge to the cloud.
• deviceWISE VIEW is a full SCADA and HMI system with data visualization and an application layer for the SMART START packages.

“We are introducing preventive maintenance first because it is a common challenge that typically takes a long time for industrial companies to implement efficiently. According to McKinsey, maintenance is one of the most important optimization factors in the industry representing a potential yearly economic impact of USD 577 billion across the industry,” said Ricardo Buranello, SVP and Head of Telit IoT Platforms.

“With deviceWISE SMART START, the solution is ready to be deployed in a day rather than weeks or months allowing enterprises to start saving immediately.”

The post Telit Releases Innovative Out-of-the-Box Digital Transformation Apps and Templates appeared first on IoT Business News.

• Gibson deploys an industrial IoT solution powered by Telit deviceWISE® EDGE, a no-code platform, to enable operation optimization, preventive maintenance, and efficiency control for one of the world’s most important ports
• Easy-to-implement deviceWISE® EDGE collects, analyzes, and visualizes machine data into actionable KPIs

Telit, a global enabler of the Internet of Things (IoT), and its partner, Gibson Engineering, are bringing state-of-the-art technology to shipping ports used by many of the most modern industrial companies across the globe to increase productivity.

At the request of one of the world’s largest ports, Gibson deployed its industrial solution powered by Telit deviceWISE® EDGE—a leading no-code Industrial IoT (IIoT) platform that collects data from any machine and integrates with any IT system—to enable operations optimization, preventive maintenance, and efficiency control.

As a consequence of COVID, American ports are under tremendous pressure to increase productivity and reduce the waiting time for ships to deliver and offload goods. Using the platform, Gibson enables continuous real-time monitoring and data collection from essential machines such as cranes used in the port’s logistics processes.

With visibility and insight into equipment health, costly breakdowns can be avoided. A single crane disruption in the middle of the day, for example, can result in hundreds of thousands of dollars in losses to the port and to the companies that depend on it.

“We selected Telit’s deviceWISE EDGE as it is the most flexible and capable IIoT platform available,” said Kurt Evans, Business Development Engineer, Gibson.

“We developed the solution in a few weeks and implemented it in just days, which provided our customer immediate ROI during such a challenging time.”

Telit has invested decades in developing its no-code IIoT deviceWISE EDGE platform, enabling industrial enterprises to visualize machine data, create custom dashboards and health management information in only a few clicks to see trends, and make more intuitive business decisions. The data can be transformed and analyzed at the edge and integrated with any enterprise system. With machine data visibility, processes can be automated and optimized to give managers real-time visualization and predictive maintenance alerts before a problem occurs.

“Industrial companies are heavily investing in Industry 4.0 IIoT solutions, and now ports can take advantage of these disruptive, state-of-the-art technologies,” said Ricardo Buranello, Head of IoT Platforms Business Unit, Telit. “We are proud of our partnership with Gibson and this solution, which can be replicated in any port around the world to increase productivity and reduce costs.”

The post Telit and Gibson Engineering Bring State-of-the-Art Technology to Ports Across the Globe to Increase Productivity appeared first on IoT Business News.

Supporting mission to expand access to 4G coverage and precision farming technologies with portfolio of products and services that enable agricultural applications.

Telit, a global enabler of the Internet of Things (IoT), today announced a strategic partnership with the ConectarAGRO Association, a Brazilian nonprofit revolutionizing the way agricultural fields connect to the world by promoting and enabling access to 4G mobile internet throughout the country.

As an industry expert in mobile connectivity solutions, Telit will work closely with solution ecosystem members to develop IoT devices for several agro segments. In addition to a strong portfolio of products and services for agricultural applications, Telit will offer support, from idea to design, as well as testing, certifications and deployment.

Lack of internet signal is one of the greatest challenges facing rural farmers in Brazil. In an Inter-American Institute for Cooperation on Agriculture (IICA) hosted webinar, it was stated that only 23% of the Brazilian agricultural space has some level of connectivity. The webinar also covered the significance of digital sciences in contributing to productivity enhancement and recommended taking a comprehensive look at digital platforms and the digital delivery of services.

“The increasing usage of 4G in rural areas will be critical to production along with the adoption of smart farming techniques and technologies,” said Gregory Riordan, President, ConectarAGRO.

“Through integrated technologies from members like Telit, producers are enabled to easily communicate with customers and suppliers from the field, as well as process and monitor field data, all of which will save time and boost productivity. As we advance our mission, it is our goal to ensure every producer can achieve greater development by taking advantage of the most current technological and digital resources available today in Agriculture 4.0.”

Andy Castonguay, Vice President of Strategic Intelligence at James Brehm & Associates, said:

“With significant investments and technological innovations in recent years, agriculture is one of the most exciting IoT sectors in the market right now.”

“Telit’s comprehensive portfolio of modules, data plans and platform capabilities give agricultural producers and solution providers the crucial connectivity, data and management tools they require to deliver IoT applications like crop/livestock monitoring, water/irrigation management, farm-to-fork regulatory compliance and precision farming.”

According to CNH Industrial, one of the founders of ConectarAGRO, in 2019 alone, the association expanded connectivity to more than 5.1 million hectares of rural areas in Brazil via 4G LTE 700 MHz broadband. This coverage helped more than 575,000 individuals, 218 towns and eight states, as well as more than 24,000 kilometers of roads in an area greater than the size of Belgium, Holland and Switzerland combined.

“The ConectarAGRO Association charter is to bring accessible connectivity to producers across Brazil and we joined to help transform agribusiness,” said Fernando Guerra, Regional Sales Director Latin America, Telit.

“Agriculture IoT application developers and system integrators have a unique opportunity to build connected agricultural solutions that can lead to improved yields, reduced costs and a well-fed world. Telit’s sensors, smart gateways, modules and monitoring systems that collect and analyze information will help in ensuring connectivity and informing decisions that drive improvements, even under adverse circumstances.”

The post Telit Joins ConectarAGRO Association to Bring 4G Connectivity and Advanced Technologies to Brazilian Farmers appeared first on IoT Business News.

• One of the world’s premier bio-pharmaceutical companies selects Controlant, a leader in supply chain management, powered by Telit, as the connected IoT temperature monitoring gateway for vaccine shipments throughout 2021
• Telit and Controlant receive the 2022 GLOMO Award for Best Innovation for COVID-19 Pandemic Response and Recovery

Controlant announced today it has successfully concluded the world’s single largest cellular IoT rollout for vaccine distribution using Telit modems for connectivity.

Telit is a global enabler of the Internet of Things (IoT), and Controlant is leader in real-time supply chain monitoring and visibility technologies for heavily regulated industries such as pharmaceuticals, life sciences, food and beverages.

In the battle against COVID-19, Controlant produced close to one million cellular cold-chain data logger devices, powered by Telit IoT modules, to secure the efficient distribution and the quality of billions of COVID-19 vaccine doses that one of the world’s premier biopharmaceutical companies is distributing across the globe.

Erlingur Brynjulfsson, CTO and co-founder, Controlant, said:
“It’s been a roller coaster ride for the biopharmaceutical industry, racing first to come up with COVID-19 vaccines and then to distribute them safely.”

“During a time of unprecedented disruptions in the global supply chain, Controlant produced nearly a million cellular cold-chain data logger devices, using Telit modems, to secure the efficient distribution and quality of billions of vaccine doses.”

“Winning the GLOMO award is testament to the hard work of a great many people and to the strength of our partnership with Telit.”

Controlant’s Cold Chain as a Service solution is a single source of supply chain truth. It is a powerful combination of IoT, advanced visibility and cost-reducing operational services that increase workflow efficiency and responsiveness while supporting quality and compliance efforts. COVID-19 vaccines, in particular, must maintain strict temperature control along every mile of the supply chain to ensure quality and integrity. Real-time supply chain monitoring solutions from Controlant offer complete visibility into shipping, distribution and warehousing, all of which reduce risk of spoilage, reducing product waste by more than 90 percent.

“Despite a period of severe material shortages and production challenges during various waves of virus outbreaks and regional lock-downs, Telit and its suppliers and production partners engaged in unprecedented collaboration to deliver all vaccine units in record time and enable the vaccination campaigns to be implemented without any disruption in the supply,” said Martin Krona, SVP, EMEA, Telit. “We are very pleased that our collaboration with Controlant’s R&D and product teams, employing Telit module technologies during a time of rapidly-changing cellular ecosystem and infrastructure, has been recognized by this award.”

The GLOMO Award was announced on March 2 during a virtual ceremony co-hosted by Sasha Twining and Justin Springham from Mobile World Live and streamed to audiences around the globe via LinkedIn. Telit and Controlant received the award for outstanding achievement in the category Best Innovation for COVID-19 Pandemic Response & Recovery.

“Congratulations to all of our 2022 GLOMO Award winners. The GLOMOs recognize the most innovative organizations in our ecosystem. The winners are changing how people, communities and businesses interact and evolve in a digital-first world,” said John Hoffman, CEO of GSMA Ltd. “This win affirms achievements of the highest merit, as judged by peers across the entire industry.”

The post Telit and Controlant Partner on Global COVID-19 Vaccine Distribution Program appeared first on IoT Business News.

• NExTPlus allows customers to have true global coverage with one single SIM
• Telit NExTPlus eUICC SIM allows IoT customers to switch between global roaming and local MNO profiles over the air in a secure manner

Telit, a global enabler of the Internet of Things (IoT), today announced NExTPlus, adding multi-profile to its multi-IMSI capabilities with eUICC.

The new offering allows IoT customers to switch between global roaming and local MNO profiles from a single SIM, overcoming permanent roaming restrictions remotely and securely.

The embedded Universal Integrated Circuit Card (eUICC) standard makes Telit’s NExTPlus versatile, as it allows remote provisioning of the SIM with different network profiles. eUICC allows connectivity providers to send their most optimized SIM profile to devices remotely, eliminating the need for physical access to the deployed device. The ability to use a single global SIM substantially enhances the capability to manage the cellular connectivity aspect of IoT deployments at scale.

Rapid advancements in technology and business models in global roaming and IoT connectivity ecosystems bring unknowns and uncertainties to the market. Changes resulting from this dynamic can cause disruptions in cost and availability of cellular IoT connectivity services. Telit NExTPlus’ future-proof, multi-IMSI, multi-profile capabilities can materially mitigate these changes and disruptions.

Telit NExTPlus delivers the true global coverage and the flexibility required to optimize coverage and costs across network technologies including LTE-M, NB-IoT, VoLTE and 5G. Telit customers deploying in the US can also download a native local profile to overcome roaming issues and optimize quality of service.

“Mobile networks around the world are announcing and implementing advancements as they cast away limitations from older generations of cellular service,” said Tomer Lavie, Head of Connectivity Business Unit, Telit. “Multi-IMSI and eUICC technologies are some of the foundational factors that support our bold plans, strengthening Telit’s position towards a true global SIM with no limits.”

“Telit’s future-proof solution ensures not only end-to-end compatibility between SIM, module and cellular network, but also the ability to remotely and securely change the attributes and features of the SIM and module using our Connectivity Management Platform across mobile networks as they exist now and in the future.”

The post Telit Launches NExTPlus, a Fully eUICC Compliant SIM appeared first on IoT Business News.

• New LTE Cat1 and Cat4 global SKUs with Telit value-added services complete the extensive Telit LE910C1 and LE910C4 module families, powered by the Qualcomm® 9207 LTE IoT modem
• Comprehensive bands support for seamless roaming across continents, now also includes the 900 MHz band for U.S. utilities deploying private LTE networks

Telit, a global enabler of the Internet of Things (IoT), today announced two additional modules based on the Qualcomm 9207 LTE IoT modem, the LE910C1-WWX and LE910C4-WWX, for its LTE IoT portfolio to enable single-SKU global deployments.

The new LTE Cat1 and Cat4 modules complete the extensive Telit LE910C1 and LE910C4 families and are the latest examples of Telit’s “design once, use anywhere” philosophy.

The new LE910C1-WWX (Cat1) and LE910C4-WWX (Cat 4) modules are ideal for a wide variety of both data and voice IoT applications and for global deployments, with comprehensive bands support, including 900 MHz band for U.S. utility private LTE networks. The two new global SKUs enable telematics and tracking applications, requiring mobility across various geographies, among others. The 3GPP Release 10 compliant modules are certified by two of the largest U.S. mobile operators, enabling device vendors to expand their IoT solutions quickly and confidently from other countries to the U.S. market.

Both new modules are members of Telit’s flagship xE910 family, whose “design once, use anywhere” philosophy enables developers to use the LE910C1-WWX or LE910C4-WWX as pin-to-pin compatible replacements for their existing devices based on the family’s modules for 2G, 3G and LTE. This design helps developers minimize development costs and lead time, and speed time-to-revenue by getting their new devices to the global market faster.

The LE910C1-WWX and LE910C4-WWX also support Voice over LTE (VoLTE), as well as 2G and 3G fallback for ubiquitous cellular coverage, on-board GNSS positioning capability, and:

• Telit IoT AppZone, which simplifies product design with advanced yet easy-to-use tools and APIs. AppZone also reduces bill-of-materials (BOM) costs and design complexity by embedding application code right in the module, eliminating the need for a microcontroller.

• Telit OneEdge, which simplifies the design, deployment and management of large-scale IoT implementations by providing a unified, dashboard-style view of hundreds or thousands of devices.

• Telit simWISE (roadmap feature), which embeds the SIM in the module to enable ultra-compact devices form factors and reduce manufacturing costs. simWISE also eliminates expensive truck rolls by enabling remote device provisioning.

“We are pleased to see Telit expand their offering of solutions based on the Qualcomm 9207 LTE IoT modem with the new LE910C1-WWX and LE910C4-WWX modules. The Qualcomm 9207 LTE IoT modem is purpose built and ideally suited for critical infrastructure applications with on-chip compute, communication and security capabilities. We are pleased to continue working with Telit to support IoT ecosystem members in adopting modern, reliable and secure IoT solutions, enabling faster time-to-commercialization and cost-effective options to proliferate next-generation IoT devices across industries,” said Vieri Vanghi, vice president, product management, Qualcomm Europe, Inc.

Marco Stracuzzi, head of product marketing, Telit, said:

“The new LE910C1-WWX and LE910C4-WWX modules combine Telit’s ‘design once, use anywhere’ philosophy with a single global SKU, so device vendors and solution providers can slash the cost and lead time of getting their IoT products to market virtually anywhere in the world.”

“And with Telit’s IoT AppZone, OneEdge and simWISE solutions, vendors and solution providers can further simplify the design, deployment and management of their LE910C1/C4-WWX-powered devices.”

The post Telit LTE IoT Modules Portfolio Adds Global SKUs appeared first on IoT Business News.

• Designed for rapid addition to embedded systems such as smart home devices, fitness trackers, medical wearables, telematics and industrial automation sensors
• Includes 4MB of internal flash, enterprise-grade security and support for a wide array of peripherals (SDIO, SPI, UART, ADC, PWM, GPIO, I2S, I2C, USB)

Telit, a global enabler of the Internet of Things (IoT), today announced the WE310G4 module, which enables device vendors to add dual-band Wi-Fi and Bluetooth Low Energy (BLE) 5.0 connectivity quickly and cost-effectively to their products.

Based on Realtek Ameba system on chip (SoC), the WE310G4 is ideal for a wide variety of embedded devices, including smart lighting, home appliances, medical wearables, smart city sensors, aftermarket telematics and industrial robots.

The Telit WE310G4 is ideal for vendors that have limited Wi-Fi or BLE expertise, as well as those with extensive RF experience that want to reduce time to market for new products. The module is IEEE 802.11 a/b/g/n and Bluetooth certified, and complies with all Wi-Fi Alliance and Bluetooth SIG-v5 requirements, eliminating the time and expense of testing and certification.

The WE310G4 provides device vendors with a low-cost, high-speed serial-to-Wi-Fi/BLE connection to an embedded design built on an 8/16/32-bit microcontroller. Furthermore, the module can be implemented as a host-less solution offering up to 456 Kb of SRAM dedicated to customer application development. With marketing samples available in February 2022, the module includes a comprehensive package of features and capabilities:

• Integrated, dual-core SoC, a high-performance application processor (running on ARM Cortex-M33) and a low-power MCU (ARM Cortex-M23) for Wi-Fi and BLE.
• Support for a wide range of peripherals: SDIO, SPI, UART, ADC, PWM, GPIO, I2S, I2C and USB.
• Low power consumption to maximize battery life.
• Industrial grade temperature range (-40 °C to +85 °C).
• Self-contained with full Wi-Fi, BLE and TCP/ IP networking stacks.
• A complete suite of advanced security features including Secured Boot, TrustZone for Cortex-M, WPA3 personal and enterprise security modes, as well as upper-layer security protocols such as TLS-1.3/SSL and HTTPS.
• Serial-to-Wi-Fi hosted implementation.
• Telit IoT AppZone IDE for host-less application development.
• Pin-to-pin compatible with the Telit WE310F5 (single-band module), enabling rapid migration of existing hardware and software to the WE310G4.
• Available with (WE310G4-I) and without (WE310G4-P) antenna.

“Ultra-low power consumption, small size, and high security are critical for modules integrating with the global IoT ecosystem,” said, Yee-Wei Huang, Realtek’s Vice President and Spokesman.

“While the IoT market offers a wide range of small modules, none compares to Telit’s WE310G4 when it comes to quickly and cost-effectively adding dual-band Wi-Fi and Bluetooth connectivity into their customer products.”

“Combined with Realtek Ameba SoC, the WE310G4 is the perfect solution for home, medical, and industrial IoT applications.”

“The new Telit WE310G4 module gives vendors a fast, easy way to add Wi-Fi or BLE to their products — even if they have little or no in-house RF expertise,” said Manish Watwani, Chief Marketing and Product Officer, Telit. “It’s ideal for vendors that want to develop wearables, IoT sensors and other products with enterprise-grade security, long battery life and other market-differentiating features, and then have them in customers’ hands before competitors do.”

Engineering samples of the WE310G4 will be available in Q2, with mass production scheduled to begin in Q3 2022.

The post Telit Launches WE310G4 Dual-Band Wi-Fi Module with BLE 5.0 appeared first on IoT Business News.

• New all-in-one cellular LTE and GNSS module provides superior throughput, latency, mobility and voice support
• Product covers all LATAM 4G and 2G Bands plus mainstream bands used in Europe and Asia, making it an ideal module for intercontinental deployments

Telit, a global enabler of the Internet of Things (IoT), today announced the LE910S1-ELG, a new LTE Cat 1 module designed for IoT applications in Latin America (LATAM) that need a combination of performance, affordability, voice support and 2G fallback in a compact form factor.

With an embedded GNSS receiver, the cost-optimized LE910S1-ELG is ideal for tracking applications such as fleet management, stolen vehicle tracking and recovery, as well as other mobile IoT applications that need to maintain a reliable connection when moving around in a country, region or multiple regions.

The LE910S1-ELG is the latest member of Telit’s flagship xE910 module family, whose unified form factor and electrical and programming interfaces spanning 2G, 3G and 4G products enables developers to implement a “design once, use anywhere” strategy. The module supports LTE Cat.1 with single-antenna reception, providing downlink speeds of up to 10 Mbps and uplink speeds up to 5 Mbps. Its streamlined configuration, compared to LTE Cat 1 devices with two antennas, helps significantly reduce cost and complexity.

Supporting 2G fallback, the LE910S1-ELG is perfect for applications that require full mobility throughout the LATAM regions, including areas that have not upgraded to 4G yet. It also supports both circuit-switched voice and VoLTE for those applications that require making phone calls, such as healthcare mobile personal emergency response systems (mPERS), connected elevators, alarm systems and more. The power-saving embedded GNSS receiver enables the use of GNSS positioning even when the cellular modem is switched off.

“The LE910S1-ELG is a great option for migrating customers that use legacy 2G and 3G modules in Latin America, especially where nationwide LTE-M and NB-IoT coverage does not yet exist,” said Marco Stracuzzi, head of product marketing, Telit.

“Our all-in-one cellular and GNSS module covers all LATAM 4G and 2G bands, as well as mainstream bands used in Europe and Asia, which makes it well-suited particularly for high-performance tracking across intercontinental deployments.”

The LE910S1-ELG is sampling now, and will be commercially available during the first quarter of 2022.

The post Telit’s LTE Cat 1 LE910S1-ELG Enables High-Performance IoT Applications in Latin America appeared first on IoT Business News.

Mobile friendly solution helps industrial companies and machine builders to completely digitize their production process with no-code dashboards.

Telit, a global enabler of the Internet of Things (IoT), today announced a new, mobile-friendly, addition to its industrial IoT platform suite.

Telit deviceWISE VIEW is a new IIoT-driven SCADA/ HMI system that allows engineers and shop floor staff to easily visualize, monitor, manage and analyze all factory machinery, external sensors and IT data from a central point. For more information, visit https://www.telit.com/m2m-iot-products/iot-platforms/telit-devicewise-for-factory-iiot-platform/devicewise-view/.

With Telit deviceWISE VIEW, enterprises can create custom dashboards and HMIs to display on-premises or in the cloud easily using drag-and-drop widgets. Visualizing factory data can enable smarter business decisions by seeing patterns and trends, more easily analyzing data, and interpreting the data received.

Telit deviceWISE VIEW is designed to work in conjunction with the award-winning Telit deviceWISE, which saves time and simplifies the solution development lifecycle with advanced edge and cloud software capabilities. The product comes with hundreds of industrial drivers for machine and sensors data collection, an edge logic engine for data transformation and monitoring, IT and Cloud connectors for IT/ OT integration, and a full SCADA/ HMI system for data visualization and alarming. Telit deviceWISE connects plant floor machines, enterprise systems and clouds without the need of custom code.

Using Telit deviceWISE and Telit deviceWISE VIEW in combination, shop floor managers can monitor machine productivity – in terms of parts processed per minute, process throughput analysis, quality and first pass yield, overall equipment effectiveness and other relevant KPIs for manufacturing management. The solution provides and presents vital data that enables preventive maintenance minimizing machine downtime and maximizing factory floor efficiency.

Ricardo Buranello, Head of Platforms Business Unit, Telit, said:

“Telit deviceWISE collects machine and sensor data with a selection of hundreds of industrial drivers. The data can be transformed and monitored on the edge without writing a single line of code and integrated with databases, IT systems or cloud.”

“Now, with Telit deviceWISE VIEW, we can display that information in an easy-to-understand format, creating dashboards, digital twins and HMIs using quick and visual rich drag and drop tool. It’s like a live PowerPoint for machine data.”

The post Telit deviceWISE® VIEW Brings New Combination of HMI and Scada System with Native Industrial IoT appeared first on IoT Business News.

• Telit’s first smart module powered by the Qualcomm® QCM2150 SoC for IoT
• Telit SE150A4 “system on module” natively supports integrated peripherals such as high-res touch displays, advanced cameras, sensors, audio interfaces and more

Telit, a global enabler of the Internet of Things (IoT), today launched the SE150A4 “system on module” series for retail and POS devices, home automation and security, law enforcement and other applications that need high data rates, advanced human-machine interfaces and edge computing functionality.

Featuring Android OS and the Qualcomm QCM2150 solution, the new SE150A4 module marks another new product line introduction to better serve IoT device makers and customers.

With LTE Category 4 for maximum data rates of up to 150 Mbps downlink and 50 Mbps uplink, the SE150A4 series is ideal for bandwidth-intensive applications such as live, high-definition (1080p/30 fps) video from law enforcement cameras, home security systems and robots. Wi-Fi (802.11a/b/g/n) and Bluetooth Low Energy (BLE) 4.2 provide additional connection flexibility, along with an embedded multi-constellation GNSS (GPS, BeiDou, GLONASS and Galileo) receiver for high-performance positioning and navigation.

The SE150A4 series provides native support for integrated peripherals such as high-resolution touch displays, advanced cameras, sensors and audio interfaces, as well as SDIO 3.0, USB 2.0, UART, SPI and I2C digital interfaces. Android OS gives device OEMs, systems designers and other users access to a vast developer community and broad, deep selection of tools and ready-to-use software components.

Telit’s precision engineering ensures that the modules’ diverse set of hardware, software and other components are tightly integrated, which streamlines product development for device OEMs, systems designers and other users. All transceivers are expertly tuned to mitigate complexity in antenna pairing and integration, ensuring mission-critical-grade performance from all radios even when cellular is operating at peak transmit (Tx) power mode. Telit’s security-by-design approach mitigates vulnerabilities with hardware-enabled features such as secure boot and trusted execution environment.

The modules are available in two versions. The SE150A4-NA for North America supports 13 LTE bands, including Band 14 for AT&T FirstNet Band and Bands 66 and 71 for T-Mobile, as well as 3G fallback. The SE150A4-EU for Europe and the rest of the world supports Band 28 and nine additional LTE bands, as well as 2G/3G fallback.

At just 40.5 x 40.5 mm, the LCC +LGA form factor allows easy integration in portable, wearable and handheld devices, including mobile point-of-sale terminals, medical monitors, industrial PDAs and telematics cameras. The modules are also ideal for fixed applications such as smart home gateways and alarm systems.

“Our cutting-edge IoT solutions and global ecosystem members are revolutionizing next-generation devices across industries,” said Vieri Vanghi, vice president, product management, QUALCOMM Europe, Inc. “We are pleased to see Telit adopting the robust Qualcomm QCM2150 solution for their new SE150A4 series. This new module will help support applications and use cases beyond traditional embedded modules with support from our breakthrough connectivity and power-efficiency capabilities.”

“As the foundation for the device it integrates, a smart module must provide best-in-class hardware, software and other key components, all carefully and tightly integrated to ensure optimal performance, reliability and security,” said Martino Turcato, head of software product management, Telit.

“Telit’s new SE150A4 series sets the standard for what a smart module should be, leveraging our long history with Qualcomm Technologies and our commitment to providing solutions that help device OEMs and systems designers get their innovative new products to market fast.”

The post Telit Announces New Product Line with SE150A4 Smart Module for Android™ OS IoT Devices appeared first on IoT Business News.

With more than thirty modules certified, customers have an extensive portfolio ranging from low power wide area NB-IoT and LTE-M all the way up to broadband 5G.

Telit, a global enabler of the Internet of Things (IoT), today announced that Deutsche Telekom AG has certified its FN980 Sub-6 5G module for use on the operator’s 5G networks across Europe.

Designed for global use, the FN980 is ideal for high-performance and bandwidth-intensive enterprise and industrial applications including fixed wireless access, enterprise routers and gateways, indoor and outdoor CPE, and professional broadcasting and surveillance.

The award-winning FN980 5G series has received global certification providing OEMs, system integrators and end users with verification that their FN980-based devices will perform as expected on all major mobile operator networks worldwide. In addition, the industrial-grade M.2 form factor provides an easy 5G migration path for end-products already in the M.2 market with 3G and 4G solutions.

European organizations also have an extensive range of certified NB-IoT and LTE-M modules in Telit’s best-selling xE310, xE910 and xL865 families. The ME310, ME910 and ML865 have variants for regional European and global IoT applications such as smart metering, security/surveillance, point of sale, health monitoring, fleet management, asset tracking and wearable trackers, fitness and wellness devices.

“We work closely in partnership with Telit to secure interoperability and reduce time-to-market for our customers up-front,” said Uday Patil, Head of Devices, Deutsche Telekom IoT.

“By certifying Telit’s innovative FN980 data card, we enable a growing number of customers to deploy the next generation of powerful IoT solutions on our 5G and 4G networks.”

“With these certifications, Telit offers the market one of the widest selections of multi-mode modules approved for use on Deutsche Telekom’s network,” said Marco Contento, VP of 5G Technologies, Telit. “This highlights our longstanding partnership with Deutsche Telekom and commitment to provide IoT integrators and our customers the products they need for their IoT deployments.”

The post Telit Receives Deutsche Telekom 5G Certification appeared first on IoT Business News.

Businesses and original equipment manufacturers (OEMs) are now able to leverage the FN980 for high-performance, bandwidth-intensive applications on T-Mobile’s 5G network.

Telit, a global enabler of the Internet of Things (IoT), today announced that T-Mobile certified its FN980 5G module for use on their 5G nationwide network.

The FN980 module series empowers businesses to leverage 5G and Gigabit LTE to future proof IoT, enterprise applications and video, and this certification enables companies to take advantage of T-Mobile’s 5G network on the sub-6 GHz spectrum.

The FN980 is based on the new 3GPP Rel. 15 standard and supports both NSA and SA 5G deployment scenarios. Powered by the second-generation Qualcomm® Snapdragon X55 5G Modem-RF System, the Telit module features the M.2 form factor and is ideally suited for high-performance and bandwidth-intensive industrial applications, such as fixed wireless access, enterprise routers and gateways, customer-premises equipment, video streaming and more.

“Qualcomm Technologies is pleased to collaborate with innovators such as Telit to fulfil our mission of bringing mature 5G connectivity to manufacturing, entertainment, healthcare, education and more,” said Gautam Sheoran, senior director, product management, Qualcomm Technologies, Inc. “Whether it’s gaming, conducting calls or doing work, the Snapdragon X55 5G Modem-RF System is designed for global 5G rollouts and supports all major spectrum bands which enables T-Mobile to drive their 5G efforts forward by proliferating ultra-fast speeds and seamless connectivity to more consumers worldwide.”

“Telit is always looking for new and exciting ways to help our partners and their users leverage the latest technology to its fullest, and we’re proud to have reached another milestone for our award-winning FN980 5G series,” said Marco Contento, vice president of 5G technologies, Telit.

“This certification not only advances our mission to provide OEMs, system integrators and end-users the best-in-class portfolio of solutions for leveraging T-Mobile’s 5G network, but it also demonstrates our commitment to help OEMs bring their 5G-powered devices and applications to market quickly while affording them a competitive advantage.”

The FN980 series has received global certification, providing OEMs, system integrators and end users with additional, independent verification that their FN980-based devices will perform as expected on all major mobile operator networks worldwide.

The post Telit FN980 Certified for Use on T-Mobile’s 5G Network appeared first on IoT Business News.